JPS60245112A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and more particularly to so-called leadless electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Structure of a conventional example and its problems A conventional so-called leadless electronic component of this type, such as a chip-type aluminum electrolytic capacitor, is shown in FIG. 1a.

It is configured as shown in b. That is, an anode foil made by roughening aluminum foil and forming a dielectric oxide film by anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. constitute a capacitor element 1, and house this capacitor element 1 in a bottomed cylindrical metal case 2,
An aluminum electrolytic capacitor is constructed by sealing the open end with a side port material 3 having elasticity such as rubber, and a lead wire 4 drawn out from the aluminum electrolytic capacitor is welded to a comb-shaped terminal 5. More electrical.

After mechanical connection, a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminal 5, resulting in a completed product.

These chip-type aluminum electrolytic capacitors have Hirata heat resistance when mounted on printed circuit boards.
As mentioned above, the molded resin exterior 6 is applied, but generally the molded resin exterior is pressurized at a temperature of 100°C to 150°C for about 6 minutes at a pressure of 10 to 100°C, and under such harsh conditions, , the driving electrolyte of the electrolytic capacitor evaporates, resulting in characteristic deterioration such as a decrease in capacitance and an increase in tan δ, and since the capacitor is coated with a molded resin exterior 6, it becomes extremely expensive. had. Furthermore, since it is a horizontal type, when it is mounted on a printed circuit board, it occupies a large area of the printed circuit board, which is a factor that hinders miniaturization of various devices.

OBJECTS OF THE INVENTION The present invention eliminates these conventional drawbacks, and aims to provide an inexpensive, vertical type IJ-dress electronic component without deterioration of characteristics.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component main body which is constructed by housing a component element in a case and has lead wires connected to the component element drawn out from the same end surface, and a main body of the electronic component. an insulating plate made of a heat-resistant thermoplastic resin and provided with a through hole through which the lead wire passes through and is disposed so as to come into contact with the end surface of the lead wire of the main body, and the outer surface of the insulating plate has the There are four parts connected to the through hole, and the tip of the lead wire passing through the through hole is bent so as to fit into the recess.6. Furthermore, the heat-resistant thermoplastic resin is composed of polyethylene terephthalate, polybutylene terephthalate, or nylon, and the resin component is 60 to 80% by weight,
The insulating plate is constructed by adding 40 to 20% by weight of an inorganic component.

With this configuration, when electronic components are mounted on a printed circuit board, the tips of the lead wires are housed in the recesses provided in the insulating board, so that there is no convex part on the surface of the insulating board that comes into contact with the printed circuit board. Since the lead wire is in a so-called tangential position with the insulating plate, there is no tilting or wobbling of the electronic components, and since the insulating plate is made of heat-resistant resin and is stable, the mounting work is extremely smooth and easy. This makes it possible to increase the speed. Since heat-resistant thermoplastic resin is used as the insulating plate, injection molding is easy and the cost of the insulating plate can be reduced.
Since only 0% by weight is added, the heat resistance of the insulating plate is significantly improved.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 4 regarding an aluminum electrolytic capacitor. In addition, in the figure, the same parts as in FIG. 1 are given the same numbers.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. , and is constructed by impregnating the wound material with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Lead wires 4 are still connected to the anode foil and cathode foil of the capacitor element 1.
is connected.

Then, the open end of the metal case 2 is sealed by attaching a sealing member 7 having a two-layer structure of an elastic body 7a and an inelastic body γb, and performing a drawing process. The main body of the part is configured.

Further, the lead wire 4 connected to the capacitor element 1 is
It penetrates the sealing member 7 and is drawn out from the same end surface.

Reference numeral 8 denotes an insulating plate made of polyethylene terephthalate, which was disposed so as to be in contact with the end surface from which the lead wire 4 of the electronic component body was drawn out, and 30% by weight of an inorganic substance was added thereto. This insulating plate 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, the outer surface of this insulating plate 8 is provided with four portions 8b that connect to the through holes 8d, and the tip portions 4a of the lead wires 4 that have passed through the through holes 8a are bent so as to fit within the four portions 8b. ing. Solder mounting was attempted by heating the chip-type aluminum electrolytic capacitor thus constructed on a hot plate at 260° C. for 1 minute. When mounted under the conditions described above, a chip-type aluminum electrolytic capacitor with improved heat resistance was obtained without deterioration of characteristics.

Regarding thermoplastic resins, in addition to polyethylene terephthalate, polybutylene terephthalate and nylon had similar effects. Further, 20% by weight of the inorganic material added to improve heat resistance is required, and if the amount of inorganic material exceeds 40% by weight, the mold will be seriously damaged and is not practical.

In this case, even if the round bar IJ-wire 4 has its tip 4a flattened and bent, as shown in Fig. 4a and b, the state of the saw 1' wire 11 of the round bar is It may be.

Effects of the Invention As described above, according to the electronic component of the present invention, an insulating plate having recesses is used, and lead wires are housed in the four parts.
There is no tilting or wobbling when mounting on a printed circuit board, and since the insulating board is made of heat-resistant resin and is stable, the mounting process can be done extremely well and at high speed. Moreover, since no mold resin exterior is used, it is possible to produce electronic components at low cost without deterioration of characteristics.

[Brief explanation of the drawing]

FIGS. 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a leadless aluminum electrolytic capacitor according to an embodiment of the present invention, and FIG. Partially sectioned front view showing one embodiment, No. 4
Figures a and b are perspective views showing the shape of a lead according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Metal case, 4... Lead wire, 7... Sealing member, 7a... Elastic body, 7b ...Inelastic body, 8
...Insulating plate, 8a...Through hole, 8b...
・・・Concavity. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (C Snol (b)) Figure 2 14α 1 JP-A-Sho GO-245112 (4) Figure 3 Figure 4 (cb (b) 111) 4 desk

Claims (1)

[Scope of Claims] (1) An electronic component body constructed by housing a component element in a case and having lead wires connected to the component element drawn out from the same end surface, and a lead wire of the electronic component body. an insulating plate made of a heat-resistant thermoplastic resin and having a through hole through which the lead wire passes through and is arranged so as to come into contact with the end surface of the lead wire, and an insulating plate made of a heat-resistant thermoplastic resin is provided on the outer surface of the insulating plate so as to be in contact with the through hole. An electronic component characterized in that a connecting recess is provided, and the tip of a lead wire passing through the through hole is bent so as to fit within the recess. (2) The thermoplastic resin that makes up the insulation board is polyethylene terephthalate or polybutylene terephthalate. The electronic component according to claim 1, which is made of any one of nylon. (3) Claim 1 in which the insulating plate contains a resin component of 60 to 80% by weight and an inorganic component of 40 to 20% by weight.
Electronic components listed in section. (4) The electronic component according to claim 1, wherein the tip of the lead wire housed in the four parts is plate-shaped. (6) The electronic component according to claim 1, wherein the electronic component main body has a sealing member made of a rubber-like elastic body and a non-rubber-like elastic body.