JPS60245116A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components, and more specifically, to so-called face bonding type electronic components. In the following description, an aluminum electrolytic capacitor will be explained in detail, but the present invention is not limited to aluminum electrolytic capacitors, and the same applies to other electronic components.

Conventional structure and its problems Conventional so-called face bonding type electronic components, such as chip-type aluminum electrolytic capacitors, are
It was constructed as shown in Figures a and b. That is, an anode foil made by roughening aluminum foil and forming a dielectric oxide film by anodization, and a cathode foil made by roughening aluminum foil are wound through a separator and impregnated with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom, and the open end is sealed using an elastic sealing material 3 such as rubber to form an aluminum electrolytic capacitor. , and weld the lead wire 4 drawn out from the aluminum electrolytic capacitor to the comb-shaped terminal 6. The electrical and mechanical connections were made by which method, and a molded resin sheath 6 was applied to the entire body except for the comb-shaped terminals 6 to produce a completed product.

Such chip-type aluminum electrolytic capacitors are soldered heat resistant when mounted on printed circuit boards.
As mentioned above, the molded resin exterior 6 is applied, but generally molded resin exteriors are pressurized at a temperature of 100°C to 150"C for about 6 minutes at a pressure of 10 exposure/cni, and such severe Under these conditions, the driving electrolyte of the electrolytic capacitor evaporates, causing characteristic deterioration such as a decrease in capacitance and an increase in tan δ.Furthermore, because the capacitor is covered with a molded resin exterior6, it becomes extremely expensive. It had some problems.

OBJECTS OF THE INVENTION The present invention eliminates such conventional drawbacks, and aims to provide an inexpensive face bonding type electronic component that does not suffer from characteristic deterioration.

Structure of the Invention In order to achieve this object, the present invention provides an electronic component main body which is constructed by housing a component element in a case, and in which a lead wire connected to the component element is drawn out from the same end surface, and a main body of the electronic component. a bottomed resin case that is arranged such that its bottom abuts the end surface from which the lead wires are drawn out of the component body, and that has a through hole through which the lead wires pass, and the bottom and side portions of the bottomed resin case. Four parts connected to the through hole are provided on the outer surface of the lead wire, and the tip of the lead wire passing through the through hole is bent so as to fit within the recess.

With this configuration, when mounting an electronic component on a printed circuit board, the tip of the lead wire is housed in the recess provided in the bottomed resin case, so there is a convex portion on the surface of the bottomed resin case that contacts the printed circuit board. In other words, since the lead wire is in a so-called flat position with the bottomed resin case, there is no tilting or wobbling of the electronic components, and the electronic components are stable, making the mounting work extremely easy and fast. It becomes possible to

5 ζ 7 Description of the Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings of FIG. 2 and FIGS. 3 a and 3 b for an aluminum electrolytic capacitor.

In addition, in the figure, the same numbers are used for the same parts as in FIG. 1.

In the figure, 1 is a capacitor element similar to the conventional one,
An anode foil made by electrochemically roughening high-purity aluminum foil and then anodizing it to form a dielectric oxide film, and a roughened cathode aluminum foil are wound with insulating paper interposed between them. 1, and the wound material is impregnated with a driving electrolyte. This capacitor element 1 is housed in a cylindrical metal case 2 with a bottom. Further, lead wires 4 are connected to the anode foil and the cathode foil of the capacitor element 1.
is connected.

The open end of the metal case 2 is sealed by attaching a sealing member 3 made of an elastic material and performing a drawing process, thereby forming an electronic component body.

Further, a lead wire 6/411-i connected to the capacitor element 1 passes through the sealing member 3 and is drawn out from the same end surface.

8 is a resin case with a bottom that can store the electronic parts body;
This bottomed resin case 8 is provided with a through hole 8a through which the lead wire 4 passes.

Further, on the outer surface of the bottomed resin case 8, a recess 8b connected to the through hole 8a is provided continuously on the bottom outer surface and the side outer surface, and a lead wire 411-j passing through the through hole 8d is provided. : It is bent so as to fit within the recess 8b.

In this case, as shown in Fig. 4a and b, the round bar lead wire 4
The lead wire may be flattened and bent, or it may be a round bar lead wire.

Effects of the Invention As described above, the electronic component of the present invention uses a resin case with a bottom and has four parts, and the lead wires are housed in the four parts, so there is no tilting or wobbling when mounting it on a printed circuit board. The mounting work can be done extremely well and at high speed. Moreover, since there is no molded resin exterior,
The effect is that electronic components can be manufactured at low cost without deterioration of characteristics.

[Brief explanation of the drawing]

FIGS. 1a and 1b are cross-sectional views and side views showing a conventional chip-type aluminum electrolytic capacitor, FIG. 2 is a perspective view showing a face bonding type aluminum electrolytic capacitor according to an embodiment of the present invention, and FIGS. FIG. 4b is a bottom view and a sectional view taken along the line A-A' showing an embodiment of the present invention, and FIG. 4a is a perspective view showing a lead shape according to an embodiment of the present invention. 1-- Capacitor element, 2- Metal case, 3-
... Sealing member, 4. Lead wire, 8-. Bottomed resin case, 8a. Through hole, 8b. Recess. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (α) (b) Figure 2 Figure 4 (a-) 4 out ('b) 4a.

Claims (2)

[Claims] (1) An electronic component body constructed by housing a component element in a case and having lead wires connected to the component element drawn out from the same end surface, and a bottom portion on the end surface from which the lead wires of the electronic component body are drawn out. and a bottomed resin case provided with a through hole through which the lead wire passes through, the bottomed resin case having four parts connected to the through hole provided on the outer surface of the bottomed resin case; An electronic component characterized in that a tip of a lead wire passing through the hole is bent so as to fit within the recess. (2) The electronic component according to claim 1, wherein the recess is formed on the bottom outer surface and the side outer surface of the bottomed resin case, and the bottom recess and the side recess are connected.