JPH01289239A - Linked body of chip-type capacitors - Google Patents
Linked body of chip-type capacitorsInfo
- Publication number
- JPH01289239A JPH01289239A JP63120028A JP12002888A JPH01289239A JP H01289239 A JPH01289239 A JP H01289239A JP 63120028 A JP63120028 A JP 63120028A JP 12002888 A JP12002888 A JP 12002888A JP H01289239 A JPH01289239 A JP H01289239A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- capacitors
- capacitor
- exterior
- exterior frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 73
- 238000003860 storage Methods 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Packaging Frangible Articles (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、コンデンサの改良にかかり、特に、基板へ
の表面実装に適したチップ形コンデンサの連続体に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in capacitors, and more particularly to a series of chip-type capacitors suitable for surface mounting on a substrate.
従来、コンデンサのチップ化を実現するには、コンデン
サ素子に樹脂モールド加工を施し、樹脂端面から導出し
た外部接続用のリード線を樹脂側面に沿って折り曲げ、
プリント基板の配線パターンに臨ませていた。Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the end of the resin was bent along the side of the resin.
It was facing the wiring pattern of the printed circuit board.
あるいは、例えば実公昭５９−３５５７号公報に記載さ
れた考案のように、従来のコンデンサを外装枠に収納し
、リード線を外装枠の端面とほぼ同一平面上に配置した
ものが提案されている。また、特開昭６０−２４５１１
６号公報および特開昭６０−２４５１１５号公報に記載
された発明のように、有底筒状の外装枠にコンデンサを
配置して、外装枠底面の貫通孔からリード線を導出し、
このリード線を外装枠の外表面に設けた凹部に収めるよ
うに折り曲げたものが提案されている。Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, it has been proposed that a conventional capacitor is housed in an exterior frame, and the lead wires are arranged on approximately the same plane as the end face of the exterior frame. . Also, JP-A-60-24511
As in the inventions described in Japanese Patent Publication No. 60-245115, a capacitor is arranged in a cylindrical outer frame with a bottom, and a lead wire is led out from a through hole at the bottom of the outer frame.
It has been proposed that this lead wire is bent so as to fit into a recess provided on the outer surface of the exterior frame.
しかしながら、モールド加工を施すチップ形コンデンサ
では、モールド加工時の熱的ストレスによりコンデンサ
素子が熱劣化するおそれがあるとともに、その製造工程
も煩雑であった・また・耐熱性の合成樹脂等からなる外
装枠にコンデンサを収納する場合には、成形型により形
成された個々の外装枠にコンデンサを収納するため、外
装枠をパーツフィーダ等で整列させる必要があった。そ
して、コンデンサ本体の逆装着等の不都合を防止するた
め、コンデンサを外装枠に収納する際に、コンデンサの
リード線の方向とともに、外装枠の方向にも留意する必
要があった。殊に微細な外装枠およびコンデンサでは、
そのリード線の取り扱い、並びに折り曲げ加工がますま
す困難となる。However, with molded chip capacitors, there is a risk of thermal deterioration of the capacitor element due to thermal stress during molding, and the manufacturing process is complicated.Also, the exterior is made of heat-resistant synthetic resin, etc. When housing capacitors in frames, the capacitors are housed in individual exterior frames formed by molds, so it is necessary to align the exterior frames using a parts feeder or the like. In order to prevent problems such as reverse mounting of the capacitor body, when storing the capacitor in the outer frame, it is necessary to pay attention to the direction of the lead wire of the capacitor as well as the direction of the outer frame. Especially for fine outer frames and capacitors,
Handling and bending the lead wire becomes increasingly difficult.
また、通常のチップ形の電子部品は、塩化ビニール等か
らなるテーピング部材に収納されて実装工程に供給され
る。しかし、このテーピングでは、テーピング用の部材
およびテーピング部材にチップ形の電子部品等を収納す
る工程等が別途に必要となってしまう。Further, a typical chip-shaped electronic component is housed in a taping member made of vinyl chloride or the like and supplied to the mounting process. However, this taping requires an additional process of accommodating a taping member and a chip-shaped electronic component in the taping member.
この発明は、チップ形コンデンサの加工精度を向上させ
るとともに、その供給を効率的に行うことを目的として
いる。The object of the present invention is to improve the processing accuracy of chip-type capacitors and to efficiently supply them.
この発明は、コンデンサの外観形状に適合した収納空間
を有する外装枠にコンデンサを収納したチップ形コンデ
ンサが、外装枠と一体に成形された基体上に一定の間隔
で連係されたことを特徴としている。This invention is characterized in that a chip-type capacitor, in which a capacitor is housed in an exterior frame having a storage space that matches the external shape of the capacitor, is linked at regular intervals on a base body that is integrally formed with the exterior frame. .
更に具体的な手段としては、外装枠および基体が、一体
に成形された弾性ゴムもしくは耐熱性の合成樹脂からな
ることを特徴としている。More specifically, the exterior frame and the base are integrally formed of elastic rubber or heat-resistant synthetic resin.
図面に示したように、単体の外装枠２は、基体８上で等
間隔に連係され、外装枠２の集合体７を形成している。As shown in the drawing, the single exterior frames 2 are linked at regular intervals on the base 8 to form an assembly 7 of exterior frames 2.
この集合体７にコンデンサ１を順次収納して、チップ形
コンデンサの連続体９を得る。外装枠２の集合体７は、
外装枠２の成形工程で一体に形成することが可能であり
、したがって、その形成が容易であるとともに、集合体
７として供給される外装枠２の方向を全て統一させるこ
とができる。そのため、コンデンサ１を外装枠２の収納
空間４に収納する工程では、従来のように外装枠２の方
向を整理、調整する必要がなくなる。Capacitors 1 are sequentially housed in this aggregate 7 to obtain a continuous body 9 of chip-type capacitors. The assembly 7 of the exterior frame 2 is
It is possible to integrally form the outer frame 2 in the process of forming the outer frame 2. Therefore, it is easy to form the outer frame 2, and the directions of the outer frames 2 supplied as the assembly 7 can all be unified. Therefore, in the step of storing the capacitor 1 in the storage space 4 of the exterior frame 2, there is no need to rearrange or adjust the direction of the exterior frame 2 as in the conventional case.
また、コンデンサ１を収納した外装枠２は、この外装枠
２と一体に成形された基体８によって連結されて、チッ
プ形コンデンサの連続体９を形成しているため、複数の
チップ形コンデンサを一定の間隔で実装工程に供給する
ことができる。そのため、従来のように別途にテーピン
グする必要がない。In addition, the exterior frame 2 housing the capacitor 1 is connected by a base 8 integrally formed with the exterior frame 2 to form a continuous body 9 of chip-type capacitors, so that a plurality of chip-type capacitors can be stored in a uniform manner. It can be supplied to the mounting process at intervals of . Therefore, there is no need for separate taping as in the past.
次いでこの発明の実施例を図面にしたがい説明する。第
１図は、この発明の実施例によるチップ形コンデンサの
連続体を示す斜視図、第２図は実施例で使用する外装枠
の集合体を示す斜視図、第３図は、この発明の別の実施
例で使用する外装枠の集合体を示す斜視図である。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a continuum of chip capacitors according to an embodiment of the present invention, FIG. 2 is a perspective view showing an assembly of exterior frames used in the embodiment, and FIG. FIG. 2 is a perspective view showing an assembly of exterior frames used in the embodiment.
外装枠２の集合体７は、弾性ゴムからなり、第２図に示
したように、帯状の基体８上に単体の外装枠２が一定の
間隔で形成されている。そして、単体の外装枠２は、内
部にコンデンサ１の外観形状に適合した収納空間４を有
するとともに、一方の開口端面にはこの開口端面の一部
を覆う壁部５が形成されている。この壁部５は、外装枠
２の収納空間４に収納されるコンデンサ１の端面と当接
して、コンデンサ１を収納空間４に係止することになる
。また、外装枠２の側面の一部（基体としての外装枠２
の底面となる側面）には、コンデンサｌのリード線３が
収納される溝部６が形成されている。The assembly 7 of the exterior frames 2 is made of elastic rubber, and as shown in FIG. 2, the single exterior frames 2 are formed on a strip-shaped base 8 at regular intervals. The single exterior frame 2 has an internal storage space 4 that matches the external shape of the capacitor 1, and has a wall 5 formed on one open end surface to cover a part of this open end surface. This wall portion 5 comes into contact with the end face of the capacitor 1 housed in the storage space 4 of the exterior frame 2, thereby locking the capacitor 1 in the storage space 4. In addition, part of the side surface of the exterior frame 2 (exterior frame 2 as a base)
A groove 6 in which the lead wire 3 of the capacitor 1 is accommodated is formed in the bottom side (side surface) of the capacitor 1.
コンデンサ１は、図示しない電極箔と電解紙とを巻回し
て形成したコンデンサ素子を、アルミニウム等からなる
有底筒状の外装ケースに収納し、外装ケース開口端を封
口体で密封するとともに、コンデンサ素子から導いたリ
ード線３を前記封口体に貫通させて外部に引き出してい
る。The capacitor 1 includes a capacitor element formed by winding electrode foil and electrolytic paper (not shown), which is housed in a bottomed cylindrical outer case made of aluminum or the like, and the open end of the outer case is sealed with a sealing member. A lead wire 3 led from the element is passed through the sealing body and drawn out to the outside.
外装枠２の集合体７は一体となって移送され、コンデン
サｌが各々の外装枠２の収納空間４に収納される。この
とき、外装枠２の向きは全て統一されているため、この
外装枠２に収納するコンデンサ１の向き、すなわちリー
ド線３の極性を調整して収納するのみでコンデンサ１の
逆装着は防止できる。The assembly 7 of the outer frames 2 is transported as one, and the capacitor I is stored in the storage space 4 of each outer frame 2. At this time, since the orientation of the exterior frame 2 is all unified, reverse installation of the capacitor 1 can be prevented by simply adjusting the orientation of the capacitor 1 housed in the exterior frame 2, that is, adjusting the polarity of the lead wire 3. .
コンデンサ１を収納した外装枠２の一方の開口端面、す
なわち壁部５が形成された端面からは、コンデンサ１の
リード線３が突出する。この突出したリード線３は、外
装枠２の開口端面および底面に沿って折り曲げられ、外
装枠２の溝部６に収納される。Lead wires 3 of the capacitor 1 protrude from one open end surface of the exterior frame 2 housing the capacitor 1, that is, the end surface on which the wall portion 5 is formed. This protruding lead wire 3 is bent along the open end surface and bottom surface of the exterior frame 2 and is housed in the groove 6 of the exterior frame 2.
このように各外装枠２にコンデンサ１が収納されたチッ
プ形コンデンサの連続体９は、基体８によって連係され
、実装工程へと供給されることになる。In this way, the continuous body 9 of chip-type capacitors in which the capacitors 1 are housed in each of the outer frames 2 is linked by the base body 8 and is supplied to the mounting process.
また、外装枠２の集合体７は、弾性ゴムから形成されて
いるため、集合体７をリール等により大量にかつ連続的
に供給することもできる。Further, since the assembly 7 of the exterior frame 2 is made of elastic rubber, the assembly 7 can be continuously supplied in large quantities by a reel or the like.
なお、外装枠２の収納空間４は、この実施例では外観形
状が円筒状のコンデンサ１を用いているため、コンデン
サ１の外観形状に適合する形状、すなわちコンデンサ１
の外径寸法とほぼ同じ内径寸法の円筒状に形成されてい
る。非円筒状のコンデンサ、例えば断面形状が楕円状に
形成されたコンデンサを用いる場合は、その形状に適合
した楕円筒状の収納空間を有する外装枠を用いることに
なる。In addition, since this embodiment uses a capacitor 1 having a cylindrical external shape, the storage space 4 of the exterior frame 2 has a shape that matches the external shape of the capacitor 1, that is, the capacitor 1.
It is formed into a cylindrical shape with an inner diameter that is approximately the same as the outer diameter. When using a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape, an exterior frame having an elliptical cylindrical storage space suitable for the shape is used.
次いで、第３図に示したこの発明の別の実施例として、
外装枠２の集合体１０を耐熱性の合成樹脂、例えば、耐
熱性に優れたエポキシ、フェノール、ポリイミド等を金
型等を介して一体に成形したものを使用した。この実施
例による外装枠２の集合体１０は、第３図に示すように
、シート状の基体１１上に外装枠２を縦横方向に所望の
数量、連係させている。Next, as another embodiment of this invention shown in FIG.
The assembly 10 of the exterior frame 2 is made of a heat-resistant synthetic resin, such as epoxy, phenol, polyimide, etc., which have excellent heat resistance, and is integrally molded using a mold or the like. As shown in FIG. 3, the assembly 10 of the exterior frames 2 according to this embodiment has a desired number of exterior frames 2 interconnected in the vertical and horizontal directions on a sheet-like base 11.
このシート状の集合体１０を一体に移送して第１の実施
例と同様、各外装枠２の収納空間４にコンデンサ１を収
納して、チップ形コンデンサの連続体を得る。そして、
このシート状のチップ形コンデンサの連続体を一体に供
給して、プリント基板に実装する。This sheet-like assembly 10 is transferred as one, and capacitors 1 are stored in the storage spaces 4 of each exterior frame 2, as in the first embodiment, to obtain a continuous body of chip-shaped capacitors. and,
This continuous body of sheet-like chip capacitors is supplied in one piece and mounted on a printed circuit board.
この実施例による場合、外装枠２の集合体１０は、いわ
ゆるシート状に成形されるため、第１の実施例と比較し
て、より大量にチップ形コンデンサを実現できる。In this embodiment, since the assembly 10 of the outer frame 2 is formed into a so-called sheet shape, chip capacitors can be produced in a larger quantity than in the first embodiment.
以上のようにこの発明は、コンデンサの外観形状に適合
した収納空間を有する外装枠にコンデンサを収納したチ
ップ形コンデンサが、外装枠と一体に成形された基体上
に一定の間隔で連係されたことを特徴としているので、
複数のチップ形コンデンサを、連続状に供給することが
でき、効率的な実装ができる。そしてこの供給では従来
のように、いわゆるテーピングする必要がない。As described above, the present invention provides a chip-type capacitor in which a capacitor is housed in an exterior frame having a storage space that matches the external shape of the capacitor, and is linked at regular intervals on a base body that is integrally formed with the exterior frame. Because it is characterized by
A plurality of chip capacitors can be continuously supplied, allowing efficient mounting. And, in this supply, there is no need for so-called taping as in the past.
また、各コンデンサ本体は、外装枠の方向が統一された
状態で収納空間に収納される。したがって、この収納工
程においてコンデンサ本体の向きのみを調整することに
より、チップ形コンデンサの連続体の各外装枠内でのコ
ンデンサ本体の向きは統一されることになる。したがっ
て、各単体のチップ形コンデンサをプリント基板に実装
する際にも、逆装着は容易に防止でき、別途にパーツフ
ィーダ等により向きを調節する必要もない。Moreover, each capacitor main body is stored in the storage space with the direction of the outer frame being unified. Therefore, by adjusting only the orientation of the capacitor body in this storage process, the orientation of the capacitor body within each exterior frame of the continuous chip-type capacitor is unified. Therefore, even when mounting individual chip capacitors on a printed circuit board, reverse mounting can be easily prevented, and there is no need to separately adjust the orientation using a parts feeder or the like.
また、リード線を外装枠の所定の位置に配置することが
容易となる。そのため、コンデンサを外装枠に収納した
後、リード線に折り曲げ加工を施した場合、リード線の
先端部分を外装枠の溝部に適正に収納することができる
。Moreover, it becomes easy to arrange the lead wire at a predetermined position on the exterior frame. Therefore, when the lead wire is bent after the capacitor is housed in the outer frame, the tip portion of the lead wire can be properly housed in the groove of the outer frame.
また、具体的な手段としては、外装枠および基体が、一
体に成形された弾性ゴムもしくは耐熱性の合成樹脂から
なることを特徴としているので、特に、弾性ゴムからな
る外装枠を供給する場合は、リール等により連続的に外
装枠を供給することが可能になり、効率的な製造をする
ことができる。In addition, as a specific means, since the exterior frame and the base are made of integrally molded elastic rubber or heat-resistant synthetic resin, in particular, when supplying the exterior frame made of elastic rubber, It is now possible to continuously supply the exterior frame using a reel or the like, allowing for efficient manufacturing.
また、シート状に供給する場合は、所望の個数毎に一体
として実装することができる。Furthermore, when supplied in sheet form, the desired number of sheets can be integrally mounted.
第１図は、この発明の実施例によるチップ形コンデンサ
の連続体を示した斜視図、第２図は、実施例で使用する
外装枠の集合体を示した斜視図である。また、第３図は
、この発明の別の実施例で使用する外装枠の集合体を示
す斜視図である。
ｌ・・・コンデンサ、２・・・外装枠、３・・・リード
線、４・・・収納空間、５・・・壁部、６・・・溝部、
７．１０・・・集合体、８，１１・・・基体、９・・・
連続体。FIG. 1 is a perspective view showing a continuous body of chip capacitors according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an assembly of exterior frames used in the embodiment. Moreover, FIG. 3 is a perspective view showing an assembly of exterior frames used in another embodiment of the present invention. l... Capacitor, 2... Exterior frame, 3... Lead wire, 4... Storage space, 5... Wall, 6... Groove,
7.10...Aggregation, 8,11...Base, 9...
continuum.
Claims (3)
る外装枠にコンデンサを収納したチップ形コンデンサが
、外装枠と一体に成形された基体上に一定の間隔で連係
されたことを特徴とするチップ形コンデンサの連続体。(1) A chip characterized in that a chip-type capacitor, in which a capacitor is housed in an exterior frame having a storage space that matches the external shape of the capacitor, is linked at regular intervals on a base body that is integrally formed with the exterior frame. A continuum of shaped capacitors.
からなることを特徴とする請求項１記載のチップ形コン
デンサの連続体。(2) The continuous chip-type capacitor according to claim 1, wherein the exterior frame and the base are made of elastic rubber integrally molded.
合成樹脂からなることを特徴とする請求項１記載のチッ
プ形コンデンサの連続体。(3) The continuous body of a chip-type capacitor according to claim 1, wherein the exterior frame and the base are made of a heat-resistant synthetic resin integrally molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120028A JP2653024B2 (en) | 1988-05-17 | 1988-05-17 | Continuum of chip type capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63120028A JP2653024B2 (en) | 1988-05-17 | 1988-05-17 | Continuum of chip type capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01289239A true JPH01289239A (en) | 1989-11-21 |
| JP2653024B2 JP2653024B2 (en) | 1997-09-10 |
Family
ID=14776122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63120028A Expired - Lifetime JP2653024B2 (en) | 1988-05-17 | 1988-05-17 | Continuum of chip type capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2653024B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496899U (en) * | 1991-01-30 | 1992-08-21 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51121177A (en) * | 1975-04-16 | 1976-10-22 | Nippon Electric Co | Method of packing electronic parts |
| JPS5730315A (en) * | 1980-07-30 | 1982-02-18 | Matsushita Electric Ind Co Ltd | Method of producing solid electrolytic condenser |
| JPS593557U (en) * | 1982-06-30 | 1984-01-11 | 三菱電機株式会社 | Monolithic microwave integrated circuit |
| JPS60245116A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Electronic part |
-
1988
- 1988-05-17 JP JP63120028A patent/JP2653024B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51121177A (en) * | 1975-04-16 | 1976-10-22 | Nippon Electric Co | Method of packing electronic parts |
| JPS5730315A (en) * | 1980-07-30 | 1982-02-18 | Matsushita Electric Ind Co Ltd | Method of producing solid electrolytic condenser |
| JPS593557U (en) * | 1982-06-30 | 1984-01-11 | 三菱電機株式会社 | Monolithic microwave integrated circuit |
| JPS60245116A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Electronic part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496899U (en) * | 1991-01-30 | 1992-08-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2653024B2 (en) | 1997-09-10 |
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Legal Events
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|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
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| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
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| EXPY | Cancellation because of completion of term |