JPH0630329B2 - Manufacturing method of chip type capacitor - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to improvement of a capacitor, and more particularly to a method of manufacturing a chip-type capacitor suitable for surface mounting on a substrate.

[Conventional technology]

Conventionally, in order to realize a chip of a capacitor, resin molding is applied to the capacitor element, and the lead wire for external connection led out from the resin end surface is bent along the resin side surface.
It was facing the wiring pattern on the printed circuit board.

Alternatively, for example, as disclosed in Japanese Utility Model Publication No. 59-3557, there has been proposed one in which a conventional capacitor is housed in an outer frame and lead wires are arranged on substantially the same plane as the end face of the outer frame. . In addition, as in the inventions described in JP-A-60-245116 and JP-A-60-245115, a capacitor is arranged in a cylindrical outer frame with a bottom, and leads are led from through holes on the bottom of the outer frame. It has been proposed that a wire be drawn out and bent so that the lead wire is housed in a recess provided on the outer surface of the exterior frame.

[Problems to be Solved by the Invention]

However, in a chip-type capacitor to be molded, the capacitor element may be thermally deteriorated due to thermal stress during molding, and the manufacturing process thereof is complicated.

Further, when the capacitor is housed in the outer frame made of heat-resistant synthetic resin or the like, it is difficult to mold the minute outer frame at high speed.

Further, in the step of storing the capacitors in the outer frame, it is necessary to align the individual outer frames with a parts feeder or the like in order to store the capacitors in the outer frame formed by the molding die.

Therefore, the storage process becomes complicated, it is difficult to speed up the manufacturing process, and high accuracy is required for the jig and the like in the storage process. Alternatively, another means or process is required to prevent inconvenience such as reverse mounting of the capacitor body.

Further, as another problem, when a chip-type capacitor having a capacitor housed in an outer frame is surface-mounted on a printed circuit board, only the side surface from which the lead wire is led is fixed to the circuit board by soldering. Therefore, the chip-type capacitor mounted on the printed circuit board is not necessarily excellent in mechanical strength, and depending on the soldering condition, it may drop off from the printed circuit board due to vibration after mounting on the printed circuit board. .

Therefore, it is conceivable to provide an auxiliary mechanism such as soldering the auxiliary lead, but it is extremely difficult to provide this mechanism for a minute chip type capacitor, and the number of steps in the manufacturing process increases.

An object of the present invention is to manufacture a chip type capacitor more efficiently and at a higher speed than ever before.

Another object is to improve the mechanical strength of the chip capacitor in a mounted state.

[Means for Solving the Problems]

This invention is a method of manufacturing a chip type capacitor,
An outer frame having a storage space inside was formed on the connection part of the comb-shaped lead frame in which the connection parts were projected at regular intervals on the band-shaped base part, and then the inner frame size of the storage space was fitted to this outer frame. The capacitor is housed and the outer frame is separated from the lead frame.

Further, in the structure of the chip type capacitor, the comb-shaped lead frame connecting portion is embedded in the opening end surface of the outer frame, and the base portion of the lead frame faces the bottom surface of the outer frame.

[Work]

As shown in the drawing, in the comb-shaped lead frame 7 in which the connecting portion 9 is formed on the strip-shaped base portion 8, the outer frame 2 is insert-molded at the tip of the connecting portion 9 of the lead frame 7, and the lead frame 7 is formed. To form a group of exterior frames 2 linked with each other.

Therefore, the outer frame 2 can be continuously formed on the connecting portion 9 of the comb-shaped lead frame 7. Further, since the assembly including the outer frame 2 and the lead frame 7 can be integrally supplied to the next step, it is possible to unify all the directions of the outer frame 2 supplied as the assembly. .

Further, the aggregate of the exterior frames 2 can be continuously supplied via a device such as a reel, so that the exterior frames 2 can be supplied in a large amount and at high speed. Therefore, the process of housing the capacitor 1 main body in the exterior frame 2 becomes efficient.

Further, the lead frame 7 is provided on one opening end surface of the exterior frame 2.
Can also be left. Then, the remaining lead frame 7 can also be used as an auxiliary lead.

〔Example〕

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a chip type capacitor obtained according to the present invention from the bottom surface direction, and FIG. 2 is a perspective view showing an exterior frame used in the first embodiment of the present invention. FIG. 3 is a process explanatory view showing a manufacturing method according to an embodiment of the present invention.

As shown in FIG. 2, the single exterior frame 2 has a cylindrical storage space 4 inside, and a wall portion 5 that covers a part of this opening end face is formed on one opening end face. . This wall 5
Contacts the end surface of the capacitor 1 housed in the housing space 4 of the exterior frame 2 and locks the capacitor 1 in the housing space 4. Further, a groove portion 6 for accommodating the lead wire 3 of the main body of the capacitor 1 is formed on the bottom surface.

As shown in FIG. 3 (a), the outer frame 2 is continuously formed on the strip-shaped base portion 8 and the connecting portions 9 of the comb-shaped lead frame 7 in which the connecting portions 9 project at regular intervals. . The lead frame 7 is formed of a metal material such as aluminum, iron, or copper, or a clad material thereof, and is continuously supplied by a reel or the like.

The outer frame 2 may be formed by any molding means,
In this example, it was formed by the insert molding method. That is, a part of the connecting portion 9 of the lead frame 7 is covered with a mold, and a synthetic resin material is injected to form the outer frame 2 on the connecting portion 9. Therefore, the outer frame 2 is linked by the lead frame 7 to form an assembly of the outer frames 2. Further, in this embodiment, in order to strengthen the connection between the outer frame 2 and the lead frame 7, the outer frame 2 is connected to two adjacent connecting portions 9.
Was formed so as to straddle.

Next, as shown in FIG. 3 (b), the assembly is transferred as a unit and supplied to the step of storing the capacitor 1 in the storage space 4 of the exterior frame 2.

In the capacitor 1, a capacitor element formed by winding an electrode foil (not shown) and electrolytic paper is housed in a cylindrical outer case having a bottom and made of aluminum or the like, and the opening end of the outer case is sealed with a sealing body and the capacitor is formed. The lead wire 3 guided from the element is penetrated through the sealing body and drawn out to the outside.

Then, the capacitors 1 are sequentially housed in the individual exterior frames 2 of the assembly supplied as a unit. At this time, since the orientations of the exterior frame 2 are all uniform, the orientation of the capacitor 1 housed in the exterior frame 2, that is, the polarity of the lead wire 3 is adjusted to be constant, so that the capacitor 1 is not reversely mounted. It can be prevented.

Next, the lead frame 7 is cut at A and A'shown in FIG. 3 (b) to separate the exterior frame 2 from the lead frame 7. Further, a part of the lead frame 7 remaining in the independent exterior frame 2 is bent along the opening end surface and the bottom surface of the exterior frame 2 to face the bottom surface of the exterior frame 2.

On the other hand, the lead wire 3 protruding from the opening end surface of the exterior frame 2 is
The chip-shaped capacitor shown in FIG. 1 is obtained by bending along the opening end surface and the bottom surface of the outer frame 2 and housing the groove in the groove portion 6 of the outer frame 2.

Since the storage space 4 of the outer frame 2 uses the capacitor 1 having a cylindrical outer shape in this embodiment, the shape conforming to the outer shape of the capacitor 1, that is, the capacitor 1 is used.
Is formed in a cylindrical shape having an inner diameter substantially the same as the outer diameter. When using a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape, an outer frame having an elliptic cylindrical storage space adapted to the shape is used.

Further, in this embodiment, the bending of the lead wire 3 is performed after separating the exterior frame 2 from the lead frame 7, but it may be performed before separating from the lead frame 7. In this case, the lead wires 3 can be bent at the same time for a plurality of capacitors 1, and a more efficient manufacturing process can be realized. Also, the lead frame 7
When separating the outer frame 2 of the single unit from the
Since the main body is locked in the storage space 4 by the wall portion 5 of the exterior frame 2 and the lead wire 3, there is no possibility of being detached from the storage space 4.

Next, another embodiment of the present invention will be described.

The outer frame 2 is continuously formed on the connecting portion 9 of the lead frame 7 in the same manner as in the first embodiment, and this aggregate is supplied integrally.

Then, the capacitor 1 formed in the same manner as in the first embodiment.
Is stored in the storage space 4 of the exterior frame 2, and the lead wire 3 protruding from the opening end surface of the exterior frame 2 is bent along the opening end surface and the bottom surface of the exterior frame 2.

Next, the various outer frames 2 are connected to the connecting portion 9 of the lead frame 7.
The chip type capacitor is obtained by separating at B.

In the case of this embodiment, unlike the first embodiment, the manufactured chip type capacitor has no auxiliary lead, but in the same manner as in the first embodiment, in the forming process of the outer frame 2 and the storing process of the capacitor 1, It enables continuous supply and efficient production.

Further, it goes without saying that the cut portion (A or B) of the lead frame 7 in the embodiments of the present invention is not determined in each embodiment but is determined according to the necessity of the auxiliary terminal.

〔The invention's effect〕

As described above, according to the present invention, in the method for manufacturing a chip-type capacitor, the outer frame having the storage space inside is formed on the connection part of the comb-shaped lead frame in which the connection parts are projected at regular intervals in the strip-shaped base part. After that, the outer frame is characterized by accommodating a capacitor that matches the inner diameter of the storage space and separating the outer frame from the lead frame.
And it becomes possible to manufacture at high speed.

In addition, the individual exterior frames are supplied in a state in which their directions are unified. Therefore, in the step of housing the capacitor in the outer frame, by adjusting only the direction of the lead wire of the capacitor, that is, only the polarity, reverse mounting on the outer frame can be prevented, the manufacturing process is simplified and the reliability is improved. .

Further, in the structure of the chip-type capacitor, the comb-shaped lead frame connecting portion is embedded in the opening end surface of the outer frame, and the base portion of the lead frame faces the bottom surface of the outer frame. The so-called auxiliary lead can be easily installed, and the auxiliary lead improves the vibration resistance performance of the chip type capacitor on the printed circuit board and improves the reliability.

Further, as a manufacturing method for obtaining the above-mentioned chip type capacitor, the lead frame is cut in the width direction at its base portion to separate the outer frame from the lead frame, and then the lead frame is attached to the opening end surface and the bottom surface of the outer frame. Since it is characterized in that it is bent along, the auxiliary lead can be easily attached to the outer frame as needed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a chip type capacitor obtained according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an exterior frame used in the embodiment of the present invention. FIG. 3 is a process explanatory view showing a manufacturing method according to an embodiment of the present invention. 1 ... Capacitor, 2 ... Exterior frame, 3 ... Lead wire, 4 ... Storage space, 5 ... Wall part, 6 ... Groove part, 7 ... Lead frame, 8 ... Base part, 9 ... Connection Department.

Claims (1)

[Claims] 1. An outer frame having a storage space inside is formed on a connection part of a comb-shaped lead frame in which connection parts are projected at regular intervals on a strip-shaped base part, and the storage space is then formed in the outer frame. A method of manufacturing a chip-type capacitor, characterized in that a capacitor conforming to an inner diameter dimension is housed and an outer frame is separated from a lead frame.