JPH0210710A - Chip-type capacitor and manufacture thereof - Google Patents

Abstract

PURPOSE:To manufacture a capacitor effectively and rapidly by removing an outer packaging frame after the capacitor, which fits in the inner housing space of the frame, is placed in the outer packaging frame. CONSTITUTION:On a comblike leadframe 7 which is a beltlike substrate 8 having protruding connections 9 at regular intervals, outer packaging frames 2 are formed which have a housing space inside. After storing capacitors 1, which fit in the inner housing space of the frame, in the outer packaging frame 2, the outer packaging frame 2 is removed from the leadframe 7. Therefore, a successive and rapid manufacture of many chip-type capacitors is possible.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in capacitors, and particularly to a method for manufacturing a chip-type capacitor suitable for surface mounting on a substrate.

[Conventional technology]

Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the end of the resin was bent along the side of the resin.
It was facing the wiring pattern of the printed circuit board.

Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, it has been proposed that a conventional capacitor is housed in an exterior frame, and the lead wires are arranged on approximately the same plane as the end face of the exterior frame. . Also, JP-A-60-2451)
6 and JP-A-60-2451) No. 5, a capacitor is placed in a bottomed cylindrical exterior frame, and a lead wire is led out from a through hole at the bottom of the exterior frame.
It has been proposed that this lead wire is bent so as to fit into a recess provided on the outer surface of the exterior frame.

[Problem to be solved by the invention]

However, in chip-type capacitors that are molded, there is a risk that the capacitor element may be thermally deteriorated due to thermal stress during molding, and the manufacturing process is also complicated.

Furthermore, when a capacitor is housed in an outer frame made of heat-resistant synthetic resin or the like, it is difficult to mold the minute outer frame at high speed.

Furthermore, in the step of housing the capacitor in the exterior frame, it was necessary to align the individual exterior frames using a parts feeder or the like, since the capacitor was housed in the exterior frame formed by the mold.

Therefore, the storage process becomes complicated, it is difficult to speed up the manufacturing process, and a high degree of precision is required for jigs and the like in the storage process.

Alternatively, another means or process is required to prevent problems such as reverse mounting of the capacitor body.

Another problem is that when a chip-shaped capacitor, in which the capacitor is housed in an exterior frame, is surface-mounted on a printed circuit board, only the side surface from which the lead wires are led is fixed to the circuit board by soldering. Therefore, chip capacitors mounted on printed circuit boards do not necessarily have excellent mechanical strength, and depending on the soldering conditions, they may fall off from the printed circuit board due to vibration etc. after being mounted on the printed circuit board. .

Therefore, it is conceivable to provide an auxiliary mechanism such as soldering auxiliary leads, but it is extremely difficult to provide this mechanism in a minute chip-type capacitor, and the number of steps in the manufacturing process increases.

The present invention aims to manufacture chip capacitors more efficiently and at a higher speed than conventional methods.

Another object is to improve the mechanical strength of a chip capacitor in a mounted state.

[Means to solve the problem]

This invention provides a method for manufacturing a chip capacitor, including:
An exterior frame with an internal storage space is formed at the connection part of a comb-shaped lead frame with connection parts protruding at regular intervals on a band-shaped base part, and this exterior frame has a shape that matches the inner diameter of the storage space. The feature is that the exterior frame is separated from the lead frame after the capacitor is housed.

Furthermore, the structure of the chip-type capacitor is characterized in that a connecting portion of a comb-shaped lead frame is buried in the open end surface of the outer frame, and the base portion of the lead frame faces the bottom surface of the outer frame.

Furthermore, as a manufacturing method for obtaining the above chip-type capacitor, the lead frame is cut in the width direction at its base portion to separate the outer frame from the lead frame, and then this lead frame is cut on the open end surface and bottom surface of the outer frame. The feature is that it can be folded along.

[For production]

As shown in the drawing, a comb-shaped lead frame 7 in which a connection part 9 is formed on a strip-shaped base part 8 has an exterior frame 2 insert-molded at the tip of the connection part 9 of the lead frame 7. forms an aggregate of exterior frames 2 linked together.

Therefore, the exterior frame 2 can be continuously formed on the connecting portion 9 of the comb-shaped lead frame 7.

Furthermore, since the assembly consisting of the exterior frame 2 and lead frame 7 can be supplied as one to the next process, it becomes possible to unify the direction of all the exterior frames 2 supplied as an assembly. .

Further, the assembly of the exterior frames 2 can be continuously supplied via a device such as a reel, and the exterior frames 2 can be supplied in large quantities and at high speed. Therefore, the process of housing the main body of the capacitor 1 in the outer frame 2 becomes efficient.

Furthermore, a lead frame 7 is provided on one open end surface of the exterior frame 2.
can also be left behind. This remaining lead frame 7 can also be used as an auxiliary lead.

〔Example〕

Next, embodiments of the present invention will be briefly described with reference to the drawings. 1st
The figure is a perspective view of a chip-type capacitor obtained according to the present invention, viewed from the bottom, and FIG. 2 is a perspective view of an exterior frame used in the first embodiment of the present invention. Figure 3 shows
FIG. 2 is a process explanatory diagram showing a manufacturing method according to an embodiment of the present invention.

As shown in FIG. 2, the single exterior frame 2 has a cylindrical storage space 4 therein, and a wall 5 is formed on one open end surface to cover a part of this open end surface. . This wall part 5
comes into contact with the end face of the capacitor 1 housed in the housing space 4 of the exterior frame 2, thereby locking the capacitor 1 in the housing space 4.

Furthermore, a groove 6 is formed in the bottom surface to accommodate the lead wire 3 of the capacitor 1 body.

The exterior frame 2 is formed continuously on a strip-shaped base portion 8 as shown in FIG. This lead frame 7 is formed from a metal material such as aluminum, iron, copper, etc. or a clad material thereof, and is continuously supplied by a reel or the like.

The exterior frame 2 may be formed by any molding method, but
In this example, it was formed by an insert molding method. That is, a part of the connecting portion 9 of the lead frame 7 is covered with a mold, and a synthetic resin material is injected to form the outer frame 2 on the connecting portion 9. Therefore, the exterior frames 2 are linked by the lead frame 7 to form an assembly of the exterior frames 2. In addition, in this embodiment, in order to strengthen the connection between the exterior frame 2 and the lead frame 7, the exterior frame 2 is connected to two adjacent connecting portions 9.
It was shaped to straddle the .

Next, as shown in FIG. 3(b), the aggregate is transported as one body and supplied to the step of storing the capacitor 1 in the storage space 4 of the outer frame 2.

A capacitor l is made by storing a capacitor element formed by winding electrode foil and electrolytic paper (not shown) in a bottomed cylindrical outer case made of aluminum or the like, and sealing the open end of the outer case with a sealing body. A lead wire 3 led from the element is passed through the sealing body and drawn out to the outside.

Then, the capacitors 1 are sequentially housed in the individual outer frames 2 of the aggregate that is supplied as one unit.

At this time, since the orientation of the exterior frame 2 is all unified,
By adjusting the orientation of the capacitor 1 housed in the exterior frame 2, that is, the polarity of the lead wire 3 to make it constant, it is possible to prevent the capacitor 1 from being installed in the opposite direction.

Next, the lead frame 7 is
and A" to separate the exterior frame 2 from the lead frame 7.Furthermore, a part of the lead frame 7 remaining in the independent exterior frame 2 is bent along the open end surface and bottom surface of the exterior frame 2, and the exterior frame 2 is separated from the lead frame 7. Face the bottom of frame 2.

On the other hand, the lead wA3 protruding from the open end surface of the outer frame 2 is bent along the open end surface and the bottom surface of the outer frame 2 and stored in the groove 6 of the outer frame 2, thereby obtaining the chip type capacitor shown in FIG.

In addition, since this embodiment uses a capacitor l having a cylindrical external shape, the storage space 4 of the exterior frame 2 has a shape that matches the external shape of the capacitor l, that is, the capacitor 1
It is formed into a cylindrical shape with an inner diameter that is approximately the same as the outer diameter. When using a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape, an exterior frame having an elliptical cylindrical storage space suitable for the shape is used.

Further, in this embodiment, the lead wire 3 was bent after the outer frame 2 was separated from the lead frame 7, but it may be performed before the lead wire 3 is separated from the lead frame 7. In this case, it becomes possible to bend the lead wires 3 for a plurality of capacitors 1 at the same time, and a more efficient manufacturing process can be realized. In addition, lead frame 7
When separating the single exterior frame 2 from the capacitor 1
Since the main body is locked to the storage space 4 by the wall portion 5 of the exterior frame 2 and the lead wire 3, there is no fear that the main body will separate from the storage space 4.

Next, another embodiment of this invention will be described.

The exterior frame 2 is continuously formed on the connecting portion 9 of the lead frame 7, as in the first embodiment, and the assembly is supplied as one piece.

Then, the capacitor 1 formed in the same manner as in the first embodiment is stored in the storage space 4 of the exterior frame 2, and the lead wires 3 protruding from the open end surface of the exterior frame 2 are connected along the open end surface and the bottom surface of the exterior frame 2. and fold it.

Next, each outer frame 2 is connected to the connection part 9 of the lead frame 7.
Separate at B to obtain a chip capacitor.

In the case of this embodiment, unlike the first embodiment, the manufactured chip capacitor does not have an auxiliary or - lead, but the molding process of the outer frame 2 and the capacitor 1 are similar to the first embodiment.
In the storage process, continuous supply is possible and efficient manufacturing is possible.

In addition, in this second embodiment, the exterior frame 2 can be separated from the lead frame 7 before the capacitor 1 is housed. In this case, the lead frame 7 does not interfere with housing the capacitor 1.

Further, it goes without saying that the cut portion (A or B) of the lead frame 7 in the embodiments of the present invention is not determined in each embodiment, but is determined depending on the necessity of the auxiliary terminal.

[Effects of the Invention] As described above, the present invention provides a method for manufacturing a chip capacitor in which storage spaces are provided inside the connecting portions of a comb-shaped lead frame in which connecting portions protrude at regular intervals from a band-shaped base portion. At the same time, the exterior frame is molded with
After storing the capacitors that match the inner diameter of the storage space, the outer frame is separated from the lead frame, so multiple chip capacitors can be stored in succession.
Moreover, it becomes possible to manufacture at high speed.

Furthermore, the individual exterior frames are supplied with their orientations unified. Therefore, in the process of housing the capacitor in the exterior frame, by adjusting only the direction of the capacitor lead wires, that is, the polarity, it is possible to prevent the capacitor from being installed in the exterior frame in the wrong direction, simplifying the manufacturing process and improving reliability. .

In addition, the structure of the chip-type capacitor is characterized in that the connecting portion of the comb-shaped lead frame is buried in the open end surface of the outer frame, and the base portion of the lead frame faces the bottom surface of the outer frame. , so-called auxiliary leads can be easily installed, and the auxiliary leads improve the vibration resistance of the chip capacitor on the printed circuit board, improving reliability.

Furthermore, as a manufacturing method for obtaining the above chip-type capacitor, the lead frame is cut in the width direction at its base portion to separate the outer frame from the lead frame, and then this lead frame is cut on the open end surface and bottom surface of the outer frame. Since it is characterized by being bent along the side, the auxiliary lead can be easily attached to the exterior frame if necessary.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a chip-type capacitor obtained according to an embodiment of the invention, and FIG. 2 is a perspective view showing an exterior frame used in an embodiment of the invention. FIG. 3 is a process explanatory diagram showing a manufacturing method according to an embodiment of the present invention. 7... Lead frame, 8... Base portion, 9... Connection portion.

Claims (3)

[Claims] (1) An exterior frame with a storage space inside is formed at the connection part of a comb-shaped lead frame with connection parts protruding at regular intervals from a band-shaped base part, and this exterior frame is provided with the inner diameter dimensions of the storage space. A method for manufacturing a chip-type capacitor, characterized by separating an exterior frame from a lead frame after storing a suitable capacitor. (2) A chip-type capacitor characterized in that a connecting portion of a comb-shaped lead frame is embedded in the open end surface of the outer frame, and the base portion of the lead frame faces the bottom surface of the outer frame. (3) A claim characterized in that the lead frame is cut in the width direction at its base portion to separate the exterior frame from the lead frame, and then the lead frame is bent along the opening end surface and bottom surface of the exterior frame. 2. The method for manufacturing a chip capacitor according to 2.