JPH01175216A - Chip-type capacitor - Google Patents
Chip-type capacitorInfo
- Publication number
- JPH01175216A JPH01175216A JP62332859A JP33285987A JPH01175216A JP H01175216 A JPH01175216 A JP H01175216A JP 62332859 A JP62332859 A JP 62332859A JP 33285987 A JP33285987 A JP 33285987A JP H01175216 A JPH01175216 A JP H01175216A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- frame
- terminals
- chip
- armoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 abstract description 3
- 238000007689 inspection Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、コンデンサの改良にかかり、特に、基板へ
の表面実装に適したチップ形あコンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in capacitors, and particularly to chip-type capacitors suitable for surface mounting on a substrate.
従来、コンデンサのチップ化を実現するには、コンデン
サ素子に樹脂モールド加工を施し、樹脂端面から導出し
た外部接続用の端子を樹脂側面に沿って折り曲げ、プリ
ント基板の配線パターンに臨ませていた。Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the external connection terminals led out from the end of the resin were bent along the side of the resin to expose the wiring pattern on the printed circuit board.
あるいは、例えば実公昭５９−３５５７号公報に記載き
れた考案のように、従来のコンデンサを外装枠に収納し
、端子を外装枠の端面とほぼ同一平面上に配置したもの
が提案されている。また、特開昭６０−２４５１１６号
公報および特開昭６０−２４５１１５号公報Ｇこ記載さ
れた発明のように、有底筒状の外装枠にコンデンサを配
置して外装枠底面の貫通孔から端子を導出し、この端子
を外装枠の外表面に設けた凹部に収めるように折り曲げ
たものが提案されている。Alternatively, a device has been proposed in which a conventional capacitor is housed in an outer frame and the terminals are disposed on substantially the same plane as the end face of the outer frame, as described in, for example, Japanese Utility Model Publication No. 59-3557. In addition, as in the inventions described in JP-A-60-245116 and JP-A-60-245115, a capacitor is placed in a cylindrical outer frame with a bottom and a terminal is connected through a through hole on the bottom of the outer frame. It has been proposed that the terminal is bent so as to fit into a recess provided on the outer surface of the outer frame.
このような従来のチップ形コンデンサは、通常のコンデ
ンサの構造を変更することなく表面実装を可能にしてい
る。Such conventional chip capacitors allow surface mounting without changing the structure of the normal capacitor.
しかしながら、モールド加工を施すチップ形コンデンサ
では、モールド加工時の熱的ストレスによりコンデンサ
素子が熱劣化するおそれがあった。However, in chip-type capacitors that are molded, there is a risk that the capacitor element will be thermally degraded due to thermal stress during the molding process.
また、近来の電子部品の小型化に伴い、電子部品から導
出される端子間の距離が極端に短くなり、１ｌ以下とな
る場合がある。そのため、通常のコンデンサを利用した
チップ形コンデンサでは、外部に導出した端子間の距離
が短くなり、プリント基板に実装して半田付けを行うと
、溶融した半田が端子を短絡させてしまうことがあった
。Further, with the recent miniaturization of electronic components, the distance between terminals led out from the electronic components has become extremely short, and may be less than 1 liter. For this reason, in chip capacitors that use regular capacitors, the distance between the terminals led out to the outside is short, and when mounted on a printed circuit board and soldered, the molten solder may short-circuit the terminals. Ta.
また、プリント基板の配線パターン密度も高くなり、効
率的な配置を行うために各種の端子間距離が求められる
ようになった。そこで、端子間の適正な距離を確保しつ
つ、すなわち半田による短絡がない程度の距離を確保し
つつ、かつ各種の端子間距離を実現させることが必要と
なっている。従来は、この要求に対して、端子を収納す
る溝部等の距離を調整して対応しているが、外装枠を製
造する際の金型を要求毎に作製する必要があり効率的で
ない。Furthermore, the wiring pattern density of printed circuit boards has increased, and various distances between terminals have become required for efficient arrangement. Therefore, it is necessary to realize various distances between the terminals while ensuring an appropriate distance between the terminals, that is, while ensuring a distance that prevents short circuits due to solder. Conventionally, this requirement has been met by adjusting the distance between the grooves and the like in which the terminals are accommodated, but this is not efficient as it requires creating a mold for each requirement for manufacturing the exterior frame.
更に、電子部品を表面実装する場合、端子は電子部品の
底面に位置することになり、端子の半田付は状態を確認
することが困難となっている。また、電子部品の小型化
に伴ってプリント基板への高密度実装化が進み、電子部
品間の距離も短くなっている。Furthermore, when electronic components are surface mounted, the terminals are located on the bottom surface of the electronic component, making it difficult to check the soldered state of the terminals. Furthermore, as electronic components become smaller, they are being mounted more densely on printed circuit boards, and the distance between electronic components is also becoming shorter.
そのため、電子部品の半田付は状態の確認がまずます困
難になっている。For this reason, it has become increasingly difficult to check the condition of soldering electronic components.
この発明の目的は、通常のコンデンサの構造を変更する
ことなく各種の端子間距離を適正に保持するとともに、
半田付は状態の確認を容易にするチップ形コンデンサを
提供することにある。The purpose of this invention is to maintain appropriate distances between various terminals without changing the structure of a normal capacitor, and to
The purpose of soldering is to provide a chip-type capacitor whose condition can be easily checked.
この発明は、コンデンサの外形寸法に適合した収納空間
を有するとともに、底面の一部に、対向する側面にわた
る弧状の切欠部が形成された外装枠にコ ゛ンデン
サを収納し、コンデンサから導出された端子を、外装枠
の開口部から側面に露出するように折り曲げて、前記外
装枠の切欠部に当接させたことを特徴としている。In this invention, the capacitor is housed in an exterior frame that has a storage space that matches the external dimensions of the capacitor and has an arc-shaped notch extending over the opposing sides in a part of the bottom. The terminal is characterized in that the terminal is bent so as to be exposed on the side surface through the opening of the exterior frame, and brought into contact with the notch of the exterior frame.
第１図に示したように、コンデンサ１から導出された端
子３は、外装枠２の対向する側面７から底面にかかる弧
状の切欠部６に当接し、外装枠２の側面７から露出する
。そのため、外装枠２の側面７方向から、半田付けの状
態を視覚により確認することができる。また各端子３は
、第２図に示すように、弧状の切欠部６の任意の位置に
当接させることにより、その端子間距離を可変とするこ
とができる。As shown in FIG. 1, the terminal 3 led out from the capacitor 1 comes into contact with an arcuate notch 6 extending from the opposing side surface 7 to the bottom of the outer frame 2 and is exposed from the side surface 7 of the outer frame 2. Therefore, the state of soldering can be visually confirmed from the direction of the side surface 7 of the exterior frame 2. Furthermore, as shown in FIG. 2, each terminal 3 can be brought into contact with any arbitrary position of the arc-shaped notch 6, thereby making it possible to change the distance between the terminals.
次いでこの発明の実施例を図面にしたがい説明する。第
１図は、この発明の実施例を示した斜視図、第２図は、
この発明の実施例によるチップ形コンデンサの正面図で
ある。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the invention, and FIG. 2 is a perspective view showing an embodiment of the invention.
FIG. 1 is a front view of a chip-type capacitor according to an embodiment of the present invention.
コンデンサ１本体は、図示しない電極箔と電解紙とを巻
回して形成したコンデンサ素子を、アルミニウム等から
なる有底筒状の外装ケースに収納し、外装ケース開口端
を封口体４で密封するとともに、コンデンサ素子から導
いた端子３を前記封口体４に貫通させて外部に引き出し
た構成からなる。The capacitor 1 body houses a capacitor element formed by winding electrode foil and electrolytic paper (not shown) in a bottomed cylindrical outer case made of aluminum or the like, and seals the open end of the outer case with a sealing body 4. , the terminal 3 led from the capacitor element is passed through the sealing body 4 and drawn out to the outside.
このコンデンサ１は、内部にコンデンサｌの外径寸法お
よび外形形状に適合した円筒状の収納空間を有する外装
枠２に収納される。外装枠２は、耐熱性に優れた材質を
用いることが望まれ、好ましくは、耐熱性に優れたエポ
キシ、フェノール、ポリイミド等の耐熱性合成樹脂、セ
ラミック材等が適当である。This capacitor 1 is housed in an exterior frame 2 having a cylindrical storage space therein that matches the outer diameter and shape of the capacitor 1. It is desirable to use a material with excellent heat resistance for the exterior frame 2, and preferably heat-resistant synthetic resins such as epoxy, phenol, polyimide, etc., which have excellent heat resistance, ceramic materials, etc. are suitable.
外装枠２の底面の一部には、対向する側面７にわたる弧
状の切欠部６が形成されている。コンデンサｌから導出
された端子３は、折り曲げられて、この切欠部６に当接
する。そして端子３は、実装されるプリント基板に臨む
ことになるとともに、切欠部６が弧状に形成されている
ので、外装枠２の側面７の方向から常に目視することが
できる。また、切欠部６における端子３の当接部分は、
このチップ形コンデンサが実装されるプリント基板の配
線パターンに合わせて調節する。An arcuate notch 6 extending across opposing side surfaces 7 is formed in a part of the bottom surface of the exterior frame 2 . The terminal 3 led out from the capacitor l is bent and abuts on this notch 6. The terminal 3 faces the printed circuit board on which it is mounted, and since the notch 6 is formed in an arc shape, it can always be visually observed from the direction of the side surface 7 of the exterior frame 2. In addition, the contact portion of the terminal 3 in the notch 6 is
This chip capacitor is adjusted according to the wiring pattern of the printed circuit board on which it is mounted.
なお、外装枠２の収納空間は、この実施例では外観形状
が円筒状のコンデンサ１を用いているため、コンデンサ
１の外径寸法とほぼ同じ内径寸法の円筒状に形成されて
いる。非円筒状のコンデンサ、例えば断面形状が楕円状
に形成されたコンデンサを用いる場合は、その形状に適
合した楕円筒状の収納空間を有する外装枠を用いること
になる。The storage space of the exterior frame 2 is formed into a cylindrical shape with an inner diameter that is approximately the same as the outer diameter of the capacitor 1, since this embodiment uses a capacitor 1 having a cylindrical external shape. When using a non-cylindrical capacitor, for example, a capacitor having an elliptical cross-sectional shape, an exterior frame having an elliptical cylindrical storage space suitable for the shape is used.
更に、外装枠２の端面の一方には、開口部の一部を覆う
突起部５が設けられている。この突起部５は、外装枠２
の収納空間に収納されるコンデンサ１の端面と当接する
。したがって、コンデンサ１本体は、この突起部５と折
り曲げられる端子３とによって外装枠２内に固定される
ことになる。Further, one end face of the exterior frame 2 is provided with a protrusion 5 that covers a part of the opening. This protrusion 5 is connected to the exterior frame 2.
The capacitor 1 comes into contact with the end face of the capacitor 1 stored in the storage space. Therefore, the main body of the capacitor 1 is fixed within the exterior frame 2 by the protrusion 5 and the bendable terminal 3.
なお、端子３を折り曲げる際には、端子３の一部に偏平
部を設け、この偏平部を基点に端子３を折り曲げてもよ
く、この場合、折り曲げ加工が容易となる。In addition, when bending the terminal 3, a flat part may be provided in a part of the terminal 3, and the terminal 3 may be bent using this flat part as a starting point. In this case, the bending process becomes easy.
以上のようにこの発明は、コンデンサの外形寸法に適合
した収納空間を有するとともに、底面の一部に、対向す
る側面にわたる弧状の切欠部が形成された外装枠にコン
デンサを収納し、コンデンサから導出された端子を、外
装枠の開口部から側面に露出するように折り曲げて、前
記外装枠の切欠部に当接させたことを特徴としているの
で、外装枠の切欠部に当接する端子は、外装枠の側面か
ら外部に露出することとなり、このチップ形コンデンサ
をプリント基板に表面実装して半田付けを行った場合、
その半田付けの状態を外装枠の側面から視覚により確認
することが容易になる。As described above, the present invention stores the capacitor in an exterior frame that has a storage space that matches the external dimensions of the capacitor and has an arc-shaped notch extending over the opposing sides in a part of the bottom surface, and The terminal is bent so as to be exposed on the side through the opening of the exterior frame and brought into contact with the notch of the exterior frame, so that the terminal that comes into contact with the notch of the exterior frame is It will be exposed to the outside from the side of the frame, and if this chip capacitor is surface mounted on a printed circuit board and soldered,
It becomes easy to visually check the soldering condition from the side of the exterior frame.
また、プリント基板に臨む各端子は、外装枠側面にわた
る弧状の切欠部に当接するので、このチップ形コンデン
サが実装されるプリント基板の配線パターンに、精密な
加工精度を要求されることなく適合させ、その距離を一
定に保持することができる。したがって、半田付けを行
う際に、溶融した半田が端子を短絡させることがなくな
るとともに、実装するプリント基板の配線パターンに合
致した端子間距離を、容易に実現することができるよう
になる。In addition, each terminal facing the printed circuit board comes into contact with an arc-shaped notch extending over the side of the exterior frame, so it can be adapted to the wiring pattern of the printed circuit board on which this chip capacitor is mounted without requiring precise processing accuracy. , the distance can be kept constant. Therefore, when performing soldering, the molten solder does not short-circuit the terminals, and it becomes possible to easily realize a distance between the terminals that matches the wiring pattern of the printed circuit board to be mounted.
更に、プリント基板に臨む端子は、外装枠の側面から露
出しているため、半田層が端子に巻き込まれるように付
着する。そのため、端子と半田層との接触面積が従来よ
り拡大し、確実な接続を行うことができる。Furthermore, since the terminals facing the printed circuit board are exposed from the side surface of the exterior frame, the solder layer is rolled up and adhered to the terminals. Therefore, the contact area between the terminal and the solder layer is expanded compared to the conventional method, and a reliable connection can be achieved.
以上のように、この発明は、通常のコンデンサの構造を
変更することなく、かつプリント・基板実装後の検査が
容易になるチップ形コンデンサを提供することができる
。As described above, the present invention can provide a chip-type capacitor that can be easily inspected after being mounted on a printed circuit board without changing the structure of an ordinary capacitor.
第１図は、この発明の実施例を示した斜視図で、第２図
は、この発明の実施例によるチップ形コンデンサの正面
図である。
■・・コンデンサ、２・・外装枠、３・・端子、４・・
封口体、５・・突起部、６・・切欠部。FIG. 1 is a perspective view showing an embodiment of the invention, and FIG. 2 is a front view of a chip-type capacitor according to an embodiment of the invention. ■...Capacitor, 2...Exterior frame, 3...Terminal, 4...
Sealing body, 5... protrusion, 6... notch.
Claims (1)
るとともに、底面の一部に、対向する側面にわたる弧状
の切欠部が形成された外装枠にコンデンサを収納し、コ
ンデンサから導出された端子を、外装枠の開口部から側
面に露出するように折り曲げて、前記外装枠の切欠部に
当接させたことを特徴とするチップ形コンデンサ。(1) The capacitor is stored in an exterior frame that has a storage space that matches the external dimensions of the capacitor and has an arc-shaped notch extending over the opposing sides in a part of the bottom, and the terminals led out from the capacitor are A chip-type capacitor characterized in that the chip-type capacitor is bent so as to be exposed on the side surface through an opening of the exterior frame and brought into contact with a notch in the exterior frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62332859A JPH01175216A (en) | 1987-12-29 | 1987-12-29 | Chip-type capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62332859A JPH01175216A (en) | 1987-12-29 | 1987-12-29 | Chip-type capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01175216A true JPH01175216A (en) | 1989-07-11 |
| JPH0426769B2 JPH0426769B2 (en) | 1992-05-08 |
Family
ID=18259601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62332859A Granted JPH01175216A (en) | 1987-12-29 | 1987-12-29 | Chip-type capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01175216A (en) |
-
1987
- 1987-12-29 JP JP62332859A patent/JPH01175216A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426769B2 (en) | 1992-05-08 |
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