JPH07142881A - Composite electronic component - Google Patents

Abstract

PURPOSE:To provide a composite electronic component having high mechanical strength and high density for mounting. CONSTITUTION:A composite electronic component comprises a composite electronic component body 3 with an electronic component 2 mounted on a multi- layered substrate 1 made of ceramic, a resin case 4 with a stage 4a formed on an inner wall and a lead frame 5 having a small protrusion 5a attached to a side wall of the resin case 4, wherein the ceramic multi-layered substrate 1 of the composite electronic component body 3 is fixed between the stage 4a of the resin case 4 and the small protrusion 5a of the lead frame 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component having electronic components mounted on a multilayer substrate.

[0002]

2. Description of the Related Art A conventional composite electronic component is shown in FIGS. In FIG. 3, reference numeral 11 is a multilayer substrate in which ceramic substrates are laminated. A circuit element (not shown) or a wiring pattern (not shown) is formed inside the multilayer substrate 11, and a pad electrode 11b is formed on the upper surface. The external electrodes 11a are formed on the side surfaces. Then, the electronic component 12 for surface mounting is mounted on the pad electrode 11b on the upper surface to form the composite electronic component 13, which is surface-mounted on the printed board 14 of the device or the like. The circuit element, the wiring pattern, and the pad electrode 11
b is connected by a via hole 11c.

However, when the printed circuit board 14 of the device on which the composite electronic component 13 is mounted is bent such as warped or twisted, mechanical stress is exerted on the multilayer substrate 11 of the composite electronic component 13, and There is a problem that cracks and cracks occur.

Therefore, as shown in FIGS. 4 and 5, the composite electronic component 15 in which the mechanical strength of the multilayer substrate 11 is improved.
And the composite electronic component 17 was used. That is, as shown in FIG. 4, in the composite electronic component 15, the ceramic pedestals 16 and 16 having the end face electrodes 16a formed on the side surfaces are attached to both ends of the bottom surface of the multilayer substrate 11 on the long side thereof. External electrode 11a and end face electrodes 1 of pedestals 16 and 16
6a is made conductive. Further, the composite electronic component 17 has an end face electrode 18a on the side surface as shown in FIG.
The ceramic case 18 on which the
The electronic component 12 is arranged on the upper surface of the
The external electrode 11a of No. 1 and the end surface electrode 18a of the case 18 are fixed by soldering.

[0005]

However, in the composite electronic components 15 and 17 of the above-mentioned conventional example, the composite electronic component 15 is
With respect to the multilayer substrate 11, the mechanical strength was not improved against the bending stress in the short side direction of the multilayer substrate 11, and a sufficient reinforcing effect was not obtained. Furthermore, when the thickness of the multilayer substrate 11 changes, the height of the composite electronic component 15 also changes, so it was necessary to prepare various pedestals 16 according to the thickness of the multilayer substrate 11.

Further, the composite electronic component 17 is a multi-layer substrate 11
Since the bottom surface of the device is in close contact with the printed circuit board 14, electronic parts cannot be mounted and the mounting density is poor. Further, when the case 18 is attached to the multilayer substrate 11, if the attachment position of the case 18 is displaced, there is a risk that the pad electrode 11b on the surface of the multilayer substrate 11 and the end face electrode 18a of the case 18 are short-circuited.

The present invention has been made in order to solve such a problem, and a multi-layered board on which electronic parts are mounted is housed in a resin case containing a lead frame, which has high mechanical strength and is mounted. It is an object of the present invention to provide a composite electronic component having a high mounting density of the electronic component.

[0008]

In order to achieve the above object, in the present invention, a composite electronic component main body in which an electronic component is mounted on a multilayer substrate on which circuit elements or wiring patterns are formed, and the composite electronic component The multi-layer substrate of the composite electronic component main body includes a resin case having a main body housed inside and a step portion formed on the inner wall, and a lead frame having small protrusions attached to the side wall of the resin case, It is characterized in that it is fixed between the step portion and the small protrusion of the lead frame.

[0009]

According to the above structure, since the composite electronic component body is housed in the resin case, the mechanical strength is improved in both the short side direction and the long side direction, and the electronic components are mounted on the front and back surfaces of the multilayer substrate. be able to. Further, since the multilayer substrate of the composite electronic component body is fixed between the step portion of the resin case and the small protrusion of the lead frame, the mounting position of the composite electronic component body is stable.

[0010]

Embodiments of the composite electronic component according to the present invention will be described below with reference to FIGS. In FIG. 1, reference numeral 1 is a multilayer substrate formed by stacking ceramic substrates. A circuit element 1a such as a capacitor and a wiring pattern 1b made of copper are formed inside the multilayer substrate 1, and internal and external surfaces are formed on the front and back surfaces. The pad electrode 1c connected to the circuit element 1a and the wiring pattern 1b is formed, and the end face electrode 1d is formed on the side surface. The electronic component 2 is surface-mounted on the pad electrode 1c to form the composite electronic component body 3. The circuit element 1a, the wiring pattern 1b, and the pad electrode 1c are connected by a via hole 1e. The multilayer substrate 1 is not limited to a ceramic substrate in particular, and can be made of a resin substrate, a metal substrate, or the like.

Reference numeral 4 denotes a resin case. A plurality of metal lead frames 5 are attached to the side wall on the long side of the resin case 4 by insert molding or the like, and a step portion 4a is provided on the inner wall. A small protrusion 5a is formed in the middle of the lead frame 5 below the step 4a of the resin case 4 toward the inside of the resin case 4.
The lower tip is bent toward the outside of the resin case 4 to form an external electrode 5b.

Then, the composite electronic component body 3 is inserted into the resin case 4, the multi-layer substrate 1 is held between the step portion 4a of the resin case 4 and the small protrusion 5a of the lead frame 5, and the end surface of the multi-layer substrate 1 is held. The electrode 1d and the lead frame 5 are connected with solder to form a composite electronic component 6 as shown in FIG.

Since the composite electronic component 6 thus constructed has the composite electronic component main body 3 housed in the resin case 4, the mechanical strength is improved, and the electronic component 2 is formed on the front and back surfaces of the multilayer substrate 1. Can be mounted, so that the mounting density is improved. Furthermore, since the mounting position of the multilayer substrate 1 is stabilized by the step portion 4a of the resin case 4 and the small protrusions 5a of the lead frame 5, no short circuit failure occurs between the electrodes, and
By changing the positions of the step portion 4a of the resin case 4 and the small protrusions 5a of the lead frame 5, various composite electronic component main bodies 3 can be dealt with without changing the outer shape.

[0014]

As described above, according to the composite electronic component of the present invention, by housing the composite electronic component body in the resin case, the mechanical strength is improved and the mounting density of the electronic component is improved. improves. Further, since the mounting position of the multi-layer substrate is stable, short-circuit defects between the electrodes are eliminated, and further various composite electronic component bodies can be housed without changing the outer shape.

[Brief description of drawings]

FIG. 1 is a sectional view of a composite electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view of FIG.

FIG. 3 is a perspective view of a first conventional composite electronic component.

FIG. 4 is a perspective view of a second conventional composite electronic component.

FIG. 5 is a sectional view of a third conventional composite electronic component.

[Explanation of symbols]

 1 Multilayer Substrate 2 Electronic Component 3 Composite Electronic Component Main Body 4 Resin Case 4a Step 5 Lead Frame 5a Small Protrusion 6 Composite Electronic Component

Claims (1)

[Claims] 1. A composite electronic component body in which electronic components are mounted on a multilayer substrate having a circuit element or a wiring pattern formed thereon, and a resin case in which the composite electronic component body is housed inside and a step portion is formed on an inner wall, A lead frame having small protrusions attached to the side wall of the resin case, wherein the multilayer substrate of the composite electronic component body is fixed between the step portion of the resin case and the small protrusions of the lead frame. Composite electronic parts to be.