JP3164182B2 - Composite electronic components - Google Patents
Composite electronic componentsInfo
- Publication number
- JP3164182B2 JP3164182B2 JP23571293A JP23571293A JP3164182B2 JP 3164182 B2 JP3164182 B2 JP 3164182B2 JP 23571293 A JP23571293 A JP 23571293A JP 23571293 A JP23571293 A JP 23571293A JP 3164182 B2 JP3164182 B2 JP 3164182B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- ceramic substrate
- multilayer ceramic
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、多層セラミック基板
の表面にディスクリート部品を覆うキャップを設けた複
合電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component provided with a cap for covering a discrete component on the surface of a multilayer ceramic substrate.
【０００２】[0002]
【従来の技術】近年、電子機器では高密度実装のニーズ
が強く、例えばチップコンデンサなどでは小型化が進め
られ、最近では1.0mm×0.5mmのものも製造されている
が、実装時の取り扱いが難しく、コストも高いという欠
点がある。2. Description of the Related Art In recent years, there has been a strong need for high-density mounting in electronic devices. For example, miniaturization of chip capacitors and the like has been promoted, and recently 1.0 mm × 0.5 mm devices have been manufactured. It is difficult and expensive.
【０００３】高密度実装のもう一つの流れとして電子部
品の複合化があり、従来の複合電子部品としては、図６
（Ａ）に示すように、多層セラミック基板１の内部に
Ｌ．Ｃ．Ｒなどの受動部品を内蔵し、この基板１の表面
に、配線や大きな定数のＬ．Ｃ．Ｒなどの受動部品やダ
イオードやトランジスタなどの能動部品からなるディス
クリート部品２を取り付け、多層セラミック基板１の側
面に内部受動部品及びディスクリート部品２と導通する
側面電極３を設け、該基板１の表面にディスクリート部
品２を覆うキャップ４を取り付けた構造になっている。Another trend in high-density packaging is the integration of electronic components.
As shown in FIG. C. R and other passive components are built in, and wiring and large constant L.R. C. A discrete component 2 composed of passive components such as R and an active component such as a diode and a transistor is mounted, and a side surface electrode 3 that is electrically connected to the internal passive component and the discrete component 2 is provided on a side surface of the multilayer ceramic substrate 1. It has a structure in which a cap 4 that covers the discrete component 2 is attached.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記のよう
な複合部品をプリント基板に実装するには、図６（Ｂ）
のように、プリント基板５上に多層セラミック基板１を
重ね、側面電極３を配線６に半田付け７することによっ
て固定化されるため、プリント基板５が撓んだ場合、多
層セラミック基板１にストレスがかかり、側面電極３に
近い部分にクラックが発生し、複合電子部品の正常な動
作が得られなくなるという問題がある。By the way, in order to mount the above-described composite component on a printed circuit board, FIG.
As described above, the multilayer ceramic substrate 1 is placed on the printed circuit board 5 and fixed by soldering the side surface electrodes 3 to the wirings 6. This causes a crack in a portion close to the side electrode 3, which causes a problem that a normal operation of the composite electronic component cannot be obtained.
【０００５】また、クラックの発生を防止するため、多
層セラミック基板１の構成材料に強度の高いものを使用
することが考えられるが、材料に制約があり、コスト的
にも高くなって実用的でない。In order to prevent the occurrence of cracks, it is conceivable to use a high-strength material for the multilayer ceramic substrate 1. However, the material is restricted and the cost is high, which is not practical. .
【０００６】そこで、この発明の課題は、多層セラミッ
ク基板の材料を変えることなく、プリント基板が撓んで
もクラックの発生がない複合電子部品を提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a composite electronic component which does not cause cracks even when a printed board is bent without changing the material of the multilayer ceramic substrate.
【０００７】[0007]
【課題を解決するための手段】上記のような課題を解決
するため、この発明は、多層セラミック基板の表面にデ
ィスクリート部品を取り付け、多層セラミック基板の側
面にディスクリート部品と導通する側面電極を設け、多
層セラミック基板の表面側にディスクリート部品を覆う
キャップを取り付けた複合電子部品において、キャップ
の側面に、多層セラミック基板の側面電極と導通し、プ
リント基板に半田付けするための接続用電極を設けた構
成としたものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for mounting a discrete component on a surface of a multilayer ceramic substrate, and providing a side surface electrode conducting on the side surface of the multilayer ceramic substrate with the discrete component, In a composite electronic component in which a cap covering a discrete component is attached to the front side of a multilayer ceramic substrate, a configuration is provided in which a connection electrode for conducting to the side electrode of the multilayer ceramic substrate and soldering to a printed board is provided on a side surface of the cap. It is what it was.
【０００８】[0008]
【作用】キャップに接続用電極が設けてあるので、キャ
ップを下にしてプリント基板上に重ね、キャップに設け
た接続用電極を配線と半田付けして実装することがで
き、プリント基板が撓んでもキャップ上に位置する多層
セラミック基板にストレスが加わらず、多層セラミック
基板に割れの発生がない。Since the connection electrode is provided on the cap, the connection electrode provided on the cap can be mounted on the printed circuit board by soldering to the wiring, and the printed circuit board can be bent. However, no stress is applied to the multilayer ceramic substrate located on the cap, and no crack occurs in the multilayer ceramic substrate.
【０００９】[0009]
【実施例】以下、この発明の実施例を添付図面の図１乃
至図５に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.
【００１０】図示のように、複合電子部品１１は、内部
にＬ．Ｃ．Ｒなどの受動部品を単独あるいは混合で内蔵
した多層セラミック基板１２の表面に、配線や大きな定
数のＬ．Ｃ．Ｒなどの受動部品やダイオードやトランジ
スタなどの能動部品からなるディスクリート部品１３を
取り付け、この基板１２の側面に内部受動部品及びディ
スクリート部品１３と導通する側面電極１４を設け、多
層セラミック基板１２の表面側にディスクリート部品１
３を覆うキャップ１５を取り付け、このキャップ１５の
側面に前記側面電極１４を導通する接続用電極１６を設
けた構造になっている。As shown in the figure, the composite electronic component 11 has an L.P. C. R or a large constant L.R. on the surface of the multilayer ceramic substrate 12 in which passive components such as R.R. C. A discrete component 13 composed of passive components such as R and an active component such as a diode and a transistor is attached, and a side surface electrode 14 that is electrically connected to the internal passive component and the discrete component 13 is provided on a side surface of the substrate 12. Discrete parts 1
The cap 15 is attached to cover 3 and a connection electrode 16 for conducting the side electrode 14 is provided on a side surface of the cap 15.
【００１１】図１と図２に示す第１の実施例において、
上記キャップ１５は、樹脂製やセラミック製のもの、あ
るいは金属の表面に絶縁膜を形成したもの等が用いられ
る。例えばＡｌ2Ｏ3等の抗折強度の大きなものを用いる
のが好ましいと共に、図示の場合、多層セラミック基板
１２より小さく形成したが、該基板１２と同じ平面的な
大きさにしてもよい。In the first embodiment shown in FIGS. 1 and 2,
The cap 15 is made of resin or ceramic, or a metal having an insulating film formed on the surface. For example, it is preferable to use a material having a large bending strength such as Al 2 O 3 , and in the illustrated case, it is formed smaller than the multilayer ceramic substrate 12, but may be formed in the same planar size as the substrate 12.
【００１２】このキャップ１５は、多層セラミック基板
１２の表面に樹脂接着剤にて接着するほか、側面電極１
４と接続用電極１６の半田付けや導電ペーストによる電
気的接続と同時に固定化を行なってもよい。The cap 15 is bonded to the surface of the multilayer ceramic substrate 12 with a resin adhesive,
The fixing may be performed simultaneously with the soldering of the connection electrode 4 and the connection electrode 16 or the electrical connection by the conductive paste.
【００１３】第１の実施例の複合電子部品は上記のよう
な構成であり、多層セラミック基板１２の表面にキャッ
プ１５を取り付け、図１（Ｂ）のように、側面電極１４
と接続用電極１６を接続し、この複合電子部品をプリン
ト基板１７上に実装するには、図２（Ａ），（Ｂ）のよ
うにキャップ１５を下にしてプリント基板１７上に重
ね、配線１８と接続用電極１６を半田付け１９によって
接続固定する。The composite electronic component of the first embodiment has the above-described structure. A cap 15 is attached to the surface of a multilayer ceramic substrate 12 and, as shown in FIG.
In order to mount the composite electronic component on the printed circuit board 17 by connecting the composite electronic component to the printed circuit board 17, the cap 15 is placed on the printed circuit board 17 with the cap 15 down as shown in FIGS. The connection electrode 18 and the connection electrode 16 are connected and fixed by soldering 19.
【００１４】上記のように、下にしたキャップ１５をプ
リント基板１７に重ねて取り付けることにより、多層セ
ラミック基板１２はプリント基板１７に接触することが
なく、プリント基板１７に撓みが生じてもキャップ１５
がこれを吸収し、多層セラミック基板１２にストレスが
かからず、この基板１２にクラックが発生するのを有効
に防止することができる。As described above, by mounting the lower cap 15 on the printed circuit board 17 so that the multilayer ceramic substrate 12 does not contact the printed circuit board 17, even if the printed circuit board 17 is bent,
Absorbs this, so that stress is not applied to the multilayer ceramic substrate 12 and cracks can be effectively prevented from being generated in the substrate 12.
【００１５】なお、多層セラミック基板１２は、ディス
クリート部品１３を取り付けた表面を下向きに実装して
も特性への影響は全くない。The characteristics of the multilayer ceramic substrate 12 are not affected at all even if the surface on which the discrete component 13 is mounted is mounted downward.
【００１６】次に図３（Ａ），（Ｂ）に示す第２の実施
例は、キャップ１５を対向する側壁２１，２１と両側壁
２１，２１を両端部で結合する接続部２２，２２とで側
面コ字形のアーチ状に形成し、両側壁２１，２１の外面
に接続用電極１６を設けた構造になっている。Next, in a second embodiment shown in FIGS. 3A and 3B, the connecting portions 22 and 22 for connecting the side walls 21 and 21 and the side walls 21 and 21 at both ends with the cap 15 are provided. , And has a structure in which connection electrodes 16 are provided on the outer surfaces of both side walls 21 and 21.
【００１７】上記キャップ１５は、多層セラミック基板
１２の表面に接続部２２，２２側が重なるように重ね、
側面電極１４と接続用電極１６を半田付けによって電気
的，機械的に接続し、この複合電子部品をプリント基板
１７に実装するには、図３（Ｂ）に示すように、キャッ
プ１５を下にしてプリント基板１７上に重ね、配線１８
と接続用電極１６を半田付け１９によって固定化すれば
よく、プリント基板１７に撓みが生じても多層セラミッ
ク基板１２にストレスはかからない。The cap 15 is superimposed on the surface of the multilayer ceramic substrate 12 so that the connection portions 22 and 22 overlap.
In order to electrically and mechanically connect the side electrode 14 and the connection electrode 16 by soldering and mount the composite electronic component on the printed circuit board 17, as shown in FIG. Over the printed circuit board 17 and the wiring 18
The connection electrodes 16 may be fixed by soldering 19, and even if the printed board 17 is bent, no stress is applied to the multilayer ceramic substrate 12.
【００１８】図４（Ａ），（Ｂ）に示す第３の実施例
は、キャップ１５を対向する側壁２１，２１と水平壁２
３で断面コ字状に形成し、両側壁２１，２１の外面に接
続用電極１６を設けたものであり、図３（Ｂ）のよう
に、プリント基板１７上にキャップ１５を下にした状態
で実装している。In the third embodiment shown in FIGS. 4 (A) and 4 (B),
3, the connecting electrodes 16 are provided on the outer surfaces of both side walls 21 and 21, and the cap 15 is placed on the printed board 17 as shown in FIG. 3B. Implemented in.
【００１９】図５に示す第４の実施例は、第３の例と同
様のキャップ１５を用い、このキャップ１５の内部に多
層セラミック基板１２を収納し、キャップ１５の内面に
まで延長して設けた接続用電極１６と側面電極１４を接
続し、キャップ１５をプリント基板１７上に重ねて実装
するようにする。The fourth embodiment shown in FIG. 5 uses a cap 15 similar to that of the third embodiment, accommodates the multilayer ceramic substrate 12 inside the cap 15, and extends the cap to the inner surface of the cap 15. The connection electrode 16 and the side electrode 14 are connected to each other, and the cap 15 is mounted on the printed circuit board 17 in an overlapping manner.
【００２０】なお、何れの実施例においても、キャップ
１５の各接続用電極１６間の部分にスリットを入れたり
切り欠きを設け、キャップ１５の撓み強度を向上させる
ようにしてもよいと共に、第２乃至第４実施例のキャッ
プ１５においては、抗折強度が大きいセラミックを用
い、粉末プレス成形や切削、レーザ加工等によって製作
することができる。In any of the embodiments, a slit may be formed or a notch may be formed in a portion between the connection electrodes 16 of the cap 15 so as to improve the bending strength of the cap 15 and the second structure. The cap 15 of the fourth to fourth embodiments can be manufactured by powder press molding, cutting, laser processing, or the like, using a ceramic having high bending strength.
【００２１】[0021]
【発明の効果】以上のように、この発明によると、多層
セラミック基板の表面に取り付けたキャップの側面に接
続用電極を設けたので、プリント基板への実装時キャッ
プを下にしてプリント基板に取り付けることができ、プ
リント基板に撓みが発生しても多層セラミック基板にス
トレスがかからず、多層セラミック基板にクラックが入
るというようなことがなく、常に正常な動作が得られる
ことになる。As described above, according to the present invention, since the connection electrodes are provided on the side surfaces of the cap mounted on the surface of the multilayer ceramic substrate, the cap is mounted on the printed circuit board with the cap down when mounted on the printed circuit board. Therefore, even if the printed board is bent, no stress is applied to the multilayer ceramic substrate, cracks are not formed in the multilayer ceramic substrate, and normal operation can always be obtained.
【００２２】また、キャップをプリント基板に取り付け
るので、キャップに抗折強度の大きな材質を選択しやす
く、多層セラミック基板の撓み強度を２倍以上に高める
ことができる。Further, since the cap is attached to the printed circuit board, it is easy to select a material having high bending strength for the cap, and the bending strength of the multilayer ceramic substrate can be more than doubled.
【図面の簡単な説明】[Brief description of the drawings]
【図１】（Ａ）はこの発明に係る複合電子部品の第１の
実施例を示す分解斜視図、（Ｂ）は同上の組立状態を示
す斜視図。FIG. 1A is an exploded perspective view showing a first embodiment of a composite electronic component according to the present invention, and FIG. 1B is a perspective view showing an assembled state of the same.
【図２】（Ａ）は同上のプリント基板への実装時の状態
を示す斜視図、（Ｂ）はプリント基板への実装状態を示
す縦断正面図。FIG. 2A is a perspective view showing a state of mounting on a printed circuit board, and FIG. 2B is a longitudinal sectional front view showing a state of mounting on a printed circuit board.
【図３】（Ａ）は第２の実施例を示す分解斜視図、
（Ｂ）は同上のプリント基板への実装状態を示す縦断正
面図。FIG. 3A is an exploded perspective view showing a second embodiment,
(B) is a vertical sectional front view showing the state of mounting on a printed circuit board.
【図４】（Ａ）は第３の実施例を示す分解斜視図、
（Ｂ）は同上のプリント基板への実装状態を示す縦断正
面図。FIG. 4A is an exploded perspective view showing a third embodiment,
(B) is a vertical sectional front view showing the state of mounting on a printed circuit board.
【図５】第４の実施例を示すプリント基板への実装状態
の縦断正面図。FIG. 5 is a longitudinal sectional front view showing a state of being mounted on a printed circuit board according to a fourth embodiment.
【図６】（Ａ）は従来の複合電子部品を示す分解斜視
図、（Ｂ）はプリント基板への実装状態を示す縦断正面
図。FIG. 6A is an exploded perspective view showing a conventional composite electronic component, and FIG. 6B is a longitudinal sectional front view showing a mounted state on a printed circuit board.
１１ 複合電子部品 １２ 多層セラミック基板 １３ ディスクリート部品 １４ 側面電極 １５ キャップ １６ 接続用電極 DESCRIPTION OF SYMBOLS 11 Composite electronic component 12 Multilayer ceramic substrate 13 Discrete component 14 Side electrode 15 Cap 16 Connection electrode
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−182845（ＪＰ，Ａ) 特開 昭63−188961（ＪＰ，Ａ) 特開 平５−206308（ＪＰ，Ａ) 実開 昭60−52670（ＪＰ，Ｕ) 実開 平３−12525（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/04 H05K 1/14 H05K 1/18 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-182845 (JP, A) JP-A-63-188961 (JP, A) JP-A-5-206308 (JP, A) 52670 (JP, U) Hikaru 3-12525 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 23/04 H05K 1/14 H05K 1/18
Claims (1)
ート部品を取り付け、多層セラミック基板の側面にディ
スクリート部品と導通する側面電極を設け、多層セラミ
ック基板の表面側にディスクリート部品を覆うキャップ
を取り付けた複合電子部品において、キャップの側面
に、多層セラミック基板の側面電極と導通し、プリント
基板に半田付けするための接続用電極を設けたことを特
徴とする複合電子部品。A composite electronic component in which a discrete component is mounted on a surface of a multilayer ceramic substrate, a side electrode that conducts with the discrete component is provided on a side surface of the multilayer ceramic substrate, and a cap that covers the discrete component is mounted on a surface side of the multilayer ceramic substrate. 3. The composite electronic component according to claim 1, wherein a connection electrode is provided on a side surface of the cap, the connection electrode being electrically connected to a side electrode of the multilayer ceramic substrate and soldered to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23571293A JP3164182B2 (en) | 1993-08-27 | 1993-08-27 | Composite electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23571293A JP3164182B2 (en) | 1993-08-27 | 1993-08-27 | Composite electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0766313A JPH0766313A (en) | 1995-03-10 |
| JP3164182B2 true JP3164182B2 (en) | 2001-05-08 |
Family
ID=16990119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23571293A Expired - Fee Related JP3164182B2 (en) | 1993-08-27 | 1993-08-27 | Composite electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3164182B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1542272B1 (en) * | 2003-10-06 | 2016-07-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2006120736A (en) * | 2004-10-19 | 2006-05-11 | Japan Radio Co Ltd | Cavity type electronic component module, its manufacturing method, and its mounting method |
| CN102356703B (en) | 2009-03-19 | 2015-05-13 | 株式会社村田制作所 | Circuit board and mother laminated body |
| WO2010146668A1 (en) * | 2009-06-17 | 2010-12-23 | 株式会社村田製作所 | Incinerator |
-
1993
- 1993-08-27 JP JP23571293A patent/JP3164182B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0766313A (en) | 1995-03-10 |
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