JP3164182B2 - Composite electronic component - Google Patents

Composite electronic component

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Publication number
JP3164182B2
JP3164182B2 JP23571293A JP23571293A JP3164182B2 JP 3164182 B2 JP3164182 B2 JP 3164182B2 JP 23571293 A JP23571293 A JP 23571293A JP 23571293 A JP23571293 A JP 23571293A JP 3164182 B2 JP3164182 B2 JP 3164182B2
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JP
Japan
Prior art keywords
ceramic substrate
cap
multilayer ceramic
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23571293A
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Japanese (ja)
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JPH0766313A (en
Inventor
登 加藤
博志 松井
治文 萬代
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP23571293A priority Critical patent/JP3164182B2/en
Publication of JPH0766313A publication Critical patent/JPH0766313A/en
Application granted granted Critical
Publication of JP3164182B2 publication Critical patent/JP3164182B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/041Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】この発明は、多層セラミック基板の表面にディスクリート部品を覆うキャップを設けた複合電子部品に関する。 - FIELD OF THE INVENTION The present invention is a composite electronic component in which a capping covering the discrete component in the surface of the multilayer ceramic substrates.

【0002】 [0002]

【従来の技術】近年、電子機器では高密度実装のニーズが強く、例えばチップコンデンサなどでは小型化が進められ、最近では1.0mm×0.5mmのものも製造されているが、実装時の取り扱いが難しく、コストも高いという欠点がある。 In recent years, strong demand for high-density mounting in electronic equipment, for example, miniaturization is advanced in a chip capacitors have been produced also those 1.0 mm × 0.5 mm recently, the handling during mounting difficult, cost also has the disadvantage that high.

【0003】高密度実装のもう一つの流れとして電子部品の複合化があり、従来の複合電子部品としては、図6 [0003] There are composite electronic component as another stream of high-density mounting, a conventional composite electronic component, FIG. 6
(A)に示すように、多層セラミック基板1の内部にL. As shown in (A), L. inside of the multilayer ceramic substrate 1 C. C. Rなどの受動部品を内蔵し、この基板1の表面に、配線や大きな定数のL. A built-in passive components such as R, on the surface of the substrate 1, L. wiring and large constant C. C. Rなどの受動部品やダイオードやトランジスタなどの能動部品からなるディスクリート部品2を取り付け、多層セラミック基板1の側面に内部受動部品及びディスクリート部品2と導通する側面電極3を設け、該基板1の表面にディスクリート部品2を覆うキャップ4を取り付けた構造になっている。 Mounting discrete components 2 made of active components such as passive components and diodes and transistors such as R, the provided side electrodes 3 to be electrically connected to the internal passive components and discrete components 2 on the side surface of the multilayer ceramic substrate 1, the surface of the substrate 1 discrete cover part 2 has a mounting structure cap 4.

【0004】 [0004]

【発明が解決しようとする課題】ところで、上記のような複合部品をプリント基板に実装するには、図6(B) [0007] Meanwhile, to implement the composite part as described above to the printed circuit board, FIG. 6 (B)
のように、プリント基板5上に多層セラミック基板1を重ね、側面電極3を配線6に半田付け7することによって固定化されるため、プリント基板5が撓んだ場合、多層セラミック基板1にストレスがかかり、側面電極3に近い部分にクラックが発生し、複合電子部品の正常な動作が得られなくなるという問題がある。 As such, repeated multi-layer ceramic substrate 1 on the printed circuit board 5, to be fixed by soldering 7 side electrodes 3 to the wiring 6, if the printed circuit board 5 is bent, the stress in the multilayer ceramic substrate 1 consuming, cracks are generated in the portion close to the side electrode 3, there is a problem that the normal operation of the composite electronic component can not be obtained.

【0005】また、クラックの発生を防止するため、多層セラミック基板1の構成材料に強度の高いものを使用することが考えられるが、材料に制約があり、コスト的にも高くなって実用的でない。 Further, in order to prevent the occurrence of cracks, it is conceivable to use a high strength to the material of the multilayer ceramic substrate 1, there are restrictions on the material, impractical higher in cost .

【0006】そこで、この発明の課題は、多層セラミック基板の材料を変えることなく、プリント基板が撓んでもクラックの発生がない複合電子部品を提供することにある。 [0006] Accordingly, an object of the present invention is to provide a multi-layer without changing the ceramic substrate material, a composite electronic component also no occurrence of cracks is bent printed circuit board.

【0007】 [0007]

【課題を解決するための手段】上記のような課題を解決するため、この発明は、多層セラミック基板の表面にディスクリート部品を取り付け、多層セラミック基板の側面にディスクリート部品と導通する側面電極を設け、多層セラミック基板の表面側にディスクリート部品を覆うキャップを取り付けた複合電子部品において、キャップの側面に、多層セラミック基板の側面電極と導通し、プリント基板に半田付けするための接続用電極を設けた構成としたものである。 Means for Solving the Problems] To solve the above problems, the present invention is mounted discrete components on the surface of the multilayer ceramic substrate, provided with a side electrode conducting with discrete components on the side surface of the multilayer ceramic substrate, in complex electronic device fitted with a cap that covers the discrete components on the surface side of the multilayer ceramic substrate, the sides of the cap, and electrically connected to the side electrodes of the multilayer ceramic substrate, provided with connecting electrodes for soldering to a printed circuit board configuration it is obtained by the.

【0008】 [0008]

【作用】キャップに接続用電極が設けてあるので、キャップを下にしてプリント基板上に重ね、キャップに設けた接続用電極を配線と半田付けして実装することができ、プリント基板が撓んでもキャップ上に位置する多層セラミック基板にストレスが加わらず、多層セラミック基板に割れの発生がない。 [Action] Since connecting electrodes to the cap is provided, overlapping on the printed circuit board of the cap facing down, the connection electrodes provided on the cap can be implemented by wiring and soldering, the printed circuit board is bent But stress is not applied to the multilayer ceramic substrate positioned on the cap, there is no occurrence of cracks in the multilayer ceramic substrate.

【0009】 [0009]

【実施例】以下、この発明の実施例を添付図面の図1乃至図5に基づいて説明する。 BRIEF DESCRIPTION based on FIGS. 1 to 5 of the embodiment of the present invention accompanying drawings.

【0010】図示のように、複合電子部品11は、内部にL. [0010] As shown, the composite electronic component 11, L. therein C. C. Rなどの受動部品を単独あるいは混合で内蔵した多層セラミック基板12の表面に、配線や大きな定数のL. On the surface of the multilayer ceramic substrate 12 having a built-in passive components such as R alone or in a mixture, L. wiring and large constant C. C. Rなどの受動部品やダイオードやトランジスタなどの能動部品からなるディスクリート部品13を取り付け、この基板12の側面に内部受動部品及びディスクリート部品13と導通する側面電極14を設け、多層セラミック基板12の表面側にディスクリート部品1 Mounting discrete parts 13 consisting of an active component such as a passive component, a diode or transistor, such as R, the side electrodes 14 which conduct the internal passive components and discrete component 13 on the side surface of the substrate 12 is provided, the surface side of the multilayer ceramic substrate 12 to discrete components 1
3を覆うキャップ15を取り付け、このキャップ15の側面に前記側面電極14を導通する接続用電極16を設けた構造になっている。 3 fitted with a cap 15 for covering the has a structure in which a connecting electrode 16 to conduct the side electrode 14 on the side surface of the cap 15.

【0011】図1と図2に示す第1の実施例において、 [0011] In the first embodiment shown in FIGS. 1 and 2,
上記キャップ15は、樹脂製やセラミック製のもの、あるいは金属の表面に絶縁膜を形成したもの等が用いられる。 The cap 15 is of a resin or ceramic, or those with an insulating film on the surface of a metal or the like is used. 例えばAl 23等の抗折強度の大きなものを用いるのが好ましいと共に、図示の場合、多層セラミック基板12より小さく形成したが、該基板12と同じ平面的な大きさにしてもよい。 Al 2 O 3, for example large with preferable to use a flexural strength such as, in the illustrated case has been smaller than the multilayer ceramic substrate 12, may be the same planar size as the substrate 12.

【0012】このキャップ15は、多層セラミック基板12の表面に樹脂接着剤にて接着するほか、側面電極1 [0012] The cap 15, in addition to adhering to the surface of the multilayer ceramic substrate 12 with a resin adhesive, the side electrode 1
4と接続用電極16の半田付けや導電ペーストによる電気的接続と同時に固定化を行なってもよい。 4 and may be performed immobilized at the same time as the electrical connection by soldering or a conductive paste connecting electrode 16.

【0013】第1の実施例の複合電子部品は上記のような構成であり、多層セラミック基板12の表面にキャップ15を取り付け、図1(B)のように、側面電極14 [0013] composite electronic component of the first embodiment is configured as described above, the cap 15 attached to the surface of the multilayer ceramic substrate 12, as shown in FIG. 1 (B), the side surface electrodes 14
と接続用電極16を接続し、この複合電子部品をプリント基板17上に実装するには、図2(A),(B)のようにキャップ15を下にしてプリント基板17上に重ね、配線18と接続用電極16を半田付け19によって接続固定する。 Connect the connection electrode 16 and, this implement complex electronic components on a printed circuit board 17, FIG. 2 (A), the overlying printed board 17 of the cap 15 and the bottom as (B), wirings 18 and connected and fixed to the connection electrode 16 by soldering 19.

【0014】上記のように、下にしたキャップ15をプリント基板17に重ねて取り付けることにより、多層セラミック基板12はプリント基板17に接触することがなく、プリント基板17に撓みが生じてもキャップ15 [0014] As described above, by installing overlapping cap 15 down on the printed circuit board 17, the multilayer ceramic substrate 12 without contacting the printed circuit board 17, the cap 15 even if bending the printed circuit board 17
がこれを吸収し、多層セラミック基板12にストレスがかからず、この基板12にクラックが発生するのを有効に防止することができる。 There absorb this, not applied stress in the multilayer ceramic substrate 12, a crack in the substrate 12 can be effectively prevented.

【0015】なお、多層セラミック基板12は、ディスクリート部品13を取り付けた表面を下向きに実装しても特性への影響は全くない。 [0015] Incidentally, the multilayer ceramic substrate 12, no influence on the characteristics and mounted on the downward surface mounted discrete components 13.

【0016】次に図3(A),(B)に示す第2の実施例は、キャップ15を対向する側壁21,21と両側壁21,21を両端部で結合する接続部22,22とで側面コ字形のアーチ状に形成し、両側壁21,21の外面に接続用電極16を設けた構造になっている。 [0016] Next FIG. 3 (A), the second embodiment shown in (B) includes a connecting portion 22 for coupling the side walls 21, 21 and side walls 21, 21 facing the cap 15 at both ends in forming an arch-shaped side U-shaped, it has a structure in which a connection electrode 16 on the outer surface of the side walls 21, 21.

【0017】上記キャップ15は、多層セラミック基板12の表面に接続部22,22側が重なるように重ね、 [0017] The cap 15 is overlaid so that the connection portions 22 and 22 side overlaps the surface of the multilayer ceramic substrate 12,
側面電極14と接続用電極16を半田付けによって電気的,機械的に接続し、この複合電子部品をプリント基板17に実装するには、図3(B)に示すように、キャップ15を下にしてプリント基板17上に重ね、配線18 Electrical, mechanically connected to the side electrode 14 the connecting electrode 16 by soldering, this implement composite electronic component to the printed circuit board 17, as shown in FIG. 3 (B), the cap 15 down superimposed over the printed circuit board 17 Te, wiring 18
と接続用電極16を半田付け19によって固定化すればよく、プリント基板17に撓みが生じても多層セラミック基板12にストレスはかからない。 The connection electrode 16 be fixed by soldering 19 as well, the stress is not applied to the multilayer ceramic substrate 12 even if bending the printed circuit board 17.

【0018】図4(A),(B)に示す第3の実施例は、キャップ15を対向する側壁21,21と水平壁2 [0018] FIG. 4 (A), the third embodiment shown in (B) is a side wall 21, 21 and horizontal wall 2 facing the cap 15
3で断面コ字状に形成し、両側壁21,21の外面に接続用電極16を設けたものであり、図3(B)のように、プリント基板17上にキャップ15を下にした状態で実装している。 Condition 3 is U-shaped cross section, which has a connection electrode 16 provided on the outer surface of the side walls 21 and 21, which is under way, the cap 15 on the printed circuit board 17 shown in FIG. 3 (B) in implements.

【0019】図5に示す第4の実施例は、第3の例と同様のキャップ15を用い、このキャップ15の内部に多層セラミック基板12を収納し、キャップ15の内面にまで延長して設けた接続用電極16と側面電極14を接続し、キャップ15をプリント基板17上に重ねて実装するようにする。 The fourth embodiment shown in FIG. 5, using the third embodiment similar to the cap 15, housing the multilayer ceramic substrate 12 inside the caps 15, provided extending to the inner surface of the cap 15 connect the connection electrodes 16 and the side electrode 14, so as to implement overlapping the cap 15 on the printed circuit board 17.

【0020】なお、何れの実施例においても、キャップ15の各接続用電極16間の部分にスリットを入れたり切り欠きを設け、キャップ15の撓み強度を向上させるようにしてもよいと共に、第2乃至第4実施例のキャップ15においては、抗折強度が大きいセラミックを用い、粉末プレス成形や切削、レーザ加工等によって製作することができる。 [0020] In any embodiment, a cutout or a slit provided in a portion between the respective connecting electrodes 16 of the cap 15, with may be to improve the bending strength of the cap 15, the second or in the cap 15 of the fourth embodiment, a ceramic bending strength is large, the powder press forming or cutting may be made by laser processing.

【0021】 [0021]

【発明の効果】以上のように、この発明によると、多層セラミック基板の表面に取り付けたキャップの側面に接続用電極を設けたので、プリント基板への実装時キャップを下にしてプリント基板に取り付けることができ、プリント基板に撓みが発生しても多層セラミック基板にストレスがかからず、多層セラミック基板にクラックが入るというようなことがなく、常に正常な動作が得られることになる。 As is evident from the foregoing description, according to the present invention, you are provided with the connecting electrodes on the side surface of the cap attached to the surface of the multilayer ceramic substrate, mounting on printed circuit board during mounting cap to the printed circuit board in the lower it can not apply stress to the multilayer ceramic substrate even deflection occurs in the printed circuit board, without such that cracks in the multilayer ceramic substrate enters, always be normal operation is obtained.

【0022】また、キャップをプリント基板に取り付けるので、キャップに抗折強度の大きな材質を選択しやすく、多層セラミック基板の撓み強度を2倍以上に高めることができる。 Further, since attaching the cap on the printed circuit board, easily select a large material of bending strength to the cap, it can increase the deflection strength of the multilayer ceramic substrate at least twice.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】(A)はこの発明に係る複合電子部品の第1の実施例を示す分解斜視図、(B)は同上の組立状態を示す斜視図。 1 (A) is an exploded perspective view showing a first embodiment of a composite electronic component according to the present invention, (B) is a perspective view showing an assembled state of the same.

【図2】(A)は同上のプリント基板への実装時の状態を示す斜視図、(B)はプリント基板への実装状態を示す縦断正面図。 Figure 2 (A) is a perspective view showing a state at the time of mounting to a printed circuit board of the same, (B) is a longitudinal sectional front view showing a mounting state of a printed circuit board.

【図3】(A)は第2の実施例を示す分解斜視図、 3 (A) is an exploded perspective view showing a second embodiment,
(B)は同上のプリント基板への実装状態を示す縦断正面図。 (B) is a longitudinal sectional front view showing a mounting state of the printed circuit board of the same.

【図4】(A)は第3の実施例を示す分解斜視図、 [4] (A) is an exploded perspective view showing a third embodiment,
(B)は同上のプリント基板への実装状態を示す縦断正面図。 (B) is a longitudinal sectional front view showing a mounting state of the printed circuit board of the same.

【図5】第4の実施例を示すプリント基板への実装状態の縦断正面図。 Figure 5 is a longitudinal front view of a mounting state of a printed circuit board showing a fourth embodiment.

【図6】(A)は従来の複合電子部品を示す分解斜視図、(B)はプリント基板への実装状態を示す縦断正面図。 FIG. 6 (A) is an exploded perspective view showing a conventional composite electronic component, (B) is a longitudinal sectional front view showing a mounting state of a printed circuit board.

【符号の説明】 DESCRIPTION OF SYMBOLS

11 複合電子部品 12 多層セラミック基板 13 ディスクリート部品 14 側面電極 15 キャップ 16 接続用電極 11 composite electronic component 12 multilayer ceramic substrate 13 discrete components 14 side electrode 15 cap 16 connecting electrodes

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−182845(JP,A) 特開 昭63−188961(JP,A) 特開 平5−206308(JP,A) 実開 昭60−52670(JP,U) 実開 平3−12525(JP,U) (58)調査した分野(Int.Cl. 7 ,DB名) H01L 23/04 H05K 1/14 H05K 1/18 ────────────────────────────────────────────────── ─── of the front page continued (56) reference Patent Sho 63-182845 (JP, a) JP Akira 63-188961 (JP, a) JP flat 5-206308 (JP, a) JitsuHiraku Akira 60- 52670 (JP, U) JitsuHiraku flat 3-12525 (JP, U) (58 ) investigated the field (Int.Cl. 7, DB name) H01L 23/04 H05K 1/14 H05K 1/18

Claims (1)

    (57)【特許請求の範囲】 (57) [the claims]
  1. 【請求項1】 多層セラミック基板の表面にディスクリート部品を取り付け、多層セラミック基板の側面にディスクリート部品と導通する側面電極を設け、多層セラミック基板の表面側にディスクリート部品を覆うキャップを取り付けた複合電子部品において、キャップの側面に、多層セラミック基板の側面電極と導通し、プリント基板に半田付けするための接続用電極を設けたことを特徴とする複合電子部品。 1. A mounting discrete components on the surface of the multilayer ceramic substrate, a side electrode conducting with discrete components on the side surface of the multilayer ceramic substrate provided, complex electronic device fitted with a cap that covers the discrete components on the surface side of the multilayer ceramic substrate in the composite electronic component on a side surface of the cap, in conduction with the side electrodes of the multilayer ceramic substrate, characterized by providing the connection electrode for soldering to the printed circuit board.
JP23571293A 1993-08-27 1993-08-27 Composite electronic component Expired - Fee Related JP3164182B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23571293A JP3164182B2 (en) 1993-08-27 1993-08-27 Composite electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23571293A JP3164182B2 (en) 1993-08-27 1993-08-27 Composite electronic component

Publications (2)

Publication Number Publication Date
JPH0766313A JPH0766313A (en) 1995-03-10
JP3164182B2 true JP3164182B2 (en) 2001-05-08

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Family Applications (1)

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JP23571293A Expired - Fee Related JP3164182B2 (en) 1993-08-27 1993-08-27 Composite electronic component

Country Status (1)

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JP (1) JP3164182B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1542272B1 (en) 2003-10-06 2016-07-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2006120736A (en) * 2004-10-19 2006-05-11 Japan Radio Co Ltd Cavity type electronic component module, its manufacturing method, and its mounting method
WO2010106839A1 (en) 2009-03-19 2010-09-23 株式会社村田製作所 Circuit board and mother laminated body

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Publication number Publication date
JPH0766313A (en) 1995-03-10

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