JP2977049B2 - Electronic functional circuit device for surface mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic functional circuit device used for a communication device, an electronic device, etc. and integrating a part of the electronic circuit as a functional circuit.

[0002]

2. Description of the Related Art As the size of electronic devices has been reduced, the degree of integration of internal electronic circuits has been increased, and various efforts have been made.
FIG. 2 is a structural example diagram of a conventional electronic functional circuit device,
(A) is a longitudinal sectional view, and (B) is a perspective view showing an example of an internal structure with a case 5 removed. In the figure, 1 is a semiconductor mounted component, 2 is a resistor / capacitor composite component, and 12 is a square chip component. The circuit board 3 on which these are mounted is mounted on a metal base 4 having glass hermetic pins for external connection, and hermetically sealed by a metal case 5.

FIG. 3 is a structural example showing the details of the semiconductor mounted component 1 of FIG. 2, (A) is a longitudinal sectional view, and (B) is a perspective view showing the internal structure with the cap 7 removed. is there.
In the figure, reference numeral 6 denotes a closed bottomed box-shaped ceramic multilayer substrate having a concave central longitudinal section, and a semiconductor bare chip 14 is wire-bonded to the inner bottom surface thereof by a thin wire 15 of gold or aluminum. Reference numeral 8 denotes a metal frame, which is brazed to the peripheral top of the ceramic multilayer substrate 6 with a brazing agent 9 such as silver brazing. Reference numeral 7 denotes a metal cap, which is joined to the upper surface of the metal frame 8 by resistance welding or the like to form an internal space. The semiconductor bare chip 14 is hermetically sealed by the internal space formed in this way to protect its fine wires and protect the environment. A black thick line portion on the periphery of the ceramic substrate 6 shown in (A) is a wiring conductor portion, and both side portions on the bottom surface are electrodes for surface mounting on the circuit board 3 in FIG. FIGS. 4A and 4B are structural example views showing details of the resistance / capacitor composite component 2 of FIG. 2, in which FIG. 4A is a longitudinal sectional view and FIG. In the drawing, 10 is a multilayer ceramic capacitor, 11 is a printed resistor provided on the upper surface thereof, and 13 is an over-glass for protecting the resistor 11 and its conductor wiring. The bold line portions of the multilayer ceramic capacitor 10 in (A) show the electrode and conductor wiring portions of the capacitors in each layer. Both ends of the bottom surface become electrodes when surface-mounted on the circuit board 3 of FIG.

[0004]

However, such a conventional structure has the following problems. (A) Since the semiconductor mounting component 1, the resistor / capacitor composite component 2 and the other rectangular chip components 12 are once surface-mounted on the circuit board 3 and then packaged on the metal base 4 by the mounting case 5, the number of component parts is small There are many limitations in miniaturization and cost reduction. (B) A semiconductor bare chip is mounted on a ceramic or mold package for surface mounting, assembled with other components, and hermetically sealed once again, so that a double packaging configuration is obtained, and materials and processing costs for the packaging are required. Not only takes time, but also takes time to assemble. An object of the present invention is to provide an electronic functional circuit device for surface mounting which solves the above-mentioned problems and reduces the number of assembly steps and the number of components.

[0005]

According to the present invention, there is provided an electronic functional circuit device for surface mounting, comprising: a multilayer ceramic capacitor having capacitor electrodes of each layer connected by side conductors and having a flat top and bottom; At least one semiconductor chip mounted on the conductor electrode;
A metal frame attached to the upper surface of the multilayer ceramic capacitor to provide a space for protecting the semiconductor chip; and a metal cap bonded to the upper surface of the frame to seal the space. At least one printed resistor provided on the bottom surface of the multilayer ceramic capacitor, over-glass coated to protect the printed resistor, the multilayer ceramic capacitor, the semiconductor chip, and the printed resistor. And a wiring conductor provided on the surface of the multilayer ceramic capacitor so as to provide a predetermined circuit connection.
Hereinafter, the present invention will be described in detail with reference to the drawings.

[0006]

FIG. 1 is a structural view showing an embodiment of the present invention.
(A) shows a longitudinal cross-sectional view, and (B) is a perspective view showing an appearance. In the figure, reference numeral 10 denotes a multilayer ceramic capacitor forming a plurality of, for example, about 16 capacitor networks, 14 denotes a semiconductor bare chip, 15 denotes a thin wire, 9 denotes a brazing agent, 8 denotes a metal frame such as Kovar, 7 denotes a metal cap,
1 print resistor of a plurality of R _u O thick film of, for example, about 16, 13 is over the glass. A thick line portion of the cross section and the peripheral portion of the multilayer capacitor 10 shown in FIG. 1A shows a capacitor electrode and a wiring conductor portion, and a side portion 16 thereof is a connection wiring of the capacitor electrode of each laminated layer and a connection electrode to an external circuit. is there. Although the embodiment of FIG. 1 shows an example of one semiconductor bare chip, a plurality of semiconductor bare chips or flip chip semiconductors are mounted. As in the above configuration example, the configuration of the present invention is achieved by directly mounting and sealing at least one semiconductor bare chip or flip chip 14 on the upper surface of the multilayer ceramic capacitor 10 and providing the printed resistor 13 on the bottom surface. The double sealing of the semiconductor chip can be avoided, and another chip component can be directly mounted on the multilayer capacitor. Therefore, a conventional circuit board, a metal base and a metal case that house the entire circuit board are not required, and a process of assembling them is not required. further,
The entire device can be surface-mounted on a substrate of an electronic device.

[0007]

As described above in detail, by implementing the present invention, it is possible to reduce the size and cost of the electronic device while having the same functions as the conventional functional circuit device. This can greatly contribute to lower prices.

[Brief description of the drawings]

FIG. 1 is a structural diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing an example of a conventional structure.

FIG. 3 is a structural example diagram of a conventional semiconductor mounting component.

FIG. 4 is a structural example diagram of a conventional resistance / capacitor composite part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor mounting component 2 Resistive capacitor composite component 3 Circuit board 4 Metal base 5 Metal case 6 Ceramic multilayer substrate 7 Metal cap 8 Metal frame 9 Wax 10 Multilayer ceramic capacitor 11 Resistor 12 Square chip component 13 Over glass 14 Semiconductor chip 15 Fine wire 16 Side electrode

Continuation of the front page (56) References JP-A-58-225627 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/12

Claims (1)

(57) [Claims] 1. A multilayer ceramic capacitor in which capacitor electrodes of each layer are connected by side conductors and whose top and bottom surfaces are flat, at least one semiconductor chip attached to the conductor electrode on the top surface of the multilayer ceramic capacitor, and the semiconductor chip A metal frame attached to the upper surface of the multilayer ceramic capacitor to provide a space for protecting the multilayer ceramic capacitor; a metal cap joined to the upper surface of the frame to seal the space; At least one printed resistor provided on the bottom surface of the ceramic capacitor; an over-glass coated to protect the printed resistor; and the multilayer ceramic capacitor, the semiconductor chip, and the printed resistor being a predetermined one A wiring conductor provided on the surface of the multilayer ceramic capacitor so as to form a circuit connection; Electronic functional circuit device for surface mounting, comprising: