JPH0457357A - Integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce the width of an integrated circuit device so as to reduce the occupied area of the device by mounting such electric circuit elements as a semiconductor element, chip parts, etc., on the circuit device by utilizing an outer lead section. CONSTITUTION:The outer lead section 2 of the title integrated circuit device is formed to have a wiring pattern-like shape and electric circuit elements, such as semiconductor elements, a chip component, etc., are mounted on the section 2 and are airtightly sealed after they are electrically connected. Therefore, a highly miniaturized integrated circuit device which has a narrow width, reduced occupied area, and simple constitution and does not require any connecting space can be realized at a low cost since the electric circuit elements, such as the semiconductor element 6, chip component 9, etc., can be mounted on the outer lead section 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an ultra-small integrated circuit device that can be mounted in a minute part such as the tip of an electronic endoscope.

[Conventional technology]

Conventionally, electric circuit elements such as semiconductor elements have been hermetically sealed in packages using various methods for the purpose of protecting the chip, mounting it on a wiring board, etc. FIG. 58 is a cross-sectional view showing an example of this, in which a semiconductor element 102 and a passive chip component 103 are attached to a substrate 101 and bonded onto a metal frame 104.
After lead bonding is performed between the external leads 105 and the substrate 101, the integrated circuit device is hermetically sealed with a resin mold 106.

Also, as shown in Figure 5 (old), the ceramic package 1
After bonding the semiconductor element 111 to the ceramic package 10 and connecting it to the wiring part of the ceramic package 110 with a bonding wire 112, a glass plate 113 is placed and sealed with resin 114.
A structure has been proposed in which a substrate 116 on which an electric circuit element such as a semiconductor element is previously mounted and sealed is connected to an external lead 115 provided on the lower surface of the ceramic package 110 through a soldered part 117.

[Problem B to be solved by the invention] However, in the configuration shown in the fifth diagram, the substrate 1
Since the semiconductor element 102 and the chip component 103 are mounted on the integrated circuit device 01, the radiation W of the integrated circuit device becomes large and the area becomes large. It is difficult.

On the other hand, although the configuration shown in Fig. 5) has a smaller width W and can reduce the area, it requires space for connection between the external leads 115 of the ceramic package 110 and the substrate 116. There is a limit to miniaturization, and if the connection space is made smaller, the problem arises that connection becomes difficult, increases the number of man-hours, and reduces productivity.

The present invention has been made to solve the above-mentioned problems of conventional integrated circuit devices, and is an ultra-compact integrated circuit that reduces the area, does not require space for connections, has a simple configuration, and is low-cost. The purpose is to provide a circuit device.

[Means and effects for solving the problems] In order to solve the above-mentioned problems, the present invention provides an integrated circuit device in which a semiconductor element is mounted on a pan cage provided with an external lead portion, in which the external lead portion is shaped like a wiring pattern. An electric circuit element such as a semiconductor element or a chip component is mounted on the external lead portion, electrically connected, and hermetically sealed.

With this configuration, electrical circuit elements such as semiconductor elements and chip components are mounted on the external lead part, so the width and area of the integrated circuit device can be reduced, and the external Since the board is not connected to the lead portion, no space for connection is required, and an ultra-small integrated circuit device with a simple configuration can be realized at low cost.

[Example] Next, an example will be described. FIG. 1 is a sectional view showing a first embodiment of an integrated circuit device according to the present invention. 1
is a package made of ceramic or the like with an external lead part 2 connected to the side surface, and the external lead part 2 is formed in the shape of a wiring pattern, as shown in Figure 1 (old), and a common connection part 2a is provided at the tip. It is being A semiconductor element 3 is bonded to the pan cage 1 using eutectic, resin paste solder, etc.
Next, the semiconductor element 3 and the wiring part of the package 1 are connected by bonding wires 4 made of Au, AI, etc.
The cap 5 is bonded to the package 1 using low melting point glass or resin, and the semiconductor element 3 is sealed within the package 1. Next, a semiconductor element 6 is die-bonded to the external lead part 2 of the package 1, connected with bonding wires 7, sealed with resin 8, and further chip parts 9 such as resistors and capacitors are attached.
It is equipped with. And the common connection part 2 at the end of the external lead part 2
A is cut and removed to complete the integrated circuit device.

In the integrated circuit device configured in this way, the semiconductor element 6 and the chip component 9 are directly mounted and connected to the external lead part 2 formed in the shape of a wiring pattern, so that the semiconductor element 6 and the chip component 9 are directly mounted and connected to the package 1 and the external lead part 2. Since there is no need for connection between the semiconductor element 6 and the chip component 9, and there is no need for space for the connection, an ultra-miniaturized integrated circuit device with a simple configuration and low cost can be obtained.

FIG. 2 is a sectional view showing an embodiment in which the area is further reduced in order to be mounted in a minute part such as the tip of an electronic endoscope. In this embodiment, an external lead portion 12 formed in the shape of a wiring pattern is provided so as to protrude from the bottom surface of the ceramic package 11, and the external lead portion 12 is provided with an electrical conductor such as a semiconductor element or a chip component, as in the first embodiment. An integrated circuit device is constructed by mounting a circuit element 13 and sealing it with a resin 14 or the like.

In FIG. 2, 15 is a semiconductor element such as a solid-state image sensor, 16 is a glass plate or color filter disposed on the top surface thereof, and 17 is a sealing resin.

In this way, the external lead portion 12 is
Since the integrated circuit device is provided with Shortening can also be achieved in the direction. Therefore, an integrated circuit device suitable for mounting in a minute part such as the tip of an electronic endoscope can be obtained.

FIG. 3 is a partially omitted sectional view showing the third embodiment, in which the same or equivalent members as those of the second embodiment shown in FIG. 2 are denoted by the same reference numerals. In this embodiment, a side plate 18 is provided on the surface of the wiring pattern external lead portion 12 opposite to the surface on which the electric circuit element 13 such as a semiconductor element or chip component is mounted, in order to reinforce the lead and prevent the sealing resin from flowing. It is attached by gluing. Any insulating side plate 18 can be used, and even conductive side plates can be used as long as they are insulated.

FIG. 4 shows that in the embodiment shown in FIG. 3, instead of using resin sealing to hermetically seal the electric circuit element 13 such as a semiconductor element provided in the external lead part 12, a further high multiplier is obtained. In addition, a cap 19 is placed over the electric circuit element 13 and sealed with a low melting point glass.

[Effects of the Invention] As described above based on the embodiments, according to the present invention, the external lead portion is configured in the shape of a wiring pattern, and the external lead portion is used to connect an electric circuit such as a semiconductor element or a chip component. Since the elements are mounted, the width of the integrated circuit device can be reduced and the area can be reduced. In addition, since the electric circuit elements are mounted directly on the external lead part, there is no need to connect the board and the external lead part, and no space is required for connection, making it a simple and low-cost ultra-compact integrated circuit. The device can be realized.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the first embodiment of the integrated circuit device according to the present invention, FIG. 1 [3] is a side view showing the external lead part of the first embodiment before mounting the electric circuit element, Figure 2 shows the second
3 is a cross-sectional view showing the third embodiment with a part omitted; FIG. 4 is a cross-sectional view showing the fourth embodiment with a part omitted; FIG. FIG. 2 is a cross-sectional view showing an example of the configuration of a conventional integrated circuit device. 1.11 is a package, 2 and 12 are external lead parts, 3.6 is a semiconductor element, 4.7 is a bonding wire, 5 is a cap, 8 and 14 are sealing resins, 9 is a chip component, and 13 is a An electric circuit element, 15 a semiconductor element, 16 a glass plate, 17 a sealing resin, 18 a side plate, and 19 a cap. Patent applicant: Olympus Optical Industry Co., Ltd. Figure 1 (△) Figure 2 Figure 3 Figure 4 (B)

Claims (1)

[Claims] 1. In an integrated circuit device in which a semiconductor element is mounted on a package provided with an external lead part, the external lead part is configured in the form of a wiring pattern, and an electric circuit element such as a semiconductor element or a chip component is mounted on the external lead part. An integrated circuit device characterized by being mounted, electrically connected, and hermetically sealed.