JPH10270288A - Composite electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composite electronic component wherein proper solder fillets can be formed at the time of mounting on a printed board and mounting area is small. SOLUTION: In this composite capacitor 11, a plurality of multilayer chip capacitors 12 are piled so that the respective terminal electrodes 13 coincide with each other, and cap terminals 14 are fixed on both ends of the multilayer chip capacitors 12. Seals 15 stick to the rears of the respective cap terminal 14, leaving height almost equal to the thickness of the one chip capacitor 12 on the lower sides of the rears. When the composite capacitor 11 is mounted on a printed board 16, molten solder 18 which rises along the rears of the cap terminals 14 from the surface of a pattern 17 of the printed board 16 is obstructed by the seals 15, and proper fillets 19 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a composite electronic component,
For example, the present invention relates to a composite electronic component in which a plurality of multilayer chip capacitors are integrally connected to obtain a large capacitance.

[0002]

2. Description of the Related Art Conventionally, electrolytic capacitors are sometimes used as large-capacity capacitors. However, the electrolytic capacitor cannot be used depending on the place of use. As an alternative, it is conceivable to use a multilayer capacitor made of ceramic. However, since ceramic is sintered, it is difficult to manufacture a large-sized one and it is difficult to obtain a large capacity. Therefore, conventionally, a composite capacitor in which the capacitance is increased by stacking ceramic multilayer capacitors has been provided.

FIG. 9 shows an example of this composite capacitor. The composite capacitor 1 is formed by stacking a plurality of multilayer chip capacitors 2 having terminal electrodes 3 at both ends so that the respective terminal electrodes 3 match each other, and if necessary, gluing or joining them by means of an adhesive or the like. And
Cap terminals 4 are fitted to both ends of the stacked chip capacitors 2 respectively. The terminal electrodes 3 of each chip capacitor 2 are electrically connected to these cap terminals 4 by solder or conductive adhesive.

[0004]

Since the composite capacitor 1 has a structure in which a plurality of chip capacitors 2 are stacked, the shape is large and the area of the cap terminal 4 is large. As shown in FIG. 10, when the composite capacitor 1 is mounted on the printed board 5, the solder 7 on the pattern 6 of the printed board 5 diffuses over almost the entire surface of the cap terminal 4. For this reason, the fillet 8 of the solder 7 joining the cap terminal 4 and the pattern 6 of the printed circuit board 5 becomes thinner as shown by a solid line from an ideal fillet shown by a dotted line in FIG. In addition, the bonding strength of the solder to the pattern 6 of the composite capacitor 1 is greatly reduced.

In order to improve such a decrease in the adhesive strength of the solder, when the composite capacitor 1 is mounted on the printed circuit board 5, the solder is further supplied between the cap terminal 4 and the pattern 6 to provide an appropriate solder. It is necessary to perform a so-called additional soldering operation for forming a fillet. For this reason, there is a problem that it takes time to mount the conventional composite capacitor 1 on the printed circuit board 5.

Further, as described above, in order to increase the amount of solder by the additional soldering operation, it is necessary to increase the area of the pattern 6. For this reason, the conventional composite capacitor 1 has a problem that the mounting area becomes large or the strength of the compact electronic component is deteriorated due to the flow of solder by additional solder into other small electronic components.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a composite electronic component having a small mounting area and capable of forming a proper fillet when mounted on a printed circuit board without using an additional soldering operation. .

[0008]

In order to achieve the above object, a composite electronic component according to the present invention comprises a plurality of chip electronic components each having a terminal electrode at an end portion, the terminal electrodes being aligned, and a plurality of the chip electronic components being stacked. It is characterized in that a solder adhesion preventing material for preventing adhesion of solder is provided on a part of the terminal electrode connecting member attached to the electrode. The solder adhesion preventing material may be a sealing material attached to the terminal electrode connecting member to repel solder, a coating material applied to the terminal electrode connecting member to repel solder, or the plurality of chips bonded to each other. It is a resin case that covers an assembly of electronic components alone.

Further, in the composite electronic component according to the present invention, it is a resin case which covers an assembly of the chip electronic components alone on which the solder adhesion preventing material is superimposed.
The terminal electrode connecting member has a solder attachment portion drawn out of the resin case.

[0010]

The solder adhesion preventing material prevents the solder from spreading along the terminal electrode connecting member on the way and suppresses the amount of solder adhering to the terminal electrode connecting member to an appropriate amount. In addition, the resin case,
A part of the portion dams the molten solder rising along the terminal electrode connecting member, and prevents the solder from rising further from that position and trying to spread.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the composite electronic component according to the present invention will be described with reference to the accompanying drawings. In the following embodiments, an example in which the present invention is applied to a composite capacitor will be described. However, the present invention is not limited to this, and may be applied to a composite device of a chip electronic component having a built-in functional element such as a resistor or a coil. it can.

[First Embodiment, FIGS. 1-3] A composite capacitor 11 shown in FIG. 1 has terminal electrodes 1 at both ends.
3 are stacked so that the respective terminal electrodes 13 coincide with each other, and at both ends of the stacked chip capacitors 12,
Cap terminals 14 as terminal electrode connection members are fitted respectively. Each terminal electrode 13 is electrically connected to these cap terminals 14 via solder or a conductive adhesive. Further, an adhesive may be interposed between the chip capacitors 12 or bonded or joined by other means as necessary.

FIG. 1 shows a back side of each of the cap terminals 14.
As shown in the figure, the seals 15 are respectively adhered to the lower side, leaving a height h1 of about one chip capacitor 12 thickness. These seals 15 are made of a heat-resistant material having a function of repelling molten solder.

In this way, since the seal 15 has a function of repelling the molten solder, when the composite capacitor 11 is mounted on the printed circuit board 16 as shown in FIG. Molten solder 1 rising from above 16 patterns 17 along the back surface of cap terminal 14
8 is blocked by the seal 15 and does not spread over the entire back surface of the cap terminal 14. Therefore, the cap terminal 14
The effective soldering surface to which the solder 18 adheres has substantially the same area as other small electronic components mounted on the printed circuit board 16 together with the composite capacitor 11. Thus, a proper fillet 1 can be provided between the pattern 17 and the cap terminal 14 without performing a so-called additional soldering operation.
9 can be formed.

The seal 15 blocks solder rising from the pattern 17 along the back surface of the cap terminal 14 on the way, so that an appropriate fillet 19 is formed between the cap terminal 14 and the pattern 17. Anything should do. Accordingly, the seal 15 is, for example, as shown in FIG.
It does not have to reach the upper end of the back surface of the cap terminal 14. In this example, the vertical direction of the composite capacitor 11 can be eliminated.

In the first embodiment, although not shown, instead of the cap terminal 14, a solder layer covering each terminal electrode 13 of the plurality of chip capacitors 12 is formed, and these solder layers are connected to the terminal electrode connecting member. It can also be used as Further, a conductive adhesive layer can be used instead of these solder layers.

[Second Embodiment, FIGS. 4 and 5] In the composite capacitor 21 shown in FIG. 4, a plurality of multilayer chip capacitors 12 each having a terminal electrode 13 at both ends are matched with each other. The stacked chip capacitors 12 are integrally connected by a solder layer 22 formed on each terminal electrode 13 to form one capacitor assembly 23. . The capacitor assembly 23 is covered with a cap-shaped resin case 24. The resin case 24 is
It is made of a heat-resistant resin material that repels molten solder.

The resin case 24 has a depth slightly smaller than the width of each chip capacitor 12 constituting the capacitor assembly 23 (the height of the assembly 23). Therefore, when the resin case 24 is put on the capacitor assembly 23, a part of the solder layer 22 is located below the resin case 24.

In the composite capacitor 21 having the structure as shown in FIG.
In this case, the solder 18 is not hindered by the resin case 24 and rises too much along the solder layer 22. Thereby, the fillet 19 of the solder 18 for connecting the terminal electrode 13 and the pattern 17 of the printed board 16 can be made appropriate.

[Third Embodiment, FIG. 6] The composite capacitor 31 shown in FIG. 6 is connected to the terminal electrodes 13 of each chip capacitor 12 of the capacitor assembly 23 described in FIG.
A pair of metal pedestals 33 joined by an insulating material 32 are soldered. In this composite capacitor 31,
By setting the height of the metal pedestal 33 to an appropriate value, the solder 18 adheres only to the pedestal 33 and the fillet 19
Can be made appropriate.

[Fourth Embodiment, FIGS. 7 and 8] In the composite capacitor 41 shown in FIG. 7, the capacitor assembly 23 described in FIG. In this case, only one of them appears), and the terminal electrode connecting members 43 are integrally formed with the solder attachment portions 4 whose surfaces are exposed from the side wall portions 42 a of the resin case 42.
3a are provided. The terminal electrode connecting member 43 is electrically connected to the terminal electrode 13 of the chip capacitor 12 constituting the capacitor assembly 23 by a conductive adhesive or the like.

In the composite capacitor 41 having such a configuration, the solder attachment portion 43 of the terminal electrode connecting member 43 is provided.
By setting the height h2 and the width w of a to appropriate values, the fillet 19 of the solder 18 can be made appropriate.

As shown in FIG. 8, the terminal electrode connecting member 43 may draw out the solder attachment portion 43a from the notch 44 provided in the resin case 42 to the outside of the resin case 42. By doing so, the terminal electrode connecting member 4
3 does not need to be integrally molded with the resin case 42,
Costs can be reduced.

[Other Embodiments] The composite type capacitor according to the present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the invention.

[0025]

As is apparent from the above description, according to the present invention, the solder spreading along the terminal electrode connecting member is prevented on the way by the solder adhesion preventing material, and the amount of the solder adhering to the terminal electrode connecting member is reduced by an appropriate amount. Therefore, an appropriate fillet can be formed at the time of mounting the composite electronic component without requiring additional work such as additional soldering. Further, since the area of the pattern of the printed circuit board to be mounted is also reduced, the mounting area of the composite electronic component can be reduced.

If a sealing material is attached to the terminal electrode connecting member, a coating material is applied, or a cap-shaped resin case is put on the assembly of the chip electronic components alone, the terminal electrode connecting member can be formed. Since the molten solder rising along the member is blocked by a sealing material or the like, and prevents the solder from rising further from the position and trying to spread, it is easy to form an appropriate fillet. Can be.

Further, by exposing the solder attachment portion of the terminal electrode connection member from the resin case, the resin case prevents the solder supplied to the solder attachment portion from spreading outside the resin case. At this time, an appropriate fillet can be formed in the solder attachment portion.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a composite capacitor according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a state of a solder fillet when the composite capacitor of FIG. 1 is mounted on a printed circuit board.

FIG. 3 is a sectional view showing a modification of the composite capacitor of FIG. 1;

FIG. 4 is an exploded perspective view showing a composite capacitor according to a second embodiment of the present invention.

FIG. 5 is a sectional view showing a state of a solder fillet when the composite capacitor of FIG. 4 is mounted on a printed circuit board.

FIG. 6 is a sectional view showing a composite capacitor according to a third embodiment of the present invention.

FIG. 7 is a partially cutaway perspective view showing a composite capacitor according to a fourth embodiment of the present invention.

FIG. 8 is a perspective view showing a modification of the composite capacitor of FIG. 7;

FIG. 9 is an exploded perspective view showing a configuration of a conventional composite capacitor.

FIG. 10 is an explanatory diagram showing a state of a solder fillet when the composite capacitor of FIG. 9 is mounted on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Composite capacitor 12 ... Laminated chip capacitor 13 ... Terminal electrode 14 ... Cap terminal 15 ... Seal 16 ... Printed circuit board 17 ... Pattern 18 ... Solder 19 ... Fillet 21 ... Capacitor 22 ... Solder layer 23 ... Capacitor assembly 24 ... Resin assembly Case 31 ... Capacitor 32 ... Insulating material 33 ... Pedestal 41 ... Capacitor 42 ... Resin case 42a ... Side wall part 43 ... Terminal electrode connecting member 43a ... Solder attaching part 44 ... Notch

Claims (5)

[Claims] A plurality of chip electronic components each having a terminal electrode at an end thereof are stacked with their terminal electrodes aligned, and solder is prevented from adhering to a part of a terminal electrode connecting member attached to the terminal electrode. A composite electronic component comprising an adhesion preventing material. 2. The composite electronic component according to claim 1, wherein the solder adhesion preventing material is a seal material for repelling the solder attached to the terminal electrode connecting member. 3. The composite electronic component according to claim 1, wherein the solder adhesion preventing material is a coating material that repels the solder applied to the terminal electrode connecting member. 4. The composite electronic component according to claim 1, wherein the solder adhesion preventing member is a resin case that covers an assembly of the chip electronic components alone joined together. 5. A resin case for covering an assembly of the chip electronic components alone on which the solder adhesion preventing material is superimposed on each other, and wherein the terminal electrode connecting member has a solder adhesion portion drawn out of the resin case. The composite electronic component according to claim 1, further comprising: