JPH0766313A - Composite electronic parts - Google Patents

Abstract

PURPOSE:To provide composite electronic parts which can prevent the occurrence of cracks in a multilayered ceramic substrate even when a printed board is deflected at the time of mounting the substrate on the printed board. CONSTITUTION:Side-face electrodes 14 electrically connected to discrete parts 13 are provided on the side faces of a multilayered ceramic substrate 12 on the surface of which the discrete parts 13 are mounted and a cap 15 which covers the discrete parts 13 is fitted to the surface side of the substrate 12 and connection electrodes 16 electrically connected to the side-face electrodes 14 are provided on the side faces of the cap 15. At the time of mounting the substrate 12 on a printed board, the substrate 12 is put on the printed board with the cap 15 downside and the electrodes are soldered to the wiring on the wiring board. Therefore, the multilayered ceramic 12 is not stressed even when the ceramic board 12 is deflected and the cracking of the board 12 is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component in which a cap for covering discrete components is provided on the surface of a multilayer ceramic substrate.

[0002]

2. Description of the Related Art In recent years, there has been a strong need for high-density mounting in electronic equipment, and chip capacitors and the like are being miniaturized. Recently, 1.0 mm × 0.5 mm products have been manufactured. It has the drawback of being difficult and expensive.

Another method of high-density mounting is compounding of electronic parts, and a conventional composite electronic part is shown in FIG.
As shown in FIG. C. R and other passive components are built in, and wiring and a large constant L.V. C. A discrete component 2 including a passive component such as R and an active component such as a diode or a transistor is attached, a side electrode 3 that is electrically connected to the internal passive component and the discrete component 2 is provided on a side surface of the multilayer ceramic substrate 1, and the surface of the substrate 1 is provided. The structure is such that a cap 4 for covering the discrete component 2 is attached.

[0004]

By the way, in order to mount the above-described composite component on a printed circuit board, the structure shown in FIG.
As described above, since the multilayer ceramic substrate 1 is fixed on the printed circuit board 5 by soldering the side electrode 3 to the wiring 6 by stacking the multilayer ceramic substrate 1 on the printed circuit board 5, when the printed circuit board 5 is bent, stress is applied to the multilayer ceramic substrate 1. Therefore, there is a problem that a crack is generated in a portion close to the side surface electrode 3 and normal operation of the composite electronic component cannot be obtained.

Further, in order to prevent the occurrence of cracks, it is possible to use a material having a high strength as the constituent material of the multilayer ceramic substrate 1, but there is a restriction on the material, and the cost becomes high, which is not practical. .

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a composite electronic component which does not cause a crack even when the printed circuit board is bent without changing the material of the multilayer ceramic substrate.

[0007]

In order to solve the above-mentioned problems, the present invention has a discrete component attached to the surface of a multilayer ceramic substrate, and a side electrode electrically connected to the discrete component is provided on a side surface of the multilayer ceramic substrate. In a composite electronic component in which a cap that covers discrete components is attached to the surface side of a multilayer ceramic substrate, a configuration is provided in which a connecting electrode is provided on a side surface of the cap for conducting to a side electrode of the multilayer ceramic substrate and soldering to a printed circuit board. It is what

[0008]

Since the connecting electrode is provided on the cap, the cap can be placed on the printed circuit board with the cap facing down, and the connecting electrode provided on the cap can be mounted by soldering with the wiring, and the printed circuit board can be flexed. However, no stress is applied to the multilayer ceramic substrate located on the cap, and the multilayer ceramic substrate does not crack.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.

As shown in the figure, the composite electronic component 11 has an L.P. C. On the surface of the multilayer ceramic substrate 12 in which passive components such as R are incorporated individually or in a mixed manner, wiring and L.V. C. A discrete component 13 including a passive component such as R and an active component such as a diode or a transistor is attached, and a side electrode 14 that is electrically connected to the internal passive component and the discrete component 13 is provided on a side surface of the substrate 12, and a front surface side of the multilayer ceramic substrate 12 is provided. Discrete parts 1
3 has a structure in which a cap 15 for covering 3 is attached, and a connecting electrode 16 for conducting the side electrode 14 is provided on a side surface of the cap 15.

In the first embodiment shown in FIGS. 1 and 2,
The cap 15 is made of resin or ceramic, or has a metal surface on which an insulating film is formed. For example, it is preferable to use a material having a large bending strength such as Al ₂ O ₃ and, in the illustrated case, it is formed smaller than the multilayer ceramic substrate 12, but the same planar size as the substrate 12 may be used.

The cap 15 is adhered to the surface of the multilayer ceramic substrate 12 with a resin adhesive, and the side electrode 1
4 and the connecting electrode 16 may be fixed at the same time as soldering or electrical connection with a conductive paste.

The composite electronic component of the first embodiment has the above-mentioned structure, the cap 15 is attached to the surface of the multilayer ceramic substrate 12, and the side electrode 14 is formed as shown in FIG.
To connect the connection electrode 16 to the connection electrode 16 and mount the composite electronic component on the printed circuit board 17, the cap 15 is placed on the printed circuit board 17 as shown in FIGS. 18 and the connection electrode 16 are connected and fixed by soldering 19.

As described above, by mounting the cap 15 which is lowered on the printed circuit board 17 in a stacked manner, the multilayer ceramic substrate 12 does not come into contact with the printed circuit board 17, and even if the printed circuit board 17 is bent, the cap 15 is formed.
It is possible to effectively prevent the multilayer ceramic substrate 12 from being cracked because it is absorbed by the stress.

The multi-layer ceramic substrate 12 has no effect on the characteristics even if the surface on which the discrete component 13 is mounted is mounted downward.

Next, in the second embodiment shown in FIGS. 3A and 3B, side walls 21 and 21 facing the cap 15 and connecting portions 22 and 22 for connecting both side walls 21 and 21 at both ends are provided. Is formed in a side U-shaped arch shape, and the connecting electrodes 16 are provided on the outer surfaces of the side walls 21 and 21.

The cap 15 is placed on the surface of the multilayer ceramic substrate 12 so that the connecting portions 22 and 22 are overlapped with each other.
In order to electrically and mechanically connect the side surface electrode 14 and the connection electrode 16 by soldering and to mount this composite electronic component on the printed circuit board 17, as shown in FIG. Wiring on the printed circuit board 17
It suffices to fix the connection electrode 16 and the connection electrode 16 by soldering 19, and even if the printed circuit board 17 is bent, no stress is applied to the multilayer ceramic substrate 12.

In the third embodiment shown in FIGS. 4A and 4B, the cap 15 is opposed to the side walls 21 and 21 and the horizontal wall 2.
3 has a U-shaped cross section, and the connection electrodes 16 are provided on the outer surfaces of both side walls 21 and 21, and the cap 15 is placed on the printed circuit board 17 as shown in FIG. 3B. It is implemented in.

In the fourth embodiment shown in FIG. 5, a cap 15 similar to that of the third embodiment is used, the multilayer ceramic substrate 12 is housed inside the cap 15, and the cap 15 is extended to the inner surface. The connection electrode 16 and the side surface electrode 14 are connected to each other, and the cap 15 is mounted on the printed board 17 in an overlapping manner.

In any of the embodiments, slits or notches may be provided in the portions of the cap 15 between the connection electrodes 16 to improve the flexural strength of the cap 15, and The cap 15 of the fourth embodiment can be manufactured by powder press molding, cutting, laser processing, or the like using ceramic having high bending strength.

[0021]

As described above, according to the present invention, since the connecting electrode is provided on the side surface of the cap attached to the surface of the multilayer ceramic substrate, the cap is attached to the printed substrate with the cap facing down. Even if the printed circuit board is bent, stress is not applied to the multilayer ceramic board, cracks are not generated in the multilayer ceramic board, and normal operation is always obtained.

Further, since the cap is attached to the printed circuit board, it is easy to select a material having a large bending strength for the cap, and the flexural strength of the multilayer ceramic substrate can be more than doubled.

[Brief description of drawings]

1A is an exploded perspective view showing a first embodiment of a composite electronic component according to the present invention, and FIG. 1B is a perspective view showing an assembled state of the same.

FIG. 2A is a perspective view showing a state of mounting the same on a printed circuit board, and FIG. 2B is a vertical sectional front view showing a state of mounting on the printed circuit board.

FIG. 3A is an exploded perspective view showing a second embodiment,
FIG. 6B is a vertical cross-sectional front view showing a mounting state on the printed circuit board.

FIG. 4A is an exploded perspective view showing a third embodiment,
FIG. 6B is a vertical cross-sectional front view showing a mounting state on the printed circuit board.

FIG. 5 is a vertical cross-sectional front view of a mounting state on a printed circuit board showing a fourth embodiment.

FIG. 6A is an exploded perspective view showing a conventional composite electronic component, and FIG. 6B is a vertical sectional front view showing a mounting state on a printed circuit board.

[Explanation of symbols]

 11 Composite Electronic Components 12 Multilayer Ceramic Substrate 13 Discrete Components 14 Side Electrodes 15 Caps 16 Connection Electrodes

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 23/12 // H01G 2/06

Claims (1)

[Claims] 1. A composite electronic component in which a discrete component is attached to the surface of a multilayer ceramic substrate, side electrodes that are electrically connected to the discrete component are provided on the side faces of the multilayer ceramic substrate, and a cap is attached to the surface side of the multilayer ceramic substrate to cover the discrete component. 2. A composite electronic component according to, wherein a side surface electrode of the multilayer ceramic substrate is provided on the side surface of the cap with a connecting electrode for soldering to the printed circuit board.