JPH09162077A - Electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily mount a cylindrical aluminum electrolytic capacitor on a printed wiring board. SOLUTION: Projections 17 formed on the internal surfaces of the upper ends of pawls 16 extended from an insulating plate 14 which is brought into contact with the end face of a cylindrical aluminum electrolytic capacitor 10 are put in an annular recessed groove 5 formed on the peripheral surface of the capacitor 10 and slits 15 are provided in the insulating plate 14 in accordance with the lead wires 4a and 4b of the capacitor 10. The lead wires 4a and 4a are bent so that the wires 4a and 4a can be extended in the slits 15 and the external side faces of the wires 4a and 4a can nearly be flush with the external surface of the insulating plate 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, especially an aluminum electrolytic capacitor, having a terminal which comes into contact with a conductor on a surface of a printed circuit board when mounted on the printed circuit board.

[0002]

There is a chip type capacitor as a type of capacitor which is mounted on a printed circuit board and soldered, and it has plate-shaped terminals provided at both ends of the lower surface of the main body. . In recent years, a cylindrical aluminum electrolytic capacitor having a lead wire has been mounted on a substrate by a method similar to that of a chip type capacitor.
An aluminum electrolytic capacitor as shown in FIG. 7 is proposed in Japanese Patent Publication No. 211214.

In FIG. 7, a capacitor element 1 in which an electrode foil and a separator are wound and impregnated with an electrolytic solution is housed in a cylindrical aluminum case 2, and the aluminum case 2 is sealed by an elastic sealing body 3. The electrode leads 4 and 4 extending from the element 1 penetrate the elastic sealing body 3 in an airtight manner and are led to the outside. Reference numeral 5 is an annular groove formed in the aluminum case 2 to which the sealing body 3 is tightened in order to enhance airtightness.

An insulating plate 6 is brought into contact with the end surface of the capacitor in order to facilitate mounting on the substrate. The insulating plate 6 has a small hole 7,
7 and concave grooves 8 and 8 directed toward the outer peripheral direction of the insulating plate 6
And lead wires 4a, 4a connected to the electrode leads 4, 4
Are inserted into the small holes 7, 7 and bent to form the concave grooves 8, 8
It is placed inside and thus holds the insulating plate 6.

In the above-mentioned capacitor, the lead wires 4a, 4
Even if "a" is bent so as to be in close contact with the bottoms of the recessed grooves 8,8, it slightly returns due to the elastic force, and therefore the tips of the lead wires 4a, 4a float up as shown in the figure and protrude from the surface of the insulating plate 6, Stability at the time of mounting is impaired. Further, when bending, a force is applied to the electrode leads 4 and 4 in the direction of pulling them out from the element 1,
May damage the capacitor. In order to prevent such damage, the lead wires 4a, 4a should be bent at the planned bending positions as shown in FIG.
There are cases where the notches 9 and 9 are provided as shown in FIG. 5, but this significantly weakens the strength of the lead wires 4a and 4a, which causes disconnection due to vibration during use. The present invention intends to solve these problems all at once.

[0006]

According to the present invention, a plurality of lead wires are led out from one end surface of the electronic component body, and each lead wire is at a position separated from the end surface by a predetermined distance and the periphery of the end surface. It is bent in the direction. An insulating plate supported by the electronic component body is in contact with the end face, and the insulating plate has a slit for passing the bent lead wire. The bent lead wire is in the slit, and the outer surface of the bent lead wire is substantially flush with the outer surface of the insulating plate.

In the above-mentioned electronic component, each lead wire is clamped and bent by a tool having a predetermined thickness and one surface of which is in contact with the end face of the electronic component body. Then, the insulating plate is brought into contact with the end surface, and the supporting portion provided on the insulating plate is coupled to the side surface of the electronic component, and the bent lead wire is provided on the insulating plate. When placed inside, the outer surface of the lead wire is located substantially flush with the outer surface of the insulating plate.

Therefore, since each lead wire is bent while being clamped by a tool, no force in the direction of pulling out the lead wire from the element is generated and the lead wire is bent at a predetermined position without a cut or the like. It is possible to position the bent portion exactly on the same plane as the outer surface of the insulating plate. Also, since the insulating plate is supported not by the lead wires but by the electronic component main body, when connecting this to the substrate, the effect is not transmitted to the lead wires even if vibration or shock is applied,
High vibration resistance and impact resistance can be obtained.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The lead wire led out from the electronic component body may have a circular cross section or may be flatly crushed. The slit of the insulating plate is selected to have a width that allows the lead wire to pass therethrough, corresponding to the cross-sectional shape of these lead wires.

As a method of supporting the insulating plate on the electronic component main body, a method of adhering it to the end face of the electronic component main body using an adhesive, a method of holding the main body side surface with an arm extending from the insulating plate, and the insulating plate Appropriate methods such as a method of accommodating the electronic component body in a cylindrical container having a bottom and a method of wrapping the peripheral portion of the insulating plate in a heat-shrinkable outer covering that surrounds the electronic component body can be adopted. Particularly in the case of a cylindrical aluminum electrolytic capacitor, since it has an annular concave groove formed on the peripheral surface by a sealing process, a method of engaging a claw extending from the insulating plate with this is effective.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, a capacitor element 1 is housed in a cylindrical aluminum case 2 and is sealed by an elastic sealing body 3, and electrode leads 4 and 4 extending from the element 1 penetrate the sealing body 3 in an airtight manner to form a capacitor. It constitutes the main body 10. The end face 1 of the capacitor body 10 is continuous with the electrode leads 4 and 4.
As shown in FIG. 2, the lead wires 4a and 4a extending from the tool 1 have one surface abutted against the end surface 11 of the capacitor body.
It is sandwiched between 2 and 13, and is bent in the direction of arrow 14 until it abuts on the tool 13. The sandwiching portions of the tools 12 and 13 both have a thickness g, and the tool 13 placed on the peripheral portion of the end face 11 becomes slightly thinner toward the peripheral direction of the end face 11. When this processing is finished, the lead wires 4a and 4a are slightly returned by the elastic force, and the distances between the respective lead wire portions and the end face 11 become equal to each other. In addition, d is the diameter of the lead wires 4a and 4a.

Next, the insulating plate 14 shown in FIG. 3 is attached to the bottom of the capacitor body 10. Insulation plate 14 is lead wire 4a
The slit 1 having a thickness corresponding to the sum of the gap width g between the end face 11 and the diameter d of the lead wire 4a and extending from the periphery toward the center.
5 and 15, the width of which is the diameter d of the lead wires 4a and 4a.
Slightly wider. The claw 1 is perpendicular to the periphery of the insulating plate 14.
6 are extended, and a protrusion 17 is formed on the inner surface of the tip thereof. And the protrusions 17, 17 ...
.. is engaged with the annular groove 5 of the capacitor body 10, the insulating plate 14 abuts the end surface 11 of the capacitor body 10, and the lead wires 4a, 4a are formed in the slits 15, 15 of the insulating plate 14. Located approximately flush with the outer surface. The tips of the lead wires 4a, 4a are not limited to the illustrated length, and may be projected from the outer periphery of the insulating plate 14.

FIG. 4 shows another embodiment of the insulating plate 14, in which a cylinder 18 having an inner diameter substantially equal to the outer diameter of the capacitor body 10 rises from the peripheral portion of the insulating plate 14.
Is a notch whose upper part is perpendicular to the insulating plate 14,
... are divided into a large number of pieces, and projections 17, 17 ... Are formed on the inner surface of the upper end thereof. Then, the lower portion of the capacitor body 10 is fitted into the cylinder 18, and the protrusion 17,
.. is engaged with the annular groove 5, the insulating plate 14
Contacts the end surface 11 of the capacitor body. Each lead wire 4
The lengths of a and 4a are selected to be a little short so that they can pass through the inside surrounded by the protrusions 17, 17 ...

FIG. 5 shows still another embodiment of the insulating plate 14. The insulating plate 14 and the cylinder 20 rising from the peripheral portion thereof are integrally formed of a resin material having a slightly stretchable property. 20 has an annular ridge 21 on the inner surface of the upper end. When the lower portion of the capacitor body 10 is fitted into the cylinder 20 and the ridge 21 is engaged with the annular groove, the insulating plate 14
Contacts the end surface 11 of the capacitor body. Each lead wire 4
The lengths of a and 4a are selected to be a little short so that they can pass through the inside surrounded by the annular ridge 21.

In the embodiment shown in FIG. 6, the slits 15, 15 on the outer surface of the insulating plate 14 as shown in FIGS.
From the part adjacent to the slit wall surface to the metal layer 22,
22 are formed. The metal layers 22 and 22 are used for the lead wires 4a and 4a when the electrolytic capacitor is attached to the substrate.
Together with it is soldered to the conductive layer of the substrate. The metal layer 2
The elements 2 and 22 may be soldered to the lead wires 4a and 4a when the insulating plate 14 is attached to the capacitor body 10.

[0016]

As described above, according to the present invention, since the lead wire can be surely bent into a predetermined shape, the lead wire does not protrude from the surface of the insulating plate, and the lead wire is undesired during bending. There is no possibility of causing stress to damage the capacitor, and since it is not necessary to provide a notch for facilitating bending of the lead wire, the effect of not lowering the strength of the lead wire can be achieved at the same time.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

FIG. 2 is a front view showing a mode of bending the lead wire in the above embodiment.

FIG. 3 shows an example of an insulating plate in the above embodiment,
(A) is a plan view and (b) is a partial vertical cross-sectional view.

FIG. 4 shows another example of the insulating plate in the above embodiment,
(A) is a plan view and (b) is a partial vertical cross-sectional view.

5A and 5B show still another example of the insulating plate in the above embodiment, FIG. 5A is a plan view and FIG. 5B is a vertical sectional view.

FIG. 6 is a bottom view showing another embodiment of the insulating plate in the above embodiment.

FIG. 7 is a vertical cross-sectional view of a conventional surface mount cylindrical aluminum electrolytic capacitor.

FIG. 8 is a front view of a capacitor element of a conventional cylindrical aluminum electrolytic capacitor for surface mounting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Aluminum case 3 Elastic sealing body 4 Electrode lead 4a Lead wire 5 Annular groove 10 Capacitor body 11 Body end face 12, 13 Tool 14 Insulation plate 15 Slit 16 Claw 17 Protrusion

Claims (8)

[Claims] 1. An insulating plate supported by the electronic component body is brought into contact with the end face of the electronic component body from which a plurality of lead wires are led out from one end face, and the insulating plate supports the lead wires. Correspondingly, a groove-shaped slit is formed from the inside toward the periphery, and the lead wires are bent so as to extend inside the slit, and the outer surface of the lead wire is substantially flush with the outer surface of the insulating plate. An electronic component characterized by being located at. 2. The electronic component according to claim 1, wherein the insulating plate has a supporting portion which stands up from a peripheral portion thereof and extends along a side surface of the electronic component main body. 3. The electronic component according to claim 2, wherein the electronic component body is a cylindrical aluminum electrolytic capacitor. 4. The cylindrical aluminum electrolytic capacitor has an annular recess on a peripheral surface near the end face, and a support portion extending from the insulating plate has a protrusion engaging with the recess. The electronic component according to claim 3. 5. The electronic component according to claim 4, wherein the support portion is a claw that stands up from a peripheral portion of the insulating plate, and has a protrusion at an upper end thereof that engages with the annular recess. 6. The support portion has a cylindrical shape, and a portion between the upper edge and the middle of the support portion is divided into a large number by vertical cuts in the insulating plate, and the annular portion is formed on the inner surface of each upper end of the support portion. The electronic component according to claim 4, further comprising a protrusion that engages with the recess. 7. The support portion is formed in a cylindrical shape and is made of a resin material having a slight elasticity integrally with the insulating plate, and an annular ridge engaged with the annular groove on the inner surface of the upper end thereof. The electronic component according to claim 4, further comprising: 8. The electronic component according to claim 1, wherein the insulating plate is adhered to the end surface of the electronic component body with an adhesive.