JP3127032B2 - Mounting method of lead terminal in hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a method of mounting a plurality of lead terminals on a side edge of the insulating substrate in a hybrid integrated circuit device including a plurality of electronic components such as a transistor, a transistor, a resistor, and a capacitor.

[0002]

2. Description of the Related Art In general, this kind of hybrid integrated circuit device has been well known in the related art, and FIGS.
As shown in FIG. 1, a printed wiring is formed on one or both of an upper surface and a lower surface of an insulating substrate A formed in a rectangular shape with glass epoxy resin or ceramic, and various electronic components such as a transistor or a resistor are formed. C on the left and right sides of the insulating substrate A,
A plurality of metal lead terminals b that are electrically connected to printed wiring to the various electronic components C are mounted at appropriate intervals along the side edge of the insulating substrate A.

In this case, each lead terminal b is connected to an insulating substrate A
Of the lead terminal b comes into contact with another object and the lead terminal c
To form the insulating substrate A
Therefore, in the conventional hybrid integrated circuit device, a bifurcated portion b 'is provided at the base end of each of the lead terminals b, as shown in FIGS. It is configured to be firmly attached by being fitted to the side edge of the insulating substrate A.

On the other hand, in the above-mentioned hybrid integrated circuit device, when the lead terminals b are attached to the left and right side edges of the insulating substrate A at an appropriate pitch,
Using a long hoop-shaped lead frame formed by integrally molding a large number of lead terminals at appropriate pitch intervals, cutting a lead frame piece of a length including a predetermined number of lead terminals from this lead frame, A method is adopted in which the lead frame piece is mounted on the insulating substrate so that each lead terminal of the lead frame piece is electrically connected to a printed wiring on the insulating substrate.

[0005]

In this case, forming the tip of each lead terminal b in the long hoop-shaped lead frame at the forked portion b 'requires a great deal of work for the processing. However, there is a problem that the manufacturing cost is significantly increased.

[0006] In addition, the tip of each lead terminal b, each Lee
For attaching the terminal b to the insulating substrate A.
b ′, there is a limit value in reducing the interval pitch in the lead terminal. In other words,
There was also a problem that the high density by Rukoto be narrowing of the pitch of the lead terminal is difficult.

According to the present invention, when the lead terminals are attached to the left and right side edges of the insulating substrate at appropriate intervals, the printed wiring on the insulating substrate of each lead terminal is connected.
It is a technical object of the present invention to provide a method for mounting a lead terminal which does not cause the above-mentioned problem in a state where a connecting portion to be connected can be easily sealed .

[0008]

In order to achieve this technical object, the present invention provides a method of forming a thin lead terminal between right and left side frames at appropriate intervals along the longitudinal direction of the side frames. A step of bending and forming a hoop-shaped lead frame integrally molded into a substantially U-shaped cross section and a step of cutting into a lead frame piece having a length including an appropriate number of lead terminals are performed. The lead frame piece includes one side frame and a plurality of lead terminals integrally connected thereto by cutting the middle of each lead terminal of the lead frame piece along the longitudinal direction of the lead frame piece. a step of dividing the first lead frame piece, to the other side frame and a second lead frame strip comprising a lead terminal of the plurality of articulating integrally, Of the first lead frame piece and a second lead frame strip, with respect to left and right side edges of the insulating substrate, the tip of the insulating surface of the substrate of the respective lead terminals formed
A step of mounting to connect by an adhesive or soldering or the like to a printed wiring which is, the insulating substrate, the protective cap body made of an insulating material, contact the insulating substrate of each lead terminal
Connection to the printed wiring
Nozomi and the surroundings of the insulating substrate serve as a protective cap.
In definitive closely to the inner surface of the side wall plates, further comprising the steps of each lead terminal is inserted to fit into the groove depressions formed in the side walls of the protective cap body, the first lead frame piece and a second lead frame strip characterized in that the side frames and a step of disconnecting from the lead terminals. Is the thing.

[0009]

In this manner, each of the lead terminals is supported in a state of being fitted in each of the recessed grooves in the protective cap body covering the entire insulating substrate on which the electronic component is mounted. When forming each lead terminal into an appropriate shape, and when separating the side frame from each lead terminal, it is possible to reduce that a large force acts on the connection portion of each lead terminal to the insulating substrate. The connecting portion of each of the lead terminals to the insulating substrate can be prevented from being formed in a forked shape as in the related art.
The strength of the connection portion to the circuit can be maintained at a high value without forming the tip of each lead terminal in a forked portion as in the related art.

Therefore, according to the present invention, it is not necessary to form the tip of each lead terminal integrally formed on the lead frame into a forked portion, so that the cost required for processing the lead frame can be greatly reduced. In addition, the pitch between the lead terminals can be made much narrower than in the conventional case, which has the effect of increasing the density .

Further , in the present invention, in the course of the manufacturing process,
In, place the insulating substrate inside the protective cap inside each lead end.
The connection to the printed wiring on the
Nominate the protective cap and check that each lead terminal is
It fits into the recess formed in the side wall plate of the cap
Inserted into the insulation board of each lead terminal
Connection to printed wiring at low cost
It also has the effect of being able to be sealed.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
2) will be described.

[0013] destination Dzu, as shown in FIG. 1, between the right and left pair of side frames b _1, b _2, the lead terminals b ₃ narrow, b ₄ the side frames b ₁ a, b ₂ a longitudinal A hoop-shaped lead frame B integrally formed at an appropriate pitch along the direction is used, and a predetermined number of lead terminals b ₃ and b ₄ are connected to the lead frame B as shown in FIG. including cutting the lead frame strip B ₁ of length L.

The lead terminals b ₃ and b ₄ are integrally connected to the tie bar portion b ₅ , whereby
Although the lead terminals b ₃ and b ₄ are prevented from being deformed, the tie bar b ₅ may be omitted.

Next, as shown in FIG. 3, the lead frame piece B ₁ is bent and formed in a substantially U-shape (note that FIG. 3).
In this case, the hoop-shaped lead frame B, after forming bent in a U-shape, may be cut into the lead frame strip B ₁ suitable length L).

[0016] Then, the lead frame strip B _1, as shown in FIG. 4, along the middle of each lead terminal b _3, b ₄ in the lead frame strip B ₁ in the longitudinal direction of the lead frame strip B ₁ cut By doing so, a first lead frame piece B ₁ ′ including _one side frame b ₁ and a plurality of lead terminals b ₃ integrally connected thereto, and the other side frame b ₂ and the one A second lead frame piece B ₁ ″ including a plurality of connected lead terminals b _4.
Divide and cut into

Next, the first lead frame piece B ₁ ′
And the second lead frame piece B ₁ ″ are mounted on the left and right side edges of an insulating substrate A formed by mounting various electronic components C on the surface in advance and forming printed wiring (not shown) for each of the electronic components C. On the other hand, the respective lead terminals b ₃ , b
₄ is mounted so as to be electrically connected to the printed wiring of the insulating substrate A by a conductive adhesive or soldering.

Meanwhile, as shown in FIG. 6, formed in a box-shaped bottom surface opening in an insulator such as synthetic resin, and, a groove D dent plurality in each of the inner surfaces of the right and left side wall panel D _{1 2} is formed at a pitch equal to the pitch between the lead terminals b ₃ and b _{4. In} the protective cap D, as shown in FIG. Frame piece B ₁ ′ and second lead frame piece B ₁ ″
The insulating substrate A on which the lead terminals b ₃ and b ₄
Of the printed circuit board on the insulating substrate A
In the protective cap body D and around the insulating substrate A.
Close to the inner surface of the side wall plates D ₁ enclosed is the protection cap body D
Further, each of the lead terminals b ₃ and b ₄ is provided with a protective cap body D.
Insert to fit into the groove D ₂ indentations formed in the side wall plates D ₁ in.

Then, the first lead frame piece B ₁ ′
The second lead frame piece B ₁ ″ is formed by homing so as to be bent outward as shown in FIG. 8, and then the first lead frame piece B ₁ ′ and the second lead frame piece B ₁ ′
The side frame b ₁ in the lead frame piece B ₁ ″,
The b _2, as shown in FIG. 9, by separating from the lead terminals b _3, b _4, is to a hybrid integrated circuit device having the structure illustrated in FIGS. 10 to 12.

By doing so, each of the lead terminals b ₃ , b
Each ₄ from being supported by the fitting waiting state in each recessed groove D ₂ in the protective cap body D which covers the entire, the respective lead terminals b _3, b ₄ FIG electronic component C with an insulating substrate A 8, a large force acts on the connecting portions of the lead terminals b ₃ , b _{4 to} the insulating substrate A at the time of forming as shown in FIG. 8 and when separating the side frames b ₁ , b ₂ as shown in FIG. Can be reduced, the insulating substrate A of each of the lead terminals b ₃ and b ₄ can be reduced.
Can be prevented from being formed in a forked shape as in the related art. In other words, the connection strength of each of the lead terminals b ₃ and b _{4 to} the insulating substrate A is reduced as in the conventional case. Can be maintained at a high value without forming in the forked portion.

Moreover, the connection of the lead terminals b ₃ and b ₄ is indispensable.
Protection of the connection to the printed wiring on the edge substrate A
Easy insertion by inserting the insulating substrate A into the cap body D
It can be sealed .

Each of the recessed grooves D ₂ in the left and right side wall plates D ₁ of the protective cap body D corresponds to the left and right side wall plates D _1.
And the lead terminals b ₃ and b ₄ are fitted into the respective concave grooves D ₂ , or the respective concave grooves D for fitting the lead terminals b ₃ and b ₄ are provided.
_2, as shown in FIG. 13, it is also good to constitute the form provided on both the inner surface and the lower surface at both side wall plates D _1.

Further, as described above, after inserting the insulating substrate A on which the first lead frame piece B ₁ ′ and the second lead frame piece B ₁ ″ are inserted into the protective cap body D, each lead terminal b ₃ , the root portion to the insulating substrate a of b _4, as shown in FIG. 10 by a two-dot chain line, by applying a non-conductive adhesive E, the lead terminals b _3, b
₄ may be fixed to the protective cap D. Further, the protective cap D
It's may be configured to provide a receiving portion D ₃ and the engaging piece D ₄ which side edge is adapted to Mari engagement fitting of the insulating substrate A when inserting the insulating substrate A within.

[Brief description of the drawings]

FIG. 1 is a perspective view of a lead frame used in an embodiment of the present invention.

FIG. 2 is a perspective view of a lead frame piece obtained by cutting the lead frame to an appropriate length.

FIG. 3 is a perspective view when the lead frame piece is bent and formed in a U-shape.

FIG. 4 is a perspective view when the lead frame piece is divided and cut into a first lead frame piece and a second lead frame piece.

FIG. 5 is a perspective view when the first lead frame piece and the second lead frame piece are mounted on an insulating substrate.

FIG. 6 is a perspective view of a protective cap body.

FIG. 7 is a perspective view when the insulating substrate is inserted into the protective cap.

FIG. 8 is a perspective view when a first lead frame piece and a second lead frame piece mounted on the insulating substrate are outwardly bent and formed.

FIG. 9 is a perspective view showing a state where an insulating substrate is inserted into a protective cap body, and then a side frame is cut off.

FIG. 10 is an enlarged sectional view taken along line XX of FIG. 9;

FIG. 11 is an enlarged sectional view taken along line XI-XI of FIG. 9;

12 is a sectional view taken along the line XII-XII in FIG.

FIG. 13 is a perspective view showing another example of the protective cap body.

FIG. 14 is a plan view of a conventional hybrid integrated circuit device.

FIG. 15 is an enlarged sectional view taken along the line XV-XV in FIG. 14;

[Explanation of symbols]

Reference Signs List A Insulating substrate C Electronic component B Lead frame b ₁ , b ₂ Side frame b ₃ , b ₄ Lead terminal B ₁ Lead frame piece B ₁ ′ First lead frame piece B ₁ ″ Second lead frame piece D Protective cap D ₁ Side wall plate D ₂ groove

Claims (1)

(57) [Claims] 1. A hoop-shaped lead frame formed by integrally forming narrow-width lead terminals between right and left side frames at appropriate intervals along the longitudinal direction of the side frames. And forming a lead frame piece having a length including an appropriate number of lead terminals. Then, the lead frame piece is inserted into the middle of each lead terminal in the lead frame piece. By cutting along the longitudinal direction of the frame piece, a first lead frame piece including one side frame and a plurality of lead terminals integrally connected thereto, and the other side frame and the first lead frame piece are integrally formed therewith. a step of dividing the second lead frame strip comprising a plurality of lead terminals for connecting, the first lead frame piece and a second lead frame strip, insulation It is formed for the left and right side edges of the plate, the tip an insulating surface of a substrate of the respective lead terminals
A step of mounting to connect by an adhesive or soldering or the like to a printed wiring which is, the insulating substrate, the protective cap body made of an insulating material, contact the insulating substrate of each lead terminal
Connection to the printed wiring
Nozomi and the surroundings of the insulating substrate serve as a protective cap.
In definitive closely to the inner surface of the side wall plates, further comprising the steps of each lead terminal is inserted to fit into the groove depressions formed in the side walls of the protective cap body, the first lead frame piece and a second lead frame strip method of mounting the lead terminal in the hybrid integrated circuit device, characterized in that the side frames and a step of disconnecting from the lead terminals.