JPH05206355A - Method of mounting lead terminal in hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce manufacture cost by making a bend nearly U-shaped in cross section at a hoop-shaped lead frame, and dividing it into the first frame piece and the second lead frame, and then, connecting them to an insulating substrate, and cutting off a side frame. CONSTITUTION:A lead frame, where lead terminals b3 and b4 are made at proper pitches between both right and left side frames b1 and b2, is made being bent in the shape of U in cross section. The lead frame is cut into the first lead frame piece B', which includes a side frame b1 and a plurality of lead terminals b3, and the second lead frame piece B1'', which includes a side frame B2 and a plurality of lead frames b4. The first and second lead frame pieces B1' and B1'' are bonded to an insulating substrate A, and then they are inserted to fit in the recess D2 for protecting each lead terminal b2 and b4 inside a protective cap D, and then the side frames b1 and b2 are cut off each lead frame b3 and b4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a method of mounting a plurality of lead terminals on a side edge of the insulating substrate in a hybrid integrated circuit device having a plurality of electronic components such as C, transistors, resistors or capacitors mounted thereon.

[0002]

2. Description of the Related Art Generally, a hybrid integrated circuit device of this type is well known in the prior art, and FIGS.
As shown in FIG. 1, various electronic components such as transistors or resistors are formed on the upper surface and / or the lower surface of an insulating substrate A formed of glass epoxy resin or ceramic in a rectangular shape, and printed wiring is formed While mounting a plurality of C, on the left and right side edges of the insulating substrate A,
A plurality of metal lead terminals b electrically connected to the printed wiring to the various electronic components C are mounted along the side edge of the insulating substrate A at appropriate pitch intervals.

In this case, each lead terminal b is connected to the insulating substrate A.
When the lead terminal b comes in contact with another object, and when the lead terminal c
Insulating substrate A into an appropriate shape
Therefore, in the conventional hybrid integrated circuit device, a bifurcated portion b'is provided at the base end of each lead terminal b as shown in FIGS. 14 and 15, and the bifurcated portion b'is formed. , The side edges of the insulating substrate A are fitted so as to be firmly attached.

On the other hand, when the lead terminals b are mounted on the left and right side edges of the insulating substrate A in the above-described bibritt integrated circuit device at appropriate intervals,
Using a long hoop-shaped lead frame formed by integrally molding a large number of lead terminals at appropriate pitch intervals, cutting a lead frame piece having a length including a predetermined number of lead terminals from this lead frame, This lead frame piece is mounted on an insulating substrate so that each lead terminal of the lead frame piece is electrically connected to a printed wiring on the insulating substrate.

[0005]

In this case, forming the tip of each lead terminal b in the long hoop-shaped lead frame at the forked portion b 'requires a great deal of labor for its processing. However, there is a problem that the manufacturing cost is significantly increased. In addition, there is a limit value in narrowing the interval pitch of the lead terminals in order to form the tip of each lead terminal b in the forked portion b '. In other words, it is difficult to narrow the pitch of the lead terminals. There was also the problem of saying that there was.

The present invention provides a method of mounting lead terminals which does not cause the above problems when mounting the lead terminals on the left and right edges of the insulating substrate at appropriate pitch intervals. This is a technical issue.

[0007]

In order to achieve this technical object, the present invention is to integrate lead terminals of narrow width between left and right side frames at appropriate pitch intervals along the longitudinal direction of the side frames. A hoop-shaped lead frame formed by mechanical shaping is bent into a substantially U-shaped cross section, and cut into lead frame pieces having a length including an appropriate number of lead terminals. By cutting the frame piece along the longitudinal direction of the lead frame piece in the middle of each lead terminal in the lead frame piece, one side frame and a plurality of lead terminals integrally connected to the side frame After dividing into one lead frame piece and a second lead frame piece including the other side frame and a plurality of lead terminals integrally connected to the side frame, The first lead frame piece and the second lead frame piece are attached to the left and right edges of the insulating substrate so that the tips of the lead terminals are connected to the printed wiring of the insulating substrate by adhesion or soldering, and then After inserting the insulating substrate into a protective cap made of an insulating material so that each lead terminal fits into a recessed groove formed in a side wall plate of the protective cap body, the first lead frame piece and the second lead are inserted. The side frame of the frame piece is separated from each lead terminal.

[0008]

[Operation] Since each lead terminal is supported by being fitted into each recessed groove in the protective cap body that covers the entire insulating substrate on which electronic components are mounted, each lead terminal is supported. It is possible to reduce a large force acting on the connection portion of each lead terminal with respect to the insulating substrate when the terminal is formed into a proper shape and when the side frame is separated from each lead terminal. It is possible to avoid forming the connecting portion of the terminal to the insulating substrate into a bifurcated shape as in the conventional case. It can be maintained at a high value without being formed in the part.

[0009]

Therefore, according to the present invention, since it is not necessary to form the tip of each lead terminal integrally formed on the lead frame at the forked portion, the cost required for processing the lead frame can be greatly reduced. Moreover, there is an effect that the pitch between the lead terminals can be made much narrower than in the conventional case.

[0010]

Embodiments of the present invention will now be described with reference to the drawings (FIGS. 1 to 1).
2) will be described. First, as shown in FIG. 1, between the pair of left and right side frames b ₁ and b ₂ , narrow lead terminals b ₃ and b ₄ are provided along the longitudinal direction of the side frames b ₁ and b _2. As shown in FIG. 2, a hoop-shaped lead frame B integrally formed at an appropriate pitch is used, and the lead frame B has a length including a predetermined number of lead terminals b ₃ and b _4. Cut into L lead frame pieces B ₁ .

The lead terminals b ₃ and b ₄ are integrally connected to the tie bar portion b ₅ ,
Although the lead terminals b ₃ and b ₄ are prevented from being deformed, the tie bar portion b ₅ may be omitted. Next, as shown in FIG. 3, the lead frame piece B ₁ is formed into a substantially U shape by bending (note that
In this case, the hoop-shaped lead frame B may be bent into a U shape and then cut into lead frame pieces B ₁ having an appropriate length L).

[0012] Then, the lead frame strip B _1, as shown in FIG. 4, along the middle of each lead terminal b _3, b ₄ in the lead frame strip B ₁ in the longitudinal direction of the lead frame strip B ₁ cut By doing so, the first lead frame piece B ₁ ′ including the one side frame b ₁ and the plurality of lead terminals b ₃ integrally connected to the _one side frame b ₁ , the other side frame b ₂ and the one side frame b ₂ are integrally formed therewith. Second lead frame piece B ₁ ″ including a plurality of lead terminals b ₄ connected to each other
Divide and cut into and.

Then, the first lead frame piece B ₁ '
And the second lead frame piece B ₁ ″ on the left and right edges of the insulating substrate A on which various electronic components C are previously mounted on the surface and printed wiring (not shown) is formed for each electronic component C. On the other hand, the respective lead terminals b ₃ , b
The tip of ₄ is attached to the printed wiring of the insulating substrate A so as to be electrically connected by a conductive adhesive or soldering.

On the other hand, as shown in FIG. 6, an insulating material such as a synthetic resin is formed into a box type having an open lower surface, and a plurality of recessed grooves D are formed on each of the inner side surfaces of the left and right side wall plates D _{1. 2} is prepared at a pitch equal to the pitch between the lead terminals b ₃ and b ₄ , and a protective cap body D is prepared. As shown in FIG. Frame piece B ₁ ′ and second lead frame piece B ₁ ″
The insulating board A on which the lead terminals b ₃ and b ₄ are mounted
Is inserted so as to fit into the respective recessed grooves D ₂ of the protective cap body D.

Then, the first lead frame piece B ₁ '
And a second lead frame strip B ₁ ", as shown in FIG. 8, after Hoomingu processed as bent outwardly facing, the first lead frame piece B ₁ 'and the second
Side frame b ₁ in the lead frame piece B ₁ ″,
The b _2, as shown in FIG. 9, by separating from the lead terminals b _3, b _4, is to a hybrid integrated circuit device having the structure illustrated in FIGS. 10 to 12.

In this way, each lead terminal b ₃ , b
Each ₄ from being supported by the fitting waiting state in each recessed groove D ₂ in the protective cap body D which covers the entire, the respective lead terminals b _3, b ₄ FIG electronic component C with an insulating substrate A When performing the forming as shown in FIG. 8 and separating the side frames b ₁ and b ₂ as shown in FIG. 9, a large force acts on the connection portion of the lead terminals b ₃ and b _{4 to} the insulating substrate A. Therefore, the insulation substrate A of the lead terminals b ₃ and b ₄ can be reduced.
It is possible to avoid forming the connecting portion for the lead wire into a bifurcated shape as in the conventional case. In other words, the connection strength of the lead terminals b ₃ and b ₄ with respect to the insulating substrate A can be determined as in the conventional case. Can be maintained at a high value without forming a fork.

The recessed grooves D ₂ in the left and right side wall plates D ₁ of the protective cap body D are defined by the left and right side wall plates D _{1 respectively.}
Provided in the lower surface, in this the recessed groove D _2, or configured to fit the respective lead terminals b _3, b _4, or the lead terminals b _3, b ₄ and fitting the recessed groove D for
_As shown in FIG. 13, ₂ may be provided on both the inner side surface and the lower surface of both side wall plates D ₁ .

Further, as described above, the first lead frame
Piece B₁'And the second lead frame piece B₁”
Smell after inserting the edge board A into the protective cap body D
Each lead terminal b₃, B_FourAttaching to insulating board A
As shown by the chain double-dashed line in Fig. 10, a non-conductive contact is made at the root.
By applying the adhesive E, each lead terminal b₃, B
_FourMay be fixed to the protective cap D.
Is inside the protective cap body D.
When the insulating substrate A is inserted into the inside, the side edge of the insulating substrate A is
Receiving part D that is fitted and engaged₃And engaging piece D_FourAnd
It may be configured to be provided.

[Brief description of drawings]

FIG. 1 is a perspective view of a lead frame used in an embodiment of the present invention.

FIG. 2 is a perspective view of a lead frame piece obtained by cutting the lead frame to an appropriate length.

FIG. 3 is a perspective view when the lead frame piece is bent and formed in a U shape.

FIG. 4 is a perspective view when the lead frame piece is divided and cut into a first lead frame piece and a second lead frame piece.

FIG. 5 is a perspective view when the first lead frame piece and the second lead frame piece are mounted on an insulating substrate.

FIG. 6 is a perspective view of a protective cap body.

FIG. 7 is a perspective view when the insulating substrate is inserted into the protective cap body.

FIG. 8 is a perspective view of a first lead frame piece and a second lead frame piece mounted on the insulating substrate when they are outwardly bent and homed.

FIG. 9 is a perspective view showing a state in which the side frame is separated after inserting the insulating substrate into the protective cap body.

FIG. 10 is an enlarged sectional view taken along line XX of FIG.

FIG. 11 is an enlarged sectional view taken along line XI-XI of FIG. 9.

12 is a sectional view taken along line XII-XII of FIG.

FIG. 13 is a perspective view showing another example of a protective cap body.

FIG. 14 is a plan view of a conventional hybrid integrated circuit device.

15 is an enlarged sectional view taken along line XV-XV of FIG.

[Explanation of symbols]

A Insulating substrate C Electronic component B Lead frame b ₁ , b ₂ Side frame b ₃ , b ₄ Lead terminal B ₁ Lead frame piece B ₁ ′ First lead frame piece B ₁ ″ Second lead frame piece D Protective cap body D ₁ Side wall plate D ₂ groove

Claims (1)

[Claims] 1. A hoop-shaped lead frame formed by integrally molding narrow lead terminals between the left and right side frames along the longitudinal direction of the both side frames at appropriate pitch intervals. A step of bending and forming into a letter shape and a step of cutting into a lead frame piece having a length including an appropriate number of lead terminals are performed, and then this lead frame piece is lead in the middle of each lead terminal in the lead frame piece By cutting along the longitudinal direction of the frame piece, a first lead frame piece including one side frame and a plurality of lead terminals integrally connected to the side frame, and the other side frame and the one side frame are integrally formed. After dividing into a second lead frame piece including a plurality of lead terminals connected to each other, the first lead frame piece and the second lead frame piece are insulated from each other. To the left and right side edges in,
Attach the tip of each lead terminal to the printed wiring of the insulating substrate so as to connect it by adhesion or soldering, and then
After inserting the insulating substrate into a protective cap made of an insulating material so that each lead terminal fits into a recessed groove formed in a side wall plate of the protective cap body, the first lead frame piece and the second lead frame are inserted. A lead terminal mounting method in a hybrid integrated circuit device, characterized in that a side frame of one piece is separated from each lead terminal.