JP2001060842A - Small-sized electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and reliably mount an insulator for insulating the base of a small-sized electronic part and a substrate on which the small-sized electronic part is mounted on the electronic part in a short time. SOLUTION: In a crystal resonator 14 provided with a base 15 having a 1st lead insertion hole and formed of conductive material, a piece of quartz crystal 19 provided on the base 15, a cap 18 connected to the base 15 and internally and hermetically sealing the piece of quartz crystal, a lead 16 which is inserted into a 1st lead insertion hole provided in the base 15 and connected to the piece of quartz crystal and a 1st insulation part which is provided in a gap between the lead 16 and the inner circumferential face of the 1st lead insertion hole, hermetically seals the cap and also electrically insulates the lead 16 and the base 15, a 2nd insulation part 20 for insulating the base 15 and a substrate 12 on which the resonator 14 is mounted is made to engage with a protrusion 29 and mounted on the resonator 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small electronic component whose inside is hermetically sealed such as a quartz oscillator, a quartz oscillator, a SAW filter (comb filter), and the like.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional small electronic component such as a quartz oscillator. This crystal resonator 1 has a base 2. As shown in the plan view of FIG. 4A, the base 2 has a contour shape in which both ends are formed by arcs and the arcs at both ends are connected by straight lines parallel to each other. is a ₁ is about 3 mm, lateral length B ₁
Is about 11 mm). FIG. 4 (b)
As shown in the figure, two first lead insertion holes 3 are provided at both ends.
(The right one is shown in the figure.) Each of these first lead insertion holes 3 has a diameter C ₁ of about 1.75 mm.
And each first lead insertion hole 3 has a diameter D _1.
The lead 4 having a circular cross section of about 0.45 mm is inserted. A glass insulating portion 5 is provided in a gap between the lead 4 and the inner peripheral surface of the first lead insertion hole 3. The glass insulating portion 5 hermetically seals the gap and electrically insulates the lead 4 from the base 2. As the glass insulating portion 5, borosilicate glass or the like is used. At the upper end of each of these two leads 4, there is provided a holding portion 6 electrically connected to the leads 4. The two holding portions 6 hold a rectangular flat plate-shaped crystal piece 7 whose both ends are electrically connected to each holding portion 6. In order to seal the crystal blank 7, a cap 8 is resistance-welded (electrically welded) to the base 2 so as to cover the crystal blank 7. The cap 8 and the holding unit 6
Is made of nickel silver (Cu-Ni-Zn alloy), and the material of base 2 and lead 4 is made of Kovar (Fe-Ni-Co alloy)
And both are conductors.

Further, an insulating plate 9 is provided on the lower surface of the base 2 by bonding with an adhesive. This insulating plate 9 is used for the base 2
It is a rectangular plate-like body slightly larger than the first plate, and has two second lead insertion holes 10. Each second lead insertion hole 1
The lead 4 is inserted through each of the 0's. The reason why the insulating plate 9 is bonded to the lower surface of the base 2 with an adhesive is to prevent the insulating plate 9 from coming off the lower surface of the base 2 when assembling the crystal unit 1. Each lead 4 is shown in FIG.
As shown in (c), it is cut into a predetermined length, pressed flat, and bent outward at a right angle along the lower surface of the insulating plate 9. The tip of each bent lead 4 is accommodated in a groove 11 provided on the lower surface of the insulating plate 9.

As shown in FIG. 4C, the crystal resonator 1 with the insulating plate 9 configured as described above solders each lead 4 to a corresponding wiring 13 printed on a substrate 12. By doing so, it can be mounted on the substrate 12. According to the crystal unit 1 with the insulating plate 9, the base 2
Since the insulating plate 9 is arranged between the lower surface of the substrate 12 and the wiring 13 provided on the substrate 12, the insulating plate 9 causes a short circuit between the base 2 and the wiring 13 of the substrate 12, and the connection between the base 2 and the lead 4. Can be prevented from being short-circuited. If a short circuit occurs between the base 2 and the wiring 13 of the substrate 12 or a short circuit occurs between the base 2 and the lead 4, problems such as an inability to obtain appropriate vibration characteristics of the crystal blank 7 occur.

[0005]

However, in the conventional crystal unit 1 shown in FIG. 4, the insulating plate 9 is bonded to the base 2 with an adhesive, and the adhesive is dried for a relatively long time. Need. When the process of bonding the insulating plate 9 to the base 2 is automated because the handling of the adhesive is difficult, the crystal unit 1 with poor bonding of the insulating plate 9 to the base 2 may be manufactured. For this reason, there is a problem that the process of assembling the crystal unit 1 and bonding the insulating plate 9 to the base 2 cannot be performed in a consistent assembly line. When an adhesive is used, the adhesive may adhere to the lower surface of the insulating plate 9 and the leads 4. When such a crystal resonator 1 is mounted on the substrate 12, the adhesive is provided on the leads 4 and the substrate 12. Continuity failure with the wiring 13 may occur.

SUMMARY OF THE INVENTION The present invention provides a small-sized electronic component that can easily and reliably attach a second insulator to an electronic component and does not cause poor conduction with wiring when mounted on a substrate. The purpose is to provide.

[0007]

According to a first aspect of the present invention, there is provided a small-sized electronic component comprising: a base having a first insertion hole and formed of a conductive material; an element provided on the base; A cap that is connected to the base so as to cover and hermetically seals the element therein, a terminal that is inserted through a first insertion hole provided in the base, and one end of which is connected to the element; A small insulator provided in a gap between the inner peripheral surface of the hole and hermetically sealing the gap and electrically insulating the terminal and the base from each other; A second insulator for electrically insulating a base of the component and a substrate on which the small electronic component is mounted is fitted to and attached to the small electronic component. is there.

According to a second aspect of the present invention, in the small electronic component according to the first aspect, the second insulator is a plate-like body and is disposed on the lower surface side of the base, and the second insulator is provided with a second terminal. It is characterized by having two insertion holes.

According to the small electronic component of the first invention,
The second insulator can be fitted and attached to the small electronic component, and the base of the small electronic component and the substrate can be electrically insulated by the second insulator.

According to the small electronic component of the second invention,
Since the terminal is inserted through the insertion hole of the second insulator, the base of the small electronic component and the terminal can be electrically insulated by the second insulator.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment in which a small electronic component according to the present invention is applied to a crystal unit 14 will be described with reference to FIGS. FIG. 1 shows that the crystal unit 14 has the second insulating unit 2.
FIG. 2 is a view showing a state in which the quartz oscillator 14 is attached.
FIG. 3 is a diagram showing the second insulating unit 20. 15 is a base, 16 is a lead, 17 is a first insulating portion, 18 is a cap, 19 is a crystal blank,
Reference numeral 20 denotes a second insulating unit. The base 15 is shown in FIG.
As shown in (a) and (b), the planar shape is substantially rectangular (vertical length A ₂ is about 3.5 mm, horizontal length B ₂ is about 6.0 m
m), and two first lead insertion holes 21 are provided along the right edge of the base 15 at intervals in the vertical direction. These two first lead insertion holes 2
1 is about 1.4 mm in the vertical direction. Each first lead insertion hole 21, the diameter C ₂ is a circular hole of about 1.0 mm. The base 15 is provided with a flange portion 22 along the outer peripheral edge, and a welded portion is formed on the upper surface of the flange portion 22 over a substantially rectangular annular range.

The lead 16 has a diameter D as shown in FIG.
₂ is a linear body having a circular cross section of about 0.27 mm, and a disc-shaped contact member 16a is provided at the upper end thereof.
The contact member 16a is connected to the first insulating portion 17 and the lead 16
This is for increasing the contact area with the first insulating portion 17. Each lead 16 has a center line parallel to the hole direction of each first lead insertion hole 21 so that each first lead
At the center of the lead insertion hole 21.

The first insulating portion 17 is, for example, a glass containing ceramic, and its main composition is a mixture of borosilicate glass and alumina or zirconia. The first insulating portion 17 is provided in a gap between the lead 16 and the inner peripheral surface of the first lead insertion hole 21, hermetically seals this gap, and electrically connects the lead 16 and the base 15. Insulated.

As shown in FIG. 2, on the upper surface of a contact member 16a provided at the upper end of each of the two leads 16, the right end of one rectangular flat plate-shaped crystal piece 19 is provided. They are bonded by a conductive adhesive. In this manner, the right end of the crystal piece 19 is electrically connected to the two contact members 16a, and is provided in parallel with the base 15, as shown in FIG. The left end of the crystal blank 19 is supported by an insulating support 23.
This insulating support 23 is provided on the base 15. The lead 16 shown in FIG. 1 is obtained by cutting the lead 16 shown in FIG. 2 to a predetermined length, pressing the lead flat, and bending the pressed tip at a right angle.

As shown in FIG. 2, the cap 18 has a substantially rectangular planar shape equivalent to that of the base 15, and has a cup shape opening downward. The cap 18 is a piece of crystal 1
In order to seal 9, a welded portion formed on the lower surface of lower opening edge 18 a of cap 18 so as to cover crystal piece 19 is formed on the upper surface of flange 22 of base 15. Resistance welding (electric welding) is performed on the part to be welded. The material of the cap 18 is nickel silver (Cu-Ni-Zn alloy), and the material of the base 15 and the lead 16 is Kovar (Fe-
Ni-Co alloy), both of which are conductors.

Next, a description will be given of the second insulating portion 20 which is a feature of the present invention. The second insulating portion 20 is made of, for example, synthetic resin having an insulating property, and as shown in FIGS. 1 and 3,
Rectangular plate-shaped part 2 whose plane shape is slightly larger than base 15
4 is provided. This plate-like portion 24 is formed with a 4
Side walls 25, 26, 27, 28 are provided along each of the three sides. A total of four protrusions 29 projecting inward are provided at the four corners of the side walls 25 to 28 having a rectangular planar shape. As shown in FIG. 1, each of the side walls 25 to 28 has a rectangular inner peripheral surface of the side wall that is attached to the plate-like portion 24 so that the outer peripheral edge of the quartz vibrator 14 is It is formed so as to be able to stop the movement of the crystal unit 14 on the plate-shaped portion 24 by being surrounded by a small gap. Then, each projection 29 is attached to each projection 2 in a state where the crystal unit 14 is in close contact with the plate-shaped portion 24.
The lower edge 9 is in contact with the upper surface of the lower opening edge 18a of the cap 18 and is pressed with a predetermined force, so that the movement of the crystal resonator 14 in the direction of coming off from the plate portion 24 can be locked. It is formed as follows.

As shown in FIG. 1 and FIG. 3, the plate-like portion 24 is spaced apart from each other in the vertical direction along the right edge.
The second lead insertion holes 30 are provided. Each of the two second lead insertion holes 30 is provided at a position corresponding to each of the two first lead insertion holes 21 with the second insulating portion 20 attached to the lower surface of the crystal unit 14. It is. Each second
The lead insertion hole 30 is a circular hole having substantially the same size as the first lead insertion hole 21. The lower surface of the second insulating portion 20 is provided with grooves 31 that are parallel to each other over a range from each second lead insertion hole 30 to the right edge of the plate portion 24. Each groove 31 is formed such that the lower surface of the lead 16 projects substantially the same height as the lower surface of the plate-shaped portion 24 or slightly outwards in a state in which the flat pressed lead 16 is accommodated. As shown in FIGS. 3A and 3B, the plate-like portion 2
Four second lead insertion holes 30 are provided along the left side edge of No. 4, and a groove 31 is provided over the range from each second lead insertion hole 30 to the left side edge. These left second lead insertion holes 30 and grooves 31 are symmetrical in shape and equivalent to the right second lead insertion holes 30 and grooves 31, and therefore, detailed description thereof is omitted. The reason for providing the second lead insertion hole 30 and the groove 31 on the left side is that when the second insulating portion 20 is fitted and attached to the lower surface of the crystal unit 14, the left and right sides of the second insulating portion 20 are formed. This is so that each lead 4 can be inserted into the second lead insertion hole 30 irrespective of the direction. 32 shown in FIG. 1 and FIG.
Forming hole required for forming the insulating portion 20 of FIG.

Next, a procedure for assembling the crystal unit 14 to which the second insulating unit 20 shown in FIG. 1 is attached will be described. First, the crystal oscillator 14 shown in FIG. 2 is assembled and completed. Next, each lead 16 of the crystal unit 14 is cut to a predetermined length and pressed so that the tip portion has a flat shape. Thereafter, each of the two leads 16 is connected to the second insulating portion 2.
0, the base 15 side of the crystal unit 14 is inserted into the second insulating portion 2.
0 is pushed into the inside of the side walls 25 to 28 with a predetermined force. At this time, the second insulating portion 20 is so formed that each projection 29 spreads outward.
Is elastically deformed, and the second insulating portion 20 is fitted to the crystal unit 14. Thereafter, the two leads 16 are bent at right angles as shown in FIG. Thus, the assembly of the crystal unit 14 to which the second insulating unit 20 shown in FIG. 1 is attached is completed. The crystal unit 14 to which the second insulating unit 20 is attached is shown in FIG.
As shown in (c), each lead 16 can be mounted on the board 12 by soldering to each corresponding wiring 13 printed on the board 12.

According to the crystal unit 1 with the second insulating portion 20, the second insulating portion 20 is arranged between the lower surface of the base 2 and the wiring 13 provided on the substrate 12, and Since the lead 16 is configured to be inserted into the second lead insertion hole 30 of the second insulating portion 20 and housed in the groove 31, the base 15 and the wiring 13 are formed by the second insulating portion 20.
Short circuit, and short circuit between the base 15 and the lead 16 can be prevented. As a result, failures caused by these short circuits can be prevented.

Then, the second insulating portion 20 is connected to the quartz oscillator 1
4, the second insulating portion 20 can be easily and securely attached to the crystal unit 14 in a short time. This makes it possible to automate the process of attaching the second insulating unit 20 to the crystal unit 14, and as a result, the process of assembling the crystal unit 14 and attaching the second insulating unit 20 to the crystal unit 14 can be performed. Can be performed on a consistent assembly line.

However, in the above embodiment, FIG.
As shown in (a), the projection 29 is provided at each of the four corners of the side walls 25 to 28 having a rectangular planar shape. However, instead of this, the projection 29 is provided on the second insulating portion 20. Lateral direction (B
₍ Longitudinal direction ₂ ) on both side walls 27, 28 on both sides. Of course, the projections 29 are formed on the side walls 25 to 28.
May be provided at a desired location or may have a desired shape. The point is that the second insulating section 20 can be easily fitted to and attached to the crystal unit 14.
What is necessary is just to be able to connect the crystal oscillator 14 and the crystal resonator 14 so that they do not easily come off.

In the above-described embodiment, the contact member 16a is provided on the upper end of the lead 16, and the crystal piece 19 is adhered to the upper surface of the contact member 16a. A configuration may be adopted in which a holding section is provided on the upper side, and the crystal piece 19 is held by the holding section. Also,
In the above-described embodiment, as shown in FIG. 2, the present invention is applied to the crystal resonator 14 having a configuration in which two leads 16 are connected to the right end of the crystal piece 19, but instead of this, the crystal piece 19
The present invention may be applied to a crystal resonator having a configuration in which leads are connected to respective left and right ends of the crystal resonator.

Further, in the above embodiment, the first insulating portion 1
Although glass with ceramics is used as 7, other insulating materials may be used. In other words, any material can be used as long as it can insulate between the lead and the base and hermetically seal the gap between them. In the above embodiment, the present invention is applied to the crystal resonator provided with the crystal piece 19 as an element.
It can be applied to AW filters (comb filters) and the like. In short, the present invention can be applied to small electronic components. Further, in the above-described embodiment, the material of the second insulating portion 20 is a synthetic resin having an insulating property, but other materials may be used. In short, any material having insulation properties and elastically deforming at the time of fitting may be used.

[0024]

According to the small electronic component according to the first aspect of the present invention, the second insulator for electrically insulating the base of the small electronic component from the substrate is fitted and attached to the small electronic component. Because of this configuration, the second insulator can be easily and securely attached to the small electronic component in a short time. Accordingly, the process of attaching the second insulator to the small electronic component can be automated, and as a result, the process of assembling the small electronic component and attaching the second insulator to the small electronic component can be performed with a consistent assembly line. It can be carried out. And since no adhesive is used to attach the second insulator to the small electronic component, no bonding failure occurs, and when the electronic component is mounted on the substrate, the adhesive causes There is no occurrence of poor conduction between the wiring and the terminal.

According to the small electronic component of the second invention,
Since the terminal is configured to be inserted through the insertion hole of the second insulator, the base of the small electronic component and the terminal can be electrically insulated by the second insulator. Failure and performance degradation of the small electronic component due to the short circuit can be prevented.

[Brief description of the drawings]

FIG. 1 shows a second embodiment of a crystal resonator according to an embodiment of the present invention.
FIGS. 3A and 3B are diagrams showing a state in which the insulating unit is attached, wherein FIG. 3A is a plan view, FIG.

FIG. 2 is a diagram showing a crystal resonator according to the embodiment;
(A) is a top view, (b) is a partial sectional front view.

FIGS. 3A and 3B are views showing a second insulating portion according to the same embodiment, where FIG. 3A is a plan view, FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A, and FIG. FIG. 4 is a cross-sectional view as viewed from the direction BB of FIG.

4A and 4B are diagrams showing a state in which an insulating plate is attached to a conventional crystal unit, wherein FIG. 4A is a plan view, FIG. 4B is a partial cross-sectional front view, and FIG. It is sectional front view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 14 Quartz crystal oscillator 15 Base 16 Lead 17 First insulating part 18 Cap 19 Quartz piece 20 Second insulating part 21 First lead insertion hole 29 Projection 30 Second lead insertion hole

Claims (2)

[Claims] 1. A base having a first insertion hole and formed of a conductive material, an element provided on the base, and an element hermetically sealed inside the base so as to cover the element. A cap to be stopped, a terminal inserted into the first insertion hole provided in the base, one end of which is connected to the element, and a gap between the terminal and the inner peripheral surface of the first insertion hole. A small electronic component including a first insulator that hermetically seals and electrically insulates the terminal from the base. The base of the small electronic component and a substrate on which the small electronic component is mounted. A second insulator for electrical insulation,
A small electronic component characterized by being fitted to and attached to the small electronic component. 2. The small electronic component according to claim 1, wherein the second insulator is a plate-like body and is disposed on the lower surface side of the base, and the second insertion hole through which the terminal is inserted. A small electronic component comprising: