JPH0529870A - Chip-type surface wave device - Google Patents
Chip-type surface wave deviceInfo
- Publication number
- JPH0529870A JPH0529870A JP18224091A JP18224091A JPH0529870A JP H0529870 A JPH0529870 A JP H0529870A JP 18224091 A JP18224091 A JP 18224091A JP 18224091 A JP18224091 A JP 18224091A JP H0529870 A JPH0529870 A JP H0529870A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- chip
- metal cap
- chip carrier
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は映像機器などに使用され
る絶縁処理した封止用金属キャップを備えたチップ型表
面波デバイスに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type surface acoustic wave device having an insulating metal cap for use in video equipment and the like.
【０００２】[0002]
【従来の技術】以下に従来のチップ型表面波フィルタに
ついて説明する。2. Description of the Related Art A conventional chip type surface acoustic wave filter will be described below.
【０００３】図２に示すように、導電パターン２を形成
したチップキャリア１内に表面波フィルタ素子３を接着
固定し、ワイヤ４をチップキャリア１にボンディングし
た後、封止用金属キャップ５で覆い、チップキャリア１
にその封止用金属キャップ５を溶接して封止した構成で
ある。As shown in FIG. 2, a surface wave filter element 3 is bonded and fixed in a chip carrier 1 on which a conductive pattern 2 is formed, and a wire 4 is bonded to the chip carrier 1 and then covered with a sealing metal cap 5. , Chip carrier 1
The metal cap 5 for sealing is welded to and sealed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記の従
来の構成では金属キャップ５は平板であり、チップキャ
リア１の内側面に嵌合する形で同等寸法であっても溶接
の際に位置ずれを起こし、所定の位置に確実に溶接する
ことが困難であるという問題点を有していた。However, in the above-mentioned conventional structure, the metal cap 5 is a flat plate, and even if the metal cap 5 is fitted to the inner surface of the chip carrier 1 and has the same size, a positional deviation occurs during welding. However, there is a problem that it is difficult to surely weld at a predetermined position.
【０００５】本発明は上記従来の問題点を解決するもの
で、溶接時に封止用金属キャップの位置ずれおよびスプ
ラッシュを抑制でき、かつボンディングされたワイヤと
封止用金属キャップとを絶縁できる高性能で信頼性の高
いチップ型表面波デバイスを提供することを目的とす
る。The present invention solves the above-mentioned problems of the prior art, and is capable of suppressing displacement and splash of the sealing metal cap during welding, and insulating the bonded wire and the sealing metal cap from each other. And a highly reliable chip-type surface acoustic wave device.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明のチップ型表面波デバイスは、チップキャリア
の内側面に嵌合する形状の絶縁性樹脂を固着させた封止
用金属キャップを備えた構成としている。In order to achieve this object, a chip type surface acoustic wave device of the present invention is provided with a sealing metal cap having an insulating resin fixed to the inner surface of a chip carrier. It is configured to be equipped.
【０００７】[0007]
【作用】この構成によって、封止用金属キャップの位置
ずれをなくすることとなり、かつボンディングされたワ
イヤと封止用金属キャップを絶縁することとなる。With this structure, the displacement of the sealing metal cap can be eliminated, and the bonded wire and the sealing metal cap can be insulated.
【０００８】[0008]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【０００９】本発明の一実施例を示す図１では、従来例
と同一部品に同一番号を付して説明は省略する。In FIG. 1 showing an embodiment of the present invention, the same parts as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted.
【００１０】図１に示すように、表面波フィルタ素子３
をチップキャリア１に接着固定しワイヤ４をボンディン
グした後、チップキャリア１に面する側の表面にチップ
キャリア１の内側面に嵌合する形状にシリコーン等の絶
縁性樹脂６を予めスクリーン印刷した封止用金属キャッ
プ７で覆い、チップキャリア１にその封止用金属キャッ
プ７を溶接して封止する。As shown in FIG. 1, the surface acoustic wave filter element 3
After the adhesive is fixed to the chip carrier 1 and the wires 4 are bonded, an insulating resin 6 such as silicone is screen-printed in advance on the surface of the side facing the chip carrier 1 to fit the inner surface of the chip carrier 1. The metal cap 7 for sealing is covered, and the metal cap 7 for sealing is welded to the chip carrier 1 for sealing.
【００１１】上記の構成によって絶縁性樹脂６で封止用
金属キャップ７の位置決めを行うので、溶接時の位置ず
れがなくなり、容易に封止することができる。Since the metal cap 7 for sealing is positioned by the insulating resin 6 according to the above-described structure, the positional displacement during welding is eliminated and the sealing can be easily performed.
【００１２】しかも、封止用金属キャップ７の位置ずれ
がなくなるので、気密も確保でき、作業性が向上し高性
能でしかも安定した特性にできる。Moreover, since the displacement of the sealing metal cap 7 is eliminated, airtightness can be secured, workability is improved, and high performance and stable characteristics can be obtained.
【００１３】また、絶縁性を有しているので、封止用金
属キャップ７とワイヤ４との接触によるショート不良を
防止し、信頼性を高くできる。Further, since it has an insulating property, it is possible to prevent a short circuit defect due to the contact between the sealing metal cap 7 and the wire 4 and to improve the reliability.
【００１４】[0014]
【発明の効果】以上のように本発明は、封止用金属キャ
ップの片面にシリコーン等の絶縁性樹脂をチップキャリ
アの内側面に嵌合する形状にスクリーン印刷することに
より、封止用金属キャップの位置ずれをなくし、ボンデ
ィングされたワイヤと封止用金属キャップとを絶縁する
ことができ、さらに、溶接時のスプラッシュも抑えるこ
とができる高性能で信頼性の高い優れたチップ型表面波
デバイスを実現できるものである。As described above, according to the present invention, a metal cap for sealing is formed by screen-printing an insulating resin such as silicone on one surface of the metal cap for sealing so as to be fitted to the inner surface of the chip carrier. A high-performance and highly reliable chip-type surface wave device that can eliminate the positional deviation of the wire, insulate the bonded wire from the sealing metal cap, and can suppress the splash at the time of welding. It can be realized.
【図１】本発明の一実施例のチップ型表面波デバイスの
断面図FIG. 1 is a cross-sectional view of a chip type surface acoustic wave device according to an embodiment of the present invention.
【図２】従来のチップ型表面波フィルタの断面図FIG. 2 is a cross-sectional view of a conventional chip surface acoustic wave filter.
１ チップキャリア ３ 表面波フィルタ素子 ６ 絶縁性樹脂 ７ 封止用金属キャップ 1 Chip Carrier 3 Surface Wave Filter Element 6 Insulating Resin 7 Metal Cap for Sealing
Claims (1)
リアの内側面に嵌合する形状の絶縁性樹脂を予め固着さ
せた封止用金属キャップを備えたチップ型表面波デバイ
ス。Claim: What is claimed is: 1. A chip-type surface acoustic wave device comprising: a metal cap for sealing, wherein an insulating resin having a shape to be fitted to the inner surface of the chip carrier is fixed in advance on the surface facing the chip carrier. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18224091A JPH0529870A (en) | 1991-07-23 | 1991-07-23 | Chip-type surface wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18224091A JPH0529870A (en) | 1991-07-23 | 1991-07-23 | Chip-type surface wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529870A true JPH0529870A (en) | 1993-02-05 |
Family
ID=16114798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18224091A Pending JPH0529870A (en) | 1991-07-23 | 1991-07-23 | Chip-type surface wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529870A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105958959A (en) * | 2016-06-29 | 2016-09-21 | 维沃移动通信有限公司 | Crystal oscillator and production method thereof |
| CN105958960A (en) * | 2016-06-29 | 2016-09-21 | 维沃移动通信有限公司 | Crystal oscillator and production method of crystal oscillator |
| CN106169918A (en) * | 2016-06-29 | 2016-11-30 | 维沃移动通信有限公司 | A kind of crystal oscillator and manufacture method thereof |
-
1991
- 1991-07-23 JP JP18224091A patent/JPH0529870A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105958959A (en) * | 2016-06-29 | 2016-09-21 | 维沃移动通信有限公司 | Crystal oscillator and production method thereof |
| CN105958960A (en) * | 2016-06-29 | 2016-09-21 | 维沃移动通信有限公司 | Crystal oscillator and production method of crystal oscillator |
| CN106169918A (en) * | 2016-06-29 | 2016-11-30 | 维沃移动通信有限公司 | A kind of crystal oscillator and manufacture method thereof |
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