JPH0334861B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to crystal elements, integrated circuit (IC) substrates,
The present invention relates to an insulating hermetic seal type leadless package that houses a composite element circuit board, other elements, etc.

[Conventional technology]

Conventional hermetically sealed package cages have multiple lead wires extending downward, and when mounting the package on a printed circuit board, these lead wires are inserted into predetermined small holes in the printed circuit board. However, soldering was performed on the back side of the printed circuit board using an automatic soldering device or the like.

In such conventional packages, when the package is mounted on a printed circuit board, the small holes in the printed circuit board may not be filled with solder sufficiently, thus impairing the electrical continuity between the package and the printed circuit board. There was a problem. Additionally, if this package is used to house a vertical element such as a crystal element, the height will be higher than other components when mounted on a printed circuit board, resulting in unnecessary space. There was also the problem of not being able to quickly respond to the miniaturization and thinning of printed circuit boards. Furthermore, the presence of lead wires can cause damage, such as when unintentional force is applied when correcting bends in the lead wires, which can destroy the fused interface between the lead wires and the glass, or lead deformation in the case of multiple leads, causing damage to the printed circuit board. There are also problems such as difficulty in inserting the

A type of leadless package called a "chip carrier" for storing IC boards is already well known, but since this chip carrier is mainly made of resin, it has poor heat resistance or moisture absorption. There were cases where insulation resistance or airtightness decreased.

[Problem that the invention seeks to solve]

The present invention provides an insulating, hermetically sealed, leadless package that solves the various problems mentioned above. In other words, the lead is reliable and easy to mount on a printed circuit board, has a low height when mounted on a printed circuit board, has excellent heat resistance, insulation, and airtightness, and can also be mounted on hybrid integrated circuit boards such as ceramics. The purpose is to provide a respackage.

[Means for Solving the Problems] In order to solve these problems, the present invention provides a container body made of a metal plate having a flange portion around the periphery for attaching a lid, and a container body comprising a metal plate on at least the lower surface of the container body. A glass serving as an insulating material provided therein and a plurality of electrodes having thin flat parts that contact the lower surface or side surface of the glass and extending onto the vessel body by penetrating the inside of the glass are sealed in an airtight and insulated manner. A leadless package is provided.

A plurality of small holes are formed in the container body, and the electrodes pass through the small holes, and among the electrodes, only the ground electrode is conductively sealed from the container body at the penetration part, and the other electrodes are electrically sealed. The electrode needs to be insulated and sealed from the vessel body at the through-hole. Further, the container body is composed of the peripheral flange portion and a central concave region or a convex region, the electrode through hole is formed in the concave region or the convex region, and the glass is formed in the concave region or the convex region of the container body. It is sealed to the container body extending over the side wall of the convex region.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

1 and 2 show a first embodiment of the present invention. As shown in Figure 2, the vessel body 1 is an iron-nickel-cobalt alloy (commonly known as Kovar).
A plate-shaped body is processed into a rectangular shape using a press molding machine, and a thin flange part 3 for attaching a lid 2 (Fig. 1) is formed on the periphery, and a rectangular concave area is formed in the center part. 4 is formed.

This recessed region 4 has a bottom surface 4a and a side wall 4b, and four small holes 5, 5a for electrode insertion are formed in the bottom surface 4a. 3 of these small holes 5, 5a
The pore diameter at one location 5 is relatively large, and the pore diameter at one location 5a is relatively small. The glass block 6 is press-molded from borosilicate-based powder glass, and has a concave shape corresponding to the outside or lower surface of the concave area 4 of the vessel body 1, and has a concave shape corresponding to the small holes 5, 5a of the vessel body 1. It has a small hole 7. In addition, glass block 8
is made of the same material as glass block 6, and is made of the same material as glass block 6.
Similarly, a rectangle corresponding to the inside of the concave area 4 of the container body 1
It has a small hole 9 at a position corresponding to the small holes 5, 5a. Alternatively, the position corresponding to the small hole 5a may be a notch 9a as shown. In FIG. 2, glass blocks 6 and 8 are fitted into the container 1 from the lower and upper sides of the container 1, and electrodes 10
(Fig. 1) in four small holes 5, 5a, 7, 9, 9.
a and housed in a carbon jig (not shown), and a conductive material is attached to the inner lead part of the electrode so that one of the four electrodes 10 (the electrode inserted into the small hole 5a) serves as a ground electrode. (for example, silver solder) is heated and welded in an electric furnace (not shown), and the first
A hermetically sealed leadless package 20a as shown in Figure b is obtained. Note that FIG. 1a is a partially cutaway perspective view of the lid 2 attached to the flange portion 3 of the vessel body 1, and FIG. 1c is a partially cutaway perspective view of the glass block 8.
Package 2 manufactured without using (Fig. 2)
It is 0b.

In FIG. 1, the glass 6 is sealed from the lower surface of the metal container 1 to the side wall 4b, and the electrode 10 has a flat portion 10a that contacts the lower surface of the glass 6 as described later. It penetrates the inside of the container body 1 and extends onto the container body 1 through the small holes 5 and 5a of the container body 1. The electrodes 10 other than the ground electrode passing through the small hole 5 are insulated from the container body 1, and
A ground electrode passing through a is electrically connected to the vessel body 1. Package cages 20a and 20b after completion
A crystal element, an IC board, a composite element circuit board, and other elements are mounted on the holder, and after being connected to the electrode 10, the lid 2 is attached.

Figures 3a, b, and c show a second embodiment of the present invention, which differs from the first embodiment in Figure 1 in that the vessel body 1 is flat without a concave area. It is a point. On the other hand, a burring (convex shape) 11 that digs into the inside of the glass is formed in the electrode insertion hole 5 in order to improve the adhesion and airtightness between the metal container body and the glass, and to obtain the strength of the container body. .

Figures 4a, b, and c show a third embodiment of the present invention, which differs from the first embodiment in Figure 1 as follows:
The main difference is that a convex region 12 is formed in the center of the container body 1 instead of a concave region. In this embodiment as well, the glass 6 extends over the side wall 4b of the vessel body 1.

Figures a to g show various cross-sectional shapes of the flange part 3 of the vessel body 1, and in a, b, and c, the thickness of the attachment part of the lid 2 is made thinner than the other parts of the vessel body. d, e, and f are provided with a thinner and weaker part 31 on the inside of the flange part 3, and g is provided with a folded part 32 to be used when sealing the lid 2. This absorbs the thermal or mechanical strain of the flange portion 3 and prevents it from being transmitted to the sealing interface between the container body 1 and the glass portion.

Figures 6a to 6g show that when the lid 2 and the container body 1 are joined and sealed, they are shaped so that they can be easily positioned, and they are also made with resistance welding (projection welding, etc.) and solder sealing. Dust generated during sealing (melted metal, solder molten gas, flux, etc.)
In order to prevent the infiltration of foreign matter from affecting the storage element, the flange portion 3 of the container body 1 and the flange portion of the lid 2 are shaped as shown in the figure.

Figures 7a to 7h show various modifications of the container body 1, and in a to c, a relatively large rectangular or round hole 41 is provided in the center of the container body 1, including a portion through which the electrode passes. In b and c, there is a burring 42 around the hole.
has been established. d to f are individual holes 5 through which each electrode passes, and e and f are burrings 11.
has been established. g and h have a convex portion 4 on the shape of d.
3 or a recess 44 is added. Note that the protrusions and recesses may be added not only to the bottom surface but also to the side surfaces.
These burrings or uneven portions have the effect of increasing the strength of the vessel itself and increasing the area of contact with the glass.

8a to 8j show various modifications of the electrode 10. FIG. In the present invention, as described above, the electrode 10 has a flat part 10a that is sealed by contacting the lower surface or side surface of the glass 6, and also penetrates the inside of the glass 6 and the electrode passage holes 5, 5a of the container body. It has a lead portion extending onto the container body 1. In FIG. 8, a to d are made of metal wires, and the lower end portions are crushed to form a flat portion 10a. e to j are made of metal plates. Although such processing of the electrode 10 is generally performed by a combined process of, for example, Kovar etching and press processing, it is also possible to process the electrode 10 by a press process alone. This electrode 10 can be made into various forms as shown in the drawings depending on the mounting position or use. It goes without saying that the flat portions 10a of these electrodes 10 are the portions that are soldered to the substrate side when the package is mounted on a printed circuit board or a hybrid integrated circuit board such as ceramic.

Figures 9a to 9d show a method for processing a grounding electrode, and a shows a method in which the lead portion of the grounding electrode 10 is silver-brazed or soldered 51 to the burred grounding electrode hole 5a of the vessel body 1. (b) is the glass block 8 shown in FIG. 2 with a conductive substance 52 sealed and fixed in the notch 9a; (c) is the glass block shown in FIG. 2. A notch 53 corresponding to the notch 9a of 8 is also provided in the glass block 6, and at the time of sealing, a conductive substance 52 is sealed in these notches 9a, 53, and the lead part of the earth electrode 10 is sealed. The fixed one, d, extends the lead part of the ground electrode upward,
Its upper end 54 is brought into contact with the inner wall of the lid 2.

Although various embodiments and modifications of the package of the present invention have been described above, various other modifications are possible. For example, regarding materials, vessel 1
The metal material of the electrode 10 is not limited to Kovar, but other materials that can be sealed with glass, such as copper-clad Kovar and iron-nickel alloy, can be used.
The glass is not limited to borosilicate glass, but also glass materials applicable to the above-mentioned metal materials, such as borosilicate glass with a filler added thereto, can also be used. Further, regarding the shape of the vessel body 1, the external shape is not limited to a rectangle, but may be square, round, oval, etc. As for the shape of the bottom of the recess, as mentioned above, in addition to the four small holes on the bottom, there are also those with four or more small holes, and those with two parallel parallel slits on the bottom. sell. Regarding the lid 2, press molding is performed using metal materials (Kovar, iron, copper),
Its external shape is rectangular, square, round, or oval to match the vessel body. Methods for sealing the lid to the vessel body include resistance welding, cold pressure welding, solder sealing, adhesive sealing, laser welding, and the like.

In addition, one of the four corners of the outer periphery of the flange of the container body 1 and the outer periphery of the corresponding lid is squared to provide a shape for positioning and preventing incorrect mounting when mounting the package cage with the lid 2 attached on a printed circuit board, etc. It is conceivable to make the other parts rounded, or vice versa, to provide unevenness in some parts, or to make part of the glass different in color.

[Effects of the Invention] Since the hermetically sealed leadless package of the present invention uses glass as an insulating material,
Improved heat resistance, increased insulation resistance, increased moisture resistance and mechanical strength, stabilized airtightness, ease of handling, ease of soldering and high reliability, increased soldering strength and high reliability. In addition to having the following characteristics:

(1) Since the package is made of glass, it is possible to maintain a vacuum inside for a long period of time. (2) Since the container body and lid are made of metal, the shielding effect is large and various parts can be used for higher frequencies and wider bands. (3) Since the lead wires do not protrude, the package can be made thin and flat. (4) It is possible to solder the top surface of the printed circuit board at the same time as other components, so it is easy to solder. (5) It eliminates unnecessary space and can be easily adapted to smaller, lighter, and thinner equipment incorporating the package. (6) Easy handling because there are no lead wires, making it easier to automate processes. This has the effect of being able to respond immediately.

[Brief explanation of drawings]

1A to 1C are views showing a first embodiment of the leadless package of the present invention, FIG. 2 is an exploded perspective view of the package components before sealing, and FIGS. FIGS. 4a to 4c are views showing a third embodiment of the present invention, FIGS. 5a to 5g are views showing various cross-sectional shapes of the vessel flange, and FIGS. Diagrams showing various cross-sectional shapes of the flange portion of the container body and lid that prevent foreign matter from entering the package, Figure 7a
- h are diagrams showing various modifications of the container body, Fig. 8 a -
j is a diagram showing various modifications of the electrode, FIGS. 9a to d
This figure shows various modifications of the method for connecting the ground electrode. 1... Vessel body, 2... Lid, 3... Flange part, 4
...Concave area, 5...Small hole, 6, 8...Glass, 1
0... Electrode.

Claims (1)

[Scope of Claims] 1. A container body made of a metal plate having a flange portion around the periphery for attaching a lid, glass as an insulating material provided on at least the lower surface of the container, and contact with the lower surface or side surface of the glass. A leadless package having a thin flat part that penetrates the inside of the glass and is sealed in an airtight and insulated manner with a plurality of electrodes extending onto the container body. 2. A plurality of small holes are formed in the vessel body, and the electrodes pass through the small holes, and among the electrodes, only the ground electrode is conductively sealed from the vessel body at the penetration part, and the other 2. The leadless package according to claim 1, wherein the electrode is insulated and sealed from the container body at the through-hole. 3. The container body consists of the flange portion at the periphery and a concave region or a convex region in the center, the electrode through hole is formed in the concave region or the convex region, and the glass is formed in the concave region or the convex region of the container body. 3. The leadless package according to claim 2, wherein the leadless package is sealed to the container body extending over the side wall of the area. 4. The device according to claim 2, wherein the container body has a flat plate shape including the flange portion, and the electrode through hole has a convex shape, and the direction of this shape is symmetrical to one direction. Leadless package. 5. The shape of the electrode sealed through the electrode through-hole of the container is made of a metal plate or metal wire, and its cross-sectional shape is T-shaped, inverted T-shaped, I-shaped, U-shaped, or L-shaped. 3. The leadless package according to claim 2, wherein the leadless package is molded into a shape, and the bottom and/or side surfaces of the electrode body are tightly adhered with the glass. 6. Claim 1, wherein the flange portion of the container body is provided with deformation absorbing means for preventing mechanical and thermal deformation of the flange portion from being transmitted to the sealing interface between the container body and the glass. Leadless package as described in section.