JPS58215812A - Sealed container of crystal oscillaor or the like - Google Patents

Abstract

PURPOSE:To improve the utilizing rate of an inner space, by providing a thin oxide coating film on an inner wall of a cover of a container sealing a crystal oscillator or the like so as to avoid an electric failure due to the contact between electronic components contained therein and the cover inner wall. CONSTITUTION:An electrode 24, terminal metal fixtures 21, 22 and a jumper 23 and the like are formed incorporatedly on a bottom plate 20 made of an insulator such as glass of the sealed container sealing the electronic components such as a crystal oscillating chip 10. A step 25 is fitted to the upper end of the jumper 23 of the bottom plate 25, and electrodes 10a, 10b of the oscillating chip 10 are bonded to the tip with a conductive adhesives to hold the oscillating chip 10 mechanically. A metallic cover 11 is provided around the oscillating piece 10 and a flange 11a of the cover 11 is sealed airtightly to a flange 20a of the bottom plate 20 with a low melting point glass layer 26. The inner wall of the cover 60 of the sealed container constituted in this way is provided with the thin oxide coating film 61 in advance so as to prevent the oscillating piece 10 contained therein from contacting with the inner wall of the cover 60 for avoiding electrical failure, allowing to use the inner space effectively.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hermetically sealed container for storing electronic components such as crystal resonators, making the container suitable for chipping and mounting on a board, and reducing the size of the container.

When mounting an electronic component on a board, conventional methods have been used such as fixing the lead wires to the terminals of the board by soldering. However, as parts become smaller, electronic parts are no longer equipped with lead wires, and the container housing the electronic parts itself is soldered directly to the electrodes on the board to electrically connect and mechanically fix the parts. , so-called chips are being developed. - That is, as shown in FIG. 1, electrodes 2 and 3 connected to the internal electronic components are provided at the bottom of a container 1 containing all electronic components (not shown), and electrodes 5.6 of the substrate 4 are connected to the electronic components inside.
After applying liquid so-called cream solder, the container 1 is placed on the substrate 4, and the electrode parts 2 and 3 at the bottom of the container
is placed on the electrode 5.6 of the substrate via cream solder, and the whole is heated in a heating furnace. Thus, the electrodes 2, 3 of the container are soldered to the electrodes 5, 6 of the board,
Frost in the container l: The child parts are connected to, for example, a printed circuit on the substrate, and the container is fixed on the substrate together with the container.

As described above, the present invention provides a sealed container for chipping electronic components and mounting them on a substrate.
.

Figure 2 shows a conventional crystal oscillator, where 7 is a metal bottom plate called a shell, small holes are provided in two places, and glass beads 8A and 8B are melted and filled respectively. Lead wires 9A and 9B are provided passing through the beads, and a crystal vibrating piece 10 is attached to the upper ends of the lead wires. 11 is a metal cover attached to the bottom plate 7 to cover the crystal vibrating piece;
Lower end flange portion 11a'ii = bottom plate flange gB7
It is adhered to a by means of soldering or pressure welding, and is hermetically sealed.

When attached to the board, the lead wires 9A and 9B are soldered to terminals on the board to electrically connect and mechanically hold them.

Conventionally, lead wires were used to connect terminals on the board, which required a considerable amount of space, and since the bottom plate was metal, in some cases an insulator was inserted between the bottom plate and the board. It was necessary to insulate it so that there was no risk of it coming into contact with other conductor parts above.

The present invention is based on the above-mentioned principle of chipping, and the gist of the present invention is to first construct the bottom plate entirely as an insulator, provide electrodes thereon, and directly solder the electrodes to the electrodes on the board.
Examples will be described in detail below.

FIG. 3(a) is a partially broken pressure surface view showing an embodiment of the bottom plate according to the invention, and FIG. 3(b) is a bottom view. 1.20 is a bottom plate made of glass as an example of an insulator; .2
2 are each partially embedded and fixed in the bottom plate as shown in the figure. That is, as shown in FIG. 4, the terminal fittings 21 and 22 are made by fixing an electrode 24 to a V-shaped connecting wire 23, which is a metal wire bent in an L-shape, by welding or the like.
As shown in aXb), the electrode is embedded in the bottom plate 20 so that the bottom surface 24a of the electrode is exposed downward.

FIG. 5 shows a crystal resonator constructed using the above-mentioned bottom plate 20, and a receiving fitting 25 formed by bending a thin metal plate is attached to the upper end of the connecting wire 23 of the terminal fitting 21 and 22, respectively, and the tip of the receiving fitting 25 is attached. Using conductive adhesive etc., attach the crystal vibrating piece 1.
The crystal vibrating piece is adhered to the electrodes 10a and 10b of 0 to electrically connect it and mechanically hold the crystal vibrating piece.

Next, as in the conventional case, a metal cover 11 surrounding the crystal vibrating piece is provided, and nitrogen gas or other suitable gas is filled.
On the flange 20a of the flange portion 11ai and the bottom plate 2°,
The crystal oscillator is completed by airtightly sealing it with the low melting point glass layer 26 interposed therebetween. Note that this gas filling and sealing between the cover 11 and the bottom plate 2o can be easily performed as follows.

That is, a large number of bottom plates 20ff each attached to the crystal vibrating piece 10 are arranged in an appropriate shape, and glass frit is applied to the adhesive surface of the flange 20a. Next i'T: ,h
C11 't' is covered and adhered to the glass frit coated surface of the flange 20a of the bottom plate of the flange 1lai, and after being evacuated in a heating furnace, nitrogen or other gas is introduced and heated to a predetermined temperature. In this way, the cover 11 is filled with a predetermined gas, and the bottom plate, the flange 11a of the cover, and the 20ald glass frit are hermetically sealed via the molten low-melting glass layer 26, thereby completing a crystal resonator.

The crystal resonator obtained in this way has a terminal fitting 21.2.
After measuring characteristics and other measurements through the connecting wire 23 of No. 2, the portion of the connecting wire 23 protruding outside the bottom plate is cut and removed at the arrow A in the figure. The cream paste is applied to the electrodes 5 and 6 of the substrate 4 shown by broken lines as described in FIG. 1, and the whole is heated to melt the cream paste. so that the electrode 24 on the bottom plate is connected to the electrode 5 on the substrate.
, 6, respectively, and are electrically connected and mechanically fixed. In this way, the crystal vibrating piece is housed in a sealed container and the crystal vibrator, which is made into a chip, is attached to the substrate.

Next, various other embodiments of the bottom plate will be described. 6th
Figures (a), (b), and (C) show a partially cutaway front view, a cross-sectional view taken along cutting line 1-j', and a bottom view of the bottom plate 30. No electrode is provided on the connection line, and the connection line 31 itself is exposed along the bottom surface of the bottom plate 30, and this exposed surface is used as an adhesive surface to the substrate electrode. However, as it is difficult to stably place it on the electrodes of the board when it is attached to the board, a part of the bottom of the bottom plate 30, in this case, as an example, below the central part 30'ak of the bottom, is connected to the connection @31. Protrude downward by the same distance. g) Using the bottom plate 30, form a crystal resonator consisting of a sealed container in which a crystal resonator piece is housed, in the same manner as in the previous embodiment.

When mounting on a board, place the crystal resonator stably on the board using the protrusion 30a of the bottom plate, and connect the connecting wire 3.
1 can be glued to the electrodes of the substrate. In this embodiment and also in FIG. 7, which will be described later, when mounting on a board, the connecting wire 31 is cut from the portion A, and the portion protruding from the bottom plate is removed.

Moreover, FIGS. 7(a>, (b), and (C) show a partially broken pressure surface view, a sectional view taken along cutting line n-n', and a bottom view of the bottom plate 40 of another embodiment; in this case, the bottom plate 40 metal wire 3
A groove 40a is provided along the horizontal portion 31a of the metal wire, and at least the lower side of the horizontal portion 31a of the metal wire is exposed from the lower surface of the bottom plate 40. In this manner, the crystal resonator constructed using the bottom plate 40 is placed on the substrate at the bottom surface of the bottom plate 40, and is soldered to the electrodes of the substrate below the horizontal portion 31a of the metal wire. I can do it.

Furthermore, FIG. 8(a) shows a partially broken front view of the bottom plate 50 of another example, in which the connecting wire 51 is straight without bending, and A downwardly open recess 50a is provided at the root portion where the is embedded.

When manufacturing a crystal oscillator using this bottom plate 50, when mounting it on a board, the connection wire 51f: cut and remove the part protruding downward from the bottom of the bottom plate shown by arrow A, and remove the connection wire 51f from the recess 50.
A is filled with blocks 52 as shown in FIG. 8(b). As shown in FIG. 8(C), the block 52 is made of metal and has a connecting wire insertion hole 52a in the center and has a shape that fits the recess 50a, for example, a hemispherical shape.
the recess 50a so that the tip of the metal wire 51 is inserted into the recess 2a.
The block 52 and the connecting wire 51 are bonded together by filling the block 52 and the lower end of the connecting wire 51 with no-da coating, or by press-fitting the block 52 and the lower end of the connecting wire 51. In this way the bottom,
The bottom surface of the block 52 attached to the plate can be used as an adhesive surface to the substrate electrode, and can be attached to the substrate. As described above, in the present invention, the electrodes are provided on the bottom plate made of an insulating material, and the electrodes are soldered directly to the electrodes of the substrate, thereby making it possible to make the entire device extremely compact.

However, inside the sealed container, that is, inside the cover ii, the crystal photographing piece 1o and the holder 25 are provided very close to the inner wall of the cover 11, as shown in FIG. This is the same with the conventional crystal unit shown in Figure 2, and when mechanical vibration is applied from the outside, the crystal unit contacts the inner wall of the cover, causing the crystal unit to stop oscillating, etc. An accident may occur. Therefore, in the past, it was necessary to take measures such as placing an insulator inside the cover 11 to surround the crystal vibrating piece.

In the present invention, in consideration of this point, an oxide film is formed on the inner wall of the cover 11 in advance, so that even if a crystal vibrating piece or the like comes into contact with the inner wall of the cover, since the oxide film is an insulator, there will be no electrical disturbance. Make sure that there is no risk of this occurring. FIG. 9 shows this embodiment, in which a cover 60 made of, for example, an iron-nickel alloy has an oxide film 61 formed on its inner wall by heating in the air or the like. In this way, by configuring a crystal resonator using the cover 60 with an oxide film on the inner wall, even if the internal crystal resonator piece etc. comes into contact with the inner wall of the cover), the inner wall of the cover Since it is insulated by the oxide film 61Vc, no trouble occurs.

However, providing an oxide film on the metal cover in this way is extremely effective in perfecting the sealing between the low melting point glass layer and the bottom plate. That is, it is conventionally known that when glass is welded to a high-temperature metal surface, if an oxide film is provided on the metal surface in advance, the molten glass will flow onto the metal surface and be completely fused. Therefore, as shown in FIG. 9, for example, glass frit is applied to the flange portion 20a of the bottom plate 20 of the embodiment shown in FIG. 5, and then a cover 60 is applied. −
When covering and heating in a heating furnace, by providing an oxide film on the inner surface of the cover to the lower surface of the flange of the cover, the molten low melting point glass 26 can be completely fused to the flange surface of the cover. The flange portion 20a of the bottom plate and the flange portion 60a of the cover are completely hermetically sealed.

In this case, the sealed container is attached to the board by applying cream solder to the electrodes of the board, and then attaching the sealed container to the electrodes by applying cream solder to each other, as explained in the case of the crystal sensor. By placing the parts so that they are adhered and heating them in a heating furnace, it is possible to mount a large number of electrical parts at once, thereby greatly reducing the labor required for mounting.

In each of the above embodiments, a crystal resonator has been described as an example of an electrical component, but the present invention can be applied to any electronic component. That is,
The electronic component is attached to a bottom plate made of an insulator such as glass, and a cover is hermetically sealed to the bottom plate over the electronic component, and the surface of the electronic component is attached to the bottom plate through a connecting wire passing through the bottom plate. Connect to exposed and fixed electrodes. In this way, a sealed container containing electronic components is
By placing the exposed electrode surface of the sealed container on the electrode of the substrate and bonding both electrode surfaces, the space required for mounting can be reduced and the entire device can be made extremely compact.

Furthermore, if the cover is made of metal, in order to avoid electrical failure due to contact between electronic components inside the cover and the inner wall of the cover, an oxide film may be provided on the inner wall of the cover, or another insulating material may be provided in the space inside the cover. Upper GT failure can be avoided without the need for. In this case, since the oxide film is extremely thin, the purpose can be achieved without reducing the utilization rate of the internal space compared to the case where a thick film such as an insulating paint is provided on the inner wall of the cover.

In addition, when providing an oxide film in this way, the oxide film has the great effect that the low melting point glass layer is completely fused to the cover via the oxide film, as described above, on the adhesive surface of the cover with the bottom plate. It will be done. In addition to glass, an insulating material such as ceramic can be used for the bottom plate.

As explained above, according to the present invention, a sealed container suitable for storing electronic components and mounting them on a board can be obtained.

[Brief explanation of the drawing]

Figure 1 is a diagram explaining the principle of chipping, Figure 2 is a cross-sectional view showing a conventional crystal resonator, and Figures 3 (a) and (b).
4 is a perspective view showing a terminal fitting, FIG. 5 is a sectional view of a crystal resonator according to an embodiment of the present invention, and FIG. Figure (aXb)
and (c) is a partially broken pressure surface view showing an embodiment of the bottom plate according to the present invention, a sectional view taken along cutting line I-1', and a bottom view, and FIGS. 7(aXb) and (C) are other embodiments of the bottom plate. 8(a) and (b) are a partially fractured pressure surface view showing a cross-sectional view taken along the cutting line n-n', and a bottom view. FIGS. 8(C) is a partially broken pressure surface view and a plan view of the block, and FIG. 9 is a sectional view showing the state in which an oxide film is formed on the inner surface of the cover according to the present invention. lO...Crystal resonator piece, 11...Cover, 11a...
・Flange part, 20... Bottom plate, 20a... Flange part, 21.22... Terminal fitting, 23... Connection wire, 2
4... Electrode, 24a... Bottom surface, 25... Low melting point,
26...Glass layer, 30...Bottom plate, 30a...Central protrusion, 31...Connection line, 40...Bottom plate, 40a...
...Groove, 50...Bottom plate, 50a...Vacancy, 51...Connection line, 52...Block, 60...Cover, 61...
...Oxide film. O I Figure O 2 times 3 M Suta Figure O 2 Figures 7 times (mountain) (No.) (C) 4θ'I-8 Figures 1,! ``2 years old wo wa

Claims (8)

[Claims] (1) A bottom plate made of an insulator, a cover that is airtightly attached to the bottom plate and forms an airtight space for storing electronic components together with the bottom plate, and a cover that is connected to the electronic components and has a portion for connection to external electrodes. An airtight container for a crystal resonator, etc., comprising: an electrode exposed and fixed to the bottom plate. (2) The electrode is embedded in the bottom plate, and at least a portion thereof is connected to the electronic component via a connection line embedded in the bottom plate. Sealed containers for crystal cameras, etc. (3) The crystal resonator or the like as set forth in claim 2, wherein one end of the connecting wire projects outside from the bottom plate, and if necessary, the portion that can project beyond the bottom plate is cut and removed. Sealed container. (4) One end of the connection wire penetrates the bottom plate and is connected to the electronic component within the airtight space, and the other end is exposed from the bottom plate outside the airtight space and bent parallel to the bottom plate, 3. A sealed container for a crystal resonator or the like according to claim 1 or 2, wherein the exposed portion of the connecting wire constitutes the electrode. (5) A sealed container for a crystal camera or the like according to claim 4 of the patent application, wherein a portion of the bottom plate protrudes from the bottom plate in the same manner as the exposed portion of the connecting wire. (6) One end penetrates the bottom plate and is connected to the electronic component in the airtight space, the other end is provided with a recess at least in contact with the cut end of the connection wire at the bottom, and the recess is filled with a conductor block. 3. A sealed container for a crystal resonator or the like according to claim 2, wherein the conductor block is connected and fixed to the cut end of the connection line to constitute the electrode. (7) A bottom plate made of an insulator, a metal cover that is airtightly attached to the bottom plate and forms an airtight space in which all electronic components are housed together with the bottom plate, and a metal cover that is partially exposed for connection to an external conductor and A sealed container for a crystal resonator or the like, comprising an electrode fixed to a bottom plate and connected to the electronic component, and the cover is characterized by forming an oxide film of the metal on the inner surface. (8) The cover is airtightly attached to the bottom plate via a low-melting glass layer, and the oxide film layer is formed on the inner surface of the cover and on the adhesive surface of the cover with the low-melting glass layer. A sealed container for a crystal camera or the like according to claim 7.