JPH0936690A - Thin crystal vibrator - Google Patents
Thin crystal vibratorInfo
- Publication number
- JPH0936690A JPH0936690A JP18378595A JP18378595A JPH0936690A JP H0936690 A JPH0936690 A JP H0936690A JP 18378595 A JP18378595 A JP 18378595A JP 18378595 A JP18378595 A JP 18378595A JP H0936690 A JPH0936690 A JP H0936690A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic case
- cover glass
- lid
- metabolized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、特に、移動体通信機
器、ＩＣカードなどの小型、薄型の携帯機器に表面実装
されるセラミックケースを用いる薄型水晶振動子に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin crystal resonator using a ceramic case which is surface-mounted on small and thin portable devices such as mobile communication devices and IC cards.
【０００２】[0002]
【従来の技術】従来、このような水晶振動子には、例え
ば、図３に示すように、内部を段状に形成したした酸化
アルミニウム（Ａｌ2Ｏ3）の箱型のセラッミクケース７
に、電極を形成した水晶振動片６を保持し、ホウケイ酸
ガラス製のカバーガラス４を、重量比でＡｕ８０％、Ｓ
ｎ２０％よりなるハンダワッシャー８を介して、真空中
で加熱および気密封止した構造である。 2. Description of the Related Art Conventionally, as shown in FIG. 3, for example, such a crystal resonator has a box-shaped ceramic case 7 made of aluminum oxide (Al 2 O 3 ) having a stepped inside.
While holding the crystal vibrating piece 6 on which the electrode is formed, the cover glass 4 made of borosilicate glass is used, and the weight ratio of Au is 80% and S is S.
The structure is such that it is heated and hermetically sealed in a vacuum through a solder washer 8 of n20%.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような従
来の水晶振動子は、以下のような課題があった。 （１）セラミックケース７とカバーガラス４の間にハン
ダワッシャー８を介して気密封止する構造のため、ハン
ダワッシャー８に付着しがちなゴミ、異物等のコンタミ
がセラミックケース７の内部に入り、水晶振動子に悪影
響を及ぼす。 （２）セラミックケース７とハンダワッシャー８とカバ
ーガラス４を治具に正確に位置合わせするため、図４の
「従来の封止工程」に示すような煩雑な工程が必要であ
る。 （３）真空で加熱封止する際に、加熱治具の熱は、セラ
ミックケース７、ハンダワッシャー８、最後にカバーガ
ラス４の順に伝わり温度が低下する。このため、ハンダ
濡れ性不良となりやすく、封止不良の原因となる。However, such a conventional crystal resonator has the following problems. (1) Due to the structure in which the ceramic case 7 and the cover glass 4 are hermetically sealed via the solder washer 8, dust, foreign matter, and other contaminants that tend to adhere to the solder washer 8 enter the inside of the ceramic case 7. It has a bad effect on the crystal unit. (2) Since the ceramic case 7, the solder washer 8 and the cover glass 4 are accurately aligned with the jig, a complicated process as shown in the "conventional sealing process" of FIG. 4 is required. (3) When heat-sealing in vacuum, the heat of the heating jig is transmitted to the ceramic case 7, the solder washer 8, and finally the cover glass 4 in this order, and the temperature decreases. Therefore, poor solder wettability is likely to occur, which causes defective sealing.
【０００４】[0004]
【課題を解決するための手段】そこで、本発明は、これ
らを解決するために、内部に水晶振動子を保持したセラ
ミックケースを、ＡｕおよびＳｎよりなる共晶ハンダを
上記封止面のメタライズ層に窒素および水素の混合ガス
雰囲気中で高温でリッド状に溶融したガラスケースで封
止する構造とする。In order to solve these problems, the present invention provides a ceramic case having a crystal resonator held therein, a eutectic solder composed of Au and Sn, and a metallized layer on the sealing surface. In addition, the structure is such that it is sealed with a glass case that is melted like a lid at a high temperature in a mixed gas atmosphere of nitrogen and hydrogen.
【０００５】[0005]
【作用】このように構成された本発明では、以下のよう
な量産上有利な効果がある。 （１）ハンダワッシャーに起因するコンタミが入りにく
い。 （２）予めカバーガラスにＡｕおよびＳｎ共晶ハンダリ
ッドが形成されているので、従来のハンダ濡れ性不良が
起きない。 （３）セラミックケースをカバーガラスで直接封止でき
るため、部品点数が減り、封止工程を短縮することがで
きる。The present invention thus constructed has the following advantageous effects in mass production. (1) It is difficult for contaminants due to the solder washer to enter. (2) Since Au and Sn eutectic solder lids are formed on the cover glass in advance, the conventional solder wettability does not occur. (3) Since the ceramic case can be directly sealed with the cover glass, the number of parts can be reduced and the sealing process can be shortened.
【０００６】[0006]
【実施例】本発明の実施例を図面に基づいて説明する。
図１は本発明の薄型水晶振動子を説明する図であり、こ
れを以下に説明する。 （１）セラミックケース７は酸化アルミニウムであり、
下面には図示はしないが外部リード電極が形成されてお
り、携帯機器の回路基板などにハンダリフローにより表
面実装することができる。An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram for explaining a thin crystal resonator according to the present invention, which will be described below. (1) The ceramic case 7 is aluminum oxide,
Although not shown, external lead electrodes are formed on the lower surface, and can be surface-mounted by solder reflow on a circuit board of a portable device or the like.
【０００７】（２）水晶振動片６は、例えば、幅方向に
主振モード、長さ方向に副振モードを有する両端に支持
部を形成した水晶振動片６など用途に応じて選択でき
る。この水晶振動片６は、セラミックケース７の内の段
状に形成した支持部に、ポリイミド系などの導電性接着
剤で電気的に導通および保持されている。(2) The crystal vibrating reed 6 can be selected according to the application, for example, the crystal vibrating reed 6 having a support portion at both ends having a main vibration mode in the width direction and a sub vibration mode in the length direction. The crystal vibrating piece 6 is electrically connected to and held by a supporting portion formed in a step shape inside the ceramic case 7 with a conductive adhesive such as polyimide.
【０００８】（３）カバーガラス５はホウケイ酸系で、
厚み０．０５mm程度であり、図２に示すように、その封
止面に下地としてＣｒ層３（厚み５００Ａ゜）の上にＡ
ｕ層２（厚み１５００Ａ°）が蒸着あるいはメッキによ
りメタライズされている。この２層のメタライズ層のＡ
ｕ層２に、重量比でＡｕ９０％およびＳｎ１０％よりな
る共晶ハンダリッド１が、予め溶融してある。(3) The cover glass 5 is made of borosilicate,
The thickness is about 0.05 mm, and as shown in FIG. 2, A is formed on the sealing surface as a base on the Cr layer 3 (thickness 500 A °).
The u layer 2 (thickness 1500 A °) is metallized by vapor deposition or plating. A of these two metallized layers
Eu layer 2 is pre-melted with eutectic solder lid 1 made of 90% Au and 10% Sn by weight.
【０００９】（４）封止工程は、図４の「本発明による
封止工程」に示すように、従来は、セラミックケース７
とハンダワッシャー８とカバーガラス４を治具にセット
してから、真空引きをした後加熱したが、本発明によれ
ば、セラミックケース７にカバーガラス５を直接セット
して封止できるので工程を簡略化することができる。(4) As shown in the "sealing process according to the present invention" of FIG. 4, the conventional sealing process is the ceramic case 7.
After the solder washer 8 and the cover glass 4 are set on the jig, the vacuum is applied and then the heating is performed. According to the present invention, however, the cover glass 5 can be directly set and sealed in the ceramic case 7, so It can be simplified.
【００１０】[0010]
【発明の効果】以上説明したように、本発明によれば、
セラミックケースをカバーガラスで確実に封止でき、し
かも、部品点数を減らし製造工程を簡略化し、さらには
歩留まりを向上させるなど量産上の効果が極めて大き
い。As described above, according to the present invention,
The ceramic case can be surely sealed with the cover glass, and the number of parts is reduced, the manufacturing process is simplified, and the yield is improved.
【図１】本発明による水晶振動子を説明する図である。FIG. 1 is a diagram illustrating a crystal resonator according to the present invention.
【図２】本発明による水晶振動子のカバーガラス部分を
説明する図である。FIG. 2 is a diagram illustrating a cover glass portion of a crystal unit according to the present invention.
【図３】従来の水晶振動子を説明する断面図である。FIG. 3 is a sectional view illustrating a conventional crystal resonator.
【図４】本発明と従来の水晶振動子の製造方法を対比す
る図である。FIG. 4 is a diagram comparing the present invention with a conventional method for manufacturing a crystal resonator.
１ リッド ２ Ａｕ層 ３ Ｃｒ層 ４ カバーガラス ５ ＡｕＳｎリッド付カバーガラス ６ 水晶振動片 7 セラミックケース ８ ハンダワッシャー 1 lid 2 Au layer 3 Cr layer 4 cover glass 5 cover glass with AuSn lid 6 crystal vibrating piece 7 ceramic case 8 solder washer
Claims (1)
水晶振動片(6)をカバーガラスで封止する薄型水晶振動
子において、封止面に形成したＣｒ層(3)およびＡｕ層
(2)のメタライズ層上にＡｕおよびＳｎよりなる共晶ハ
ンダリッド(1)を溶融させたカバーガラス(5)により、セ
ラミックケース(7)を気密封止したことを特徴とする薄
型水晶振動子1. A thin crystal resonator in which a crystal vibrating piece (6) held inside a ceramic case (7) is sealed with a cover glass, wherein a Cr layer (3) and an Au layer are formed on a sealing surface.
A thin crystal unit characterized in that a ceramic case (7) is hermetically sealed by a cover glass (5) obtained by melting a eutectic solder lid (1) made of Au and Sn on the metallized layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18378595A JPH0936690A (en) | 1995-07-20 | 1995-07-20 | Thin crystal vibrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18378595A JPH0936690A (en) | 1995-07-20 | 1995-07-20 | Thin crystal vibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0936690A true JPH0936690A (en) | 1997-02-07 |
Family
ID=16141899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18378595A Pending JPH0936690A (en) | 1995-07-20 | 1995-07-20 | Thin crystal vibrator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0936690A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040033098A (en) * | 2002-10-11 | 2004-04-21 | 제원전자 주식회사 | Quartz crystal |
| JP2005503659A (en) * | 2001-09-17 | 2005-02-03 | スタフォード，ジョン | Micro Magnetic Latch Relay Package and Packaging Method |
| KR100486758B1 (en) * | 2002-12-04 | 2005-05-03 | 주식회사 코스텍시스 | a quartz vibrator |
| KR100486996B1 (en) * | 2001-11-20 | 2005-05-03 | 주식회사 코스텍시스 | a quartz vibrator |
| JP2005175520A (en) * | 2003-12-05 | 2005-06-30 | Tokyo Denpa Co Ltd | Piezoelectric vibrator |
| US8069549B2 (en) | 2007-03-22 | 2011-12-06 | Seiko Epson Corporation | Method for sealing a quartz crystal device |
| WO2019159858A1 (en) * | 2018-02-13 | 2019-08-22 | 田中貴金属工業株式会社 | Sealing lid formed from translucent material |
| JP2020065052A (en) * | 2018-10-15 | 2020-04-23 | 三菱マテリアル株式会社 | Package and lid material for package |
| KR20210002730A (en) * | 2018-10-15 | 2021-01-08 | 미쓰비시 마테리알 가부시키가이샤 | Lid material and package for package |
-
1995
- 1995-07-20 JP JP18378595A patent/JPH0936690A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005503659A (en) * | 2001-09-17 | 2005-02-03 | スタフォード，ジョン | Micro Magnetic Latch Relay Package and Packaging Method |
| KR100486996B1 (en) * | 2001-11-20 | 2005-05-03 | 주식회사 코스텍시스 | a quartz vibrator |
| KR20040033098A (en) * | 2002-10-11 | 2004-04-21 | 제원전자 주식회사 | Quartz crystal |
| KR100486758B1 (en) * | 2002-12-04 | 2005-05-03 | 주식회사 코스텍시스 | a quartz vibrator |
| JP2005175520A (en) * | 2003-12-05 | 2005-06-30 | Tokyo Denpa Co Ltd | Piezoelectric vibrator |
| US8344599B2 (en) | 2007-03-22 | 2013-01-01 | Seiko Epson Corporation | Quartz crystal device and method for sealing the same |
| US8069549B2 (en) | 2007-03-22 | 2011-12-06 | Seiko Epson Corporation | Method for sealing a quartz crystal device |
| WO2019159858A1 (en) * | 2018-02-13 | 2019-08-22 | 田中貴金属工業株式会社 | Sealing lid formed from translucent material |
| CN111712912A (en) * | 2018-02-13 | 2020-09-25 | 田中贵金属工业株式会社 | Sealing cap made of translucent material |
| JPWO2019159858A1 (en) * | 2018-02-13 | 2021-01-28 | 田中貴金属工業株式会社 | Sealing lid made of translucent material |
| CN111712912B (en) * | 2018-02-13 | 2023-12-22 | 田中贵金属工业株式会社 | Sealing cap made of light-transmitting material |
| US12002723B2 (en) | 2018-02-13 | 2024-06-04 | Tanaka Kikinzoku Kogyo K.K. | Sealing lid formed from translucent material |
| JP2020065052A (en) * | 2018-10-15 | 2020-04-23 | 三菱マテリアル株式会社 | Package and lid material for package |
| KR20210002730A (en) * | 2018-10-15 | 2021-01-08 | 미쓰비시 마테리알 가부시키가이샤 | Lid material and package for package |
| US11158766B2 (en) | 2018-10-15 | 2021-10-26 | Mitsubishi Materials Corporation | Lid material for packages including reflowed gold-tin layers, and method for manufacturing package |
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