JP3556111B2

JP3556111B2 - Package for electronic component, electronic component assembly using the same, and method of manufacturing electronic component assembly

Info

Publication number: JP3556111B2
Application number: JP36496898A
Authority: JP
Inventors: 栄吾岸
Original assignee: エヌイーシーショットコンポーネンツ株式会社
Priority date: 1998-12-22
Filing date: 1998-12-22
Publication date: 2004-08-18
Anticipated expiration: 2018-12-22
Also published as: JP2000188459A

Description

【０００１】
【発明の属する技術分野】
本発明は、水晶振動素子、水晶発振素子、ＳＡＷデバイス素子等の電子素子を収納する電子部品用パッケージに関する。
本発明はまた、前記の電子部品用パッケージに電子素子を組み付けた電子部品中間構体を、プリント基板等の取付基板に組み付けた電子部品組立構体に関する。
本発明はさらに、前記電子部品組立構体の製造方法に関する。
【０００２】
【従来の技術】
水晶振動子、水晶発振子、ＳＡＷデバイス用の気密パッケージとして、絶縁性ベースと、この絶縁性ベースの内方から絶縁性ベースの外方に導出された電極と、絶縁性ベースの開口部に封止材を介して気密に封止されたキャップとを有する気密パッケージがある。そのような気密パッケージは、水晶振動素子等の形状により各種のものがある。例えば、矩形板状の水晶振動素子用の気密パッケージとしては、実開平６−７７３２８号公報に開示されているものがある。その典型的なものについて、以下説明する。
図１１は従来の気密パッケージの斜視図で、図１２はその封止材およびキャップの一部を除去した平面図、図１３は図１２のＢ−Ｂ線に沿う縦断面図である。
図１１ないし図１３において、７１はアルミナセラミツク製の箱状の絶縁製ベースで、底板部７２および枠体部７３を有する。７４、７５は絶縁製ベース７１の内方から外方に導出された銀パラジウムペースト等の塗布・焼成により形成された電極、７６は前記電極７４、７５と同一材料で同時に形成された、後述する水晶振動素子等の電子素子を支持する、いわゆる「枕」と称される支持部である。２点鎖線で示す７７は前記電極７４、７５に導電性接着材により接続固定された水晶振動素子等の電子素子、７８は前記絶縁性ベース７１の開口部を封止する封止材で、絶縁性ベース７１の枠体部７３の上面とアルミナセラミック製のキャップ７９の下面とを封止している。
上記構成の気密パッケージにおいては、キャップ７９としてアルミナセラミック等の絶縁性キャップを用いているため、機械的強度の点からその厚さ寸法ｔ２の薄型化に限度があり、それに伴って気密パッケージ全体の厚さ寸法ｔ３の薄型化にも限度がある。また、浮遊容量や外来電磁波に起因する電子素子７の特性変動を防止できない。
このため、アルミナセラミツク製の絶縁性キャップ７９に代えて金属キャップを用いることも考えられている。しかしながら、アルミナセラミック製の絶縁性ベース７１に金属キャップを組み合わすことは、両者の熱膨張係数差による応力で、封止材７８に亀裂が生じたり、金属キャップが剥離するという問題がある。
そこで、アルミナセラミック製の絶縁性ベース７１の枠体部７３の上に、絶縁性ベース７１と金属キャップとの中間の熱膨張係数の中間金属枠体部を介在することも考えられている。しかしながら、このような構成では、中間金属枠体部が必要になり、材料費および加工費が嵩むのみならず、気密パッケージ全体が嵩高になり、低背化にも反する。
【０００３】
そこで、本出願人は、ガラス中にフォルステライト粉末を３０〜７０ｗｔ％混入した熱膨張係数が１０〜１５×１０^−６／℃のガラスセラミツクからなる絶縁性ベースを開発するとともに、この絶縁性ベースにこれと近似する熱膨張係数金属を有するステンレス鋼よりなる金属キャップを封止材で封止する気密パッケージを提案した。このような構成の気密パツケージによれば、絶縁性ベースと金属キャップとの熱膨張係数が近似しているので、熱膨張係数差に起因する応力発生がなく、電子素子の特性変動が生じない気密パツケージが提供できる。また、金属キャップを接地すれば、浮遊容量や外来電磁波に起因する電子素子の特性変動も生じない。
なお、上記の絶縁性ベース７１を用いて電子素子７７を気密に封止した気密パッケージを用いた電子部品およびその電子部品をプリント基板等の取付基板に組み付けた電子部品組立構体の製造方法を、図１４の製造工程ブロック図に示す。まず、絶縁性ベース７１を製作し（図１４ａ）。次に、この絶縁性ベース７１の電極７４、７５に電子素子７７を組み付けて電子部品中間構体を製作する（図１４ｂ）。次に、絶縁ベース７１の開口部を金属キャップで封止して電子部品を製作する（図１４ｃ）。そして、前記電子部品をその下面に形成した電極７４、７５を利用して、プリント基板等の取付基板に組み付けて電子部品組立構体を製造する（図１４ｄ）。
【０００４】
【発明が解決しようとする課題】
しかしながら、上記の構成の気密パツケージにおいても、金属キャップが必要で、気密パッケージ全体の低背化には限度があり、しかもこの金属キャップを絶縁性ベースの枠体部に封止材を介して気密に封止する必要があるため、キャップの封止と、電子部品の取付基板への組み付けと、二度の加熱工程が必要になり、電子素子７７の加熱に伴う特性変動が生じやすい。
そこで、本発明は、上記の気密パツケージ用からキャップを省略し得る電子部品用パッケージを提供することを目的とする。
本発明はまた、上記の電子部品用パツケージを用いた電子部品組立構体を提供することを目的とする。
本発明はさらにまた、電子部品用パツケージを用いた電子部品組立構体の製造方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極とを有する電子部品用パツケージである。
本発明はまた、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された封止材とを有する電子部品用パツケージにおける前記電子素子用電極に電子素子を接続固着してなる電子部品中間構体を、前記電子素子用電極を取付基板の回路端子に接続するとともに、前記封止材で取付基板に気密に固着封止した電子部品組立構体である。
本発明はさらに、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パツケージを用意する工程と、前記電子部品用パツケージにおける電子素子用電極に電子素子を接続固着して電子部品中間構体を製作する工程と、前記電子素子用電極を取付基板の回路端子に接続すると同時に、前記封止材で取付基板に気密に固着封止する工程とを有する電子部品組立構体の製造方法である。
【０００６】
【発明の実施の形態】
本発明の請求項１記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極とを有する電子部品用パッケージである。
【０００７】
本発明の請求項２記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された封止材とを有する電子部品用パッケージである。
【０００８】
本発明の請求項３記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パッケージである。
【０００９】
本発明の請求項４記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に前記電子素子用電極と離隔して枠状に形成された接地兼封止用電極と、前記接地兼封止用電極に被着されたはんだよりなる導電性封止材とを有する電子部品用パッケージである。
【００１０】
本発明の請求項５記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電極と、前記枠体部の上面部に前記電子素子用電極と離隔して枠状に形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パッケージにおける、前記電子素子用電極に電子素子を接続固着した電子部品中間構体を、その開口部をキャップで封止することなく、前記電子素子用電極を取付基板の回路端子に電気的に接続するとともに、前記接地兼封止用電極を前記取付基板に前記封止材で気密に固着封止したことを特徴とする電子部品組立構体である。
【００１１】
本発明の請求項６記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に電子素子用電極と離隔して枠状に形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パッケージにおける、前記電子素子用電極に電子素子を接続固着した臀部品中間構体を、キャップで封止することなく、前記電子素子用電極を取付基板の回路電極に電気的に接続するとともに、前記接地兼封止用電極を前記取付基板に形成した接地電極に前記導電性封止材で気密に固着封止したことを特徴とする電子部品組立構体である。
【００１２】
本発明の請求項７記載の発明は、底板部および枠体部を有するベースと、このベースの内方から外方に導出され前記枠体部の端面部および上面部まで形成された電子素子用電極と、前記枠体部の上面部に電子素子用電極と離隔して枠状に形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子素子用パツケージを用意する工程と、前記電子素子用電極に電子素子を接続固着した電子部品中間構体を製作する工程と、前記電子素子用電極を取付基板の回路端子に電気的に接続すると同時に、前記接地兼封止用電極を前記取付基板に形成した接地電極に前記導電性封止材で気密に固着封止することを特徴とするする電子部品組立構体の製造方法である。
【００１３】
【実施例】
本発明の実施例について、以下、図面を参照して説明する。
図１は本発明の一実施例の電子部品用パツケージ用Ａの斜視図、図２は図１の電子部品用パツケージ用Ａの平面図、図３は図２の電子部品用パツケージ用ＡののＡ−Ａ線に沿う縦断面図である。
また、図４は本発明の電子部品組立構体の製造方法について説明するための製造工程ブロック図である。
まず、図１ないし図３に示す電子部品用パツケージ用Ａを製作する（図４ａ）。図１ないし図３に示す電子部品用パツケージ用Ａにおいて、１はベースの一例としての熱膨張係数が１０〜１５×１０^−６／℃のガラスセラミック製の絶縁性ベース（以下、単にベースという）で、底板部２と枠体部３とを有し、長手方向の両端部に電子素子用電極を形成するための凹部４、５を有する。このような熱膨張係数のベース１は、例えば、ガラス中に３０〜７０ｗｔ％のフォルステライト粉末を含むガラスセラミックで製作することができる。６、７は前記底板部２の上面からベース１の内方から外方に導出されている電子素子用電極で、一方の電極６は前記一方の凹部４の端面部を通って前記枠体部３の上面にまで延在してされており、他方の電極７は枠体部３の下を迂回して他方の凹部５の端面部を通って枠体部３の上面にまで延在してされている。８は前記電極６、７と同一材料でかつ同時に形成された、後述する水晶振動素子等の電子素子を支持するための、いわゆる「枕」と称せられる支持部である。９は前記枠体部３の上面に前記電子素子用電極６、７と離隔して形成された枠状の接地兼封止用電極である。２点鎖線で示す１０は、水晶振動素子等の電子素子である。
前記電子部品用パツケージ用Ａにおいては、ベース１の開口部を図１１ないし図１３に示すようなキャップ７９で封止していないので、図１１ないし図１３に示す従来の気密パツケージに比較して、そのキャップ９の高さ寸法ｔ２だけ小さくなり、それに応じて全体の高さ寸法ｔ１は従来の高さ寸法ｔ３に比較して小さくでき、低背化ができる。
【００１４】
次に、上記の電子部品用パッケージＡを用いて、その枠体部３の上面の電子素子用電極６、７および接地兼封止用電極９にはんだ等の導電性接着材１１、１２および導電性封止材１３を被着形成する。さらに前記電子素子用電極６、７に水晶振動素子等の電子素子１０を導電性接着材１４、１５で電気的に接続するとともに機械的に固着して、図５に示す電子部品中間構体Ｂを製作する（図４ｂ）。ここで、前記導電性封止材１１、１２および導電性封止材１３は、この電子部品中間構体Ｂを後述するプリント基板等の取付基板に固着する際の温度で溶融する融点を有するもので形成する。また、前記水晶振動素子等の電子素子１０を接続固着する導電性接着材１４、１５は、前記導電性封止材１１、１２および導電性封止材１３の融点よりも高い融点のものを用いる。
【００１５】
図６は前記電子部品中間構体Ｂと、この電子部品中間構体Ｂを組み付けるプリント基板等の取付基板５０の組み付け前の斜視図である。図において、電子部品中間構体Ｂは、組み立てのために裏返しの状態になっており、取付基板５０は、前記電子部品中間構体Ｂの電子素子用電極６、７を接続するための回路端子５１、５２と、この回路端子５１、５２から離隔した矩形状の接地電極５３とを有する。
そして、前記電子部品中間構体Ｂの電子素子用電極６、７に被着された導電性接着材１１、１２をそれぞれ前記回路端子５１、５２に、また、前記接地兼封止用電極９に被着された導電性封止材１３を前記接地電極５３に重ね合わせ、加圧しながら加熱することにより、前記電子素子用電極６、７に被着された導電性接着材１１、１２を溶融させて電子素子用電極６、７をそれぞれ前記回路端子５１、５２に接続すると同時に、前記接地兼封止用電極９に被着された導電性封止材１３を溶融させて接地兼封止用電極９を前記接地電極５３に固着封止する（図４ｃ）。このようにして、前記電子部品中間構体Ｂの開口部の封止と、電子部品中間構体Ｂの基板５０への組み付けが同時に実施できる。
このため、電子素子１０は、電子部品中間構体Ｂを取付基板５０に組み付ける時に、一回だけ加熱されるだけであるから、加熱に伴う特性変動が生じ難くなるという特長がある。
図７は電子部品中間構体Ｂを基板５０へ組み付けた状態の電子部品組立構体Ｃの縦断面図を示す。この電子部品組立構体Ｃにおいても、当然のことながら、キャップを用いていないので、全体の低背化が実現される。また、接地電極５３によって、電子部品中間構体Ｂの接地兼封止電極９が接地されるので、浮遊容量や外来電磁波による電子素子１０の特性変動が防止できる。
【００１６】
なお、上記実施例は特定の構成の電子部品用パツケージＡについて説明したが、本発明はこの構成の電子部品用パツケージＡに限定されるものではなく、本発明の精神を逸脱しない範囲で各種の変形された構成が採用できる。
例えば、上記の電子部品用パツケージＡでは、図に示す従来の絶縁性ベース１と同一寸法のベース１を用いてその枠体部３の上面に電子素子用電極６、７と、接地兼封止用電極９とを形成したものを示したが、図８に示す電子部品用パツケージＤのように、絶縁性ベース２１の長手方向の両端部の枠体部３の幅寸法ｗ１を、短手方向の両端部の枠体部３の幅寸法ｗ２よりも大きくしてもよい。そのようにすると、枠体部３の上面における電子素子用電極６、７と接地兼封止用電極９の面積を大きくできるので、取付基板５０への組み付けが容易になるし、電子素子用電極６、７と接地兼封止用電極９とをさらに離隔して形成できるので、取付基板５０への組み付け時に、高度の位置決めをしなくても、電子素子用電極６、７と接地兼封止用電極９とが短絡することを確実に防止できる特長がある。
【００１７】
また、図９は電子素子用電極６、７を底板部２の長手方向の両端部に振り分けて形成した絶縁性ベース３１を用いるとともに、水晶振動素子等の電子素子として両持ち用の電子素子３２を用いたものでもよい。このようにすると、電極７を枠体部３の下を迂回して長手方向の他端部まで延在させる必要がなくなり、底板部２と枠体部３との密着性がよくなり、両者のデラミネーションが発生しなくなるのみならず、電極形成材料の使用量を節減できるし、電子素子３２を安定して支持できる特長がある。
【００１８】
さらに、上記実施例の電子部品用パツケージＡおよびＢは、ベース１、２１または３１の枠体部３の上面にのみ接地兼封止用電極９を形成する場合について説明したが、図１０に示すように、ベース４１の底板部２の全面に接地用導体層１６を形成してもよい。なお、ベース４１の長手方向の両端部に形成された凹部４、５の端面部には、図１に示す電子部品用パッケージＡと異なり、上半分（図１０の状態では下半分）のみに電子素子用電極６、７が形成されている。また、前記ベース４１の短手方向の両端部には、凹部１７、１８を有し、これらの凹部１７、１８の端面部全面には、前記接地用導体層１９が電気的に接続された接地用電極１９、２０が形成されている。
図中、６０はプリント基板等の取付基板で、電子素子用電極６、７が接続される回路端子６１、６２と、ベース４１の枠体部３の上面に形成された接地兼封止用電極９および前記ベース４１の底板部２の下面に形成された接地用導体層１６を接続固着するための接地電極６３とを有する。ここで、前記接地電極６３は、図６に示す接地電極５１よりも大面積に形成されている。
このような構成によれば、前記ベース４１の底板部２の下面の接地用導体層１６が凹部１７、１８に形成された接地用電極１９、２０を介して接地されるので、浮遊容量や外来電磁波による電子素子１０、３２の特性変動をより確実に防止できるという特長がある。
【００１９】
【発明の効果】
本発明は以上のように、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極とを有する電子部品用パッケージであるから、キャップを必要としない電子部品用パッージを提供できる。
本発明はまた、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パツケージにおける前記電子素子用電極に電子素子を接続固着してなる電子部品中間構体を、前記ベースの開口部をキャップで封止することなく、前記電子素子用電極を取付基板の回路端子に接続するとともに、前記導電性封止材で取付基板に気密に固着封止した電子部品組立構体であるから、キャップを必要とせず、全体の低背化が実現できる。
本発明はさらに、底板部および枠体部とを有するベースと、このベースの内方からベースの外方に導出され前記枠体部の端面部を通って枠体部の上面部まで形成された電子素子用電極と、前記ベースの枠体部の上面部に前記電子素子用電極と離隔して形成された接地兼封止用電極と、前記接地兼封止用電極に被着された導電性封止材とを有する電子部品用パツケージを製造する工程と、前記電子部品用パツケージにおける電子素子用電極に電子素子を接続固着して電子部品中間構体を製作する工程と、前記ベースの開口部をキャップで封止することなく、前記電子素子用電極を取付基板の回路端子に接続すると同時に、前記導電性封止材で取付基板に気密に固着封止する工程とを有する電子部品組立構体の製造方法であるから、キャップを必要としない電子部品組立構体用が提供できるという効果を奏する。
【図面の簡単な説明】
【図１】本発明の一実施例の電子部品用パツケージ用Ａの斜視図
【図２】図１の電子部品用パツケージ用Ａの平面図
【図３】図２の電子部品用パツケージ用ＡのＡ−Ａ線に沿う縦断面図
【図４】本発明の電子部品組立構体の製造方法を説明するための製造工程ブロック図
【図５】図１の電子部品用パツケージ用Ａに電子素子を組み付けた電子部品中間構体Ｂの平面図
【図６】図５の電子部品中間構体Ｂを取付基板に組み付ける前の電子部品中間構体Ｂおよび取付基板の斜視図
【図７】図６の電子部品中間構体Ｂおよび取付基板の組み付け後の電子部品組立構体Ｃの縦断面図
【図８】本発明の第２実施例の電子部品用パッケージＤの平面図
【図９】本発明の第３実施例の電子部品用パッケージを用いた電子部品中間構体Ｅの平面図
【図１０】本発明の第４実施例の電子部品用パッケージを用いた電子部品中間構体Ｆおよび取付基板の組み付け前の斜視図
【図１１】従来の気密パツケージを用いた電子部品の斜視図
【図１２】図１１の従来の気密パッケージを用いた電子部品のキャップおよび封止材の一部を除去した平面図
【図１３】図１２の従来の電子部品のＢ−Ｂ線に沿う縦断面図
【図１４】従来の電子部品の製造方法を説明するための製造工程ブロック図
【符号の説明】
Ａ、Ｄ電子部品用パッケージ
Ｂ、Ｅ、Ｆ電子部品中間構体
Ｃ電子部品組立構体
１、２１、３１、４１ベース
２底板部
３枠体部
６、７電子素子用電極
９接地兼封止用電極
１０、３２電子素子（水晶振動素子）
１１、１２、１４、１５導電性接着材
１３導電性封止材
１６接地用導体層
１９．２０接地用電極
６０取付基板（プリント基板）
５２、６１、６２回路端子
５３、６３接地電極[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a package for an electronic component that houses an electronic element such as a crystal oscillator, a crystal oscillator, and a SAW device.
The present invention also relates to an electronic component assembly structure in which an electronic component intermediate structure in which an electronic element is assembled in the electronic component package is mounted on a mounting board such as a printed circuit board.
The present invention further relates to a method for manufacturing the electronic component assembly.
[0002]
[Prior art]
As an airtight package for quartz oscillators, quartz oscillators and SAW devices, an insulating base, electrodes extending from the inside of the insulating base to the outside of the insulating base, and an opening in the insulating base are sealed. There is an airtight package having a cap hermetically sealed via a stopper. There are various types of such hermetic packages depending on the shape of the crystal vibrating element or the like. For example, as an airtight package for a rectangular plate-shaped quartz-crystal vibrating element, there is one disclosed in Japanese Utility Model Laid-Open No. 6-77328. Typical examples will be described below.
FIG. 11 is a perspective view of a conventional hermetic package, FIG. 12 is a plan view of the sealing material and a part of the cap removed, and FIG. 13 is a longitudinal sectional view taken along line BB of FIG.
11 to 13, reference numeral 71 denotes a box-shaped insulating base made of alumina ceramic, which has a bottom plate portion 72 and a frame portion 73. 74 and 75 are electrodes formed by applying and firing silver palladium paste or the like drawn out from the inside of the insulating base 71 to the outside, and 76 is simultaneously formed of the same material as the electrodes 74 and 75, which will be described later. It is a support portion that supports an electronic element such as a crystal vibrating element, which is called a “pillow”. Reference numeral 77 indicated by a two-dot chain line denotes an electronic element such as a crystal vibrating element connected and fixed to the electrodes 74 and 75 by a conductive adhesive, and 78 denotes a sealing material for sealing the opening of the insulating base 71. The upper surface of the frame portion 73 of the conductive base 71 and the lower surface of the cap 79 made of alumina ceramic are sealed.
In the hermetic package having the above-described configuration, since an insulating cap such as alumina ceramic is used as the cap 79, the thickness t2 of the hermetic package is limited in terms of mechanical strength. There is also a limit to the reduction in thickness t3. In addition, it is not possible to prevent a change in the characteristics of the electronic element 7 due to a stray capacitance or an external electromagnetic wave.
Therefore, it has been considered to use a metal cap instead of the insulating cap 79 made of alumina ceramic. However, combining the metal cap with the insulating base 71 made of alumina ceramic has a problem that a crack is generated in the sealing material 78 or the metal cap is peeled off due to a stress due to a difference in thermal expansion coefficient between the two.
Therefore, it is considered that an intermediate metal frame having an intermediate thermal expansion coefficient between the insulating base 71 and the metal cap is provided on the frame 73 of the insulating base 71 made of alumina ceramic. However, such a configuration requires an intermediate metal frame, which not only increases material and processing costs, but also increases the bulk of the hermetic package and contradicts a reduction in height.
[0003]
Accordingly, the present applicant has developed an insulating base made of glass ceramic having a thermal expansion coefficient of 10 to 15 × 10 ⁻⁶ / ° C. in which 30 to 70 wt% of forsterite powder is mixed in glass, and this insulating base has been developed. An airtight package was proposed in which a metal cap made of stainless steel having a thermal expansion coefficient metal similar to this was sealed with a sealing material. According to the hermetic package having such a configuration, since the thermal expansion coefficients of the insulating base and the metal cap are close to each other, there is no stress due to the difference in the thermal expansion coefficient, and the hermetic package does not cause the characteristic fluctuation of the electronic element. Package can be provided. Further, if the metal cap is grounded, there is no fluctuation in the characteristics of the electronic element due to stray capacitance or external electromagnetic waves.
The method for manufacturing an electronic component using an airtight package in which the electronic element 77 is hermetically sealed using the insulating base 71 and an electronic component assembly assembly in which the electronic component is assembled on a mounting board such as a printed board is described. This is shown in the manufacturing process block diagram of FIG. First, the insulating base 71 is manufactured (FIG. 14A). Next, an electronic component 77 is assembled to the electrodes 74 and 75 of the insulating base 71 to produce an electronic component intermediate structure (FIG. 14B). Next, an electronic part is manufactured by sealing the opening of the insulating base 71 with a metal cap (FIG. 14C). Then, using the electrodes 74 and 75 formed on the lower surface of the electronic component, the electronic component is assembled on a mounting board such as a printed board to manufacture an electronic component assembly structure (FIG. 14D).
[0004]
[Problems to be solved by the invention]
However, even in the hermetic package having the above structure, a metal cap is required, and there is a limit to the reduction in height of the hermetic package. Further, the metal cap is hermetically sealed to the frame portion of the insulating base via a sealing material. Therefore, it is necessary to seal the cap, assemble the electronic component to the mounting board, and perform two heating steps, and the characteristics of the electronic element 77 tend to fluctuate with heating.
Therefore, an object of the present invention is to provide an electronic component package in which a cap can be omitted from the hermetic package.
Another object of the present invention is to provide an electronic component assembly using the electronic component package described above.
Still another object of the present invention is to provide a method for manufacturing an electronic component assembly using a package for electronic components.
[0005]
[Means for Solving the Problems]
The present invention provides a base having a bottom plate portion and a frame portion, and an electron drawn out from the inside of the base to the outside of the base and formed to an upper surface portion of the frame portion through an end surface portion of the frame portion. An electronic component package comprising: an element electrode; and a grounding / sealing electrode formed on an upper surface of the frame of the base so as to be separated from the electronic element electrode.
The present invention also provides a base having a bottom plate portion and a frame portion, and is formed to extend from the inside of the base to the outside of the base to the upper surface portion of the frame portion through the end surface of the frame portion. An electrode for an electronic element, an electrode for grounding and sealing formed on the upper surface of the frame portion of the base so as to be spaced apart from the electrode for the electronic element, and a seal adhered to the electrode for grounding and sealing. An electronic component intermediate structure in which an electronic element is connected and fixed to the electronic element electrode in the electronic component package having the material, the electronic element electrode is connected to a circuit terminal of a mounting board, and the sealing material is used. This is an electronic component assembly that is hermetically fixed and sealed to a mounting substrate.
The present invention further includes a base having a bottom plate portion and a frame portion, and is formed from the inside of the base to the outside of the base and formed through the end surface portion of the frame portion to the upper surface portion of the frame portion. An electrode for an electronic element, a grounding / sealing electrode formed on the upper surface of the frame portion of the base so as to be separated from the electrode for the electronic element, and a conductive material attached to the grounding / sealing electrode. A step of preparing an electronic component package having a sealing material; a step of connecting and fixing an electronic element to an electronic element electrode in the electronic component package to produce an electronic component intermediate structure; and Connecting to the circuit terminals of the mounting substrate and hermetically sealing and sealing the mounting substrate with the sealing material at the same time.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
The invention according to claim 1 of the present invention is directed to a base having a bottom plate portion and a frame portion, and an electronic device formed to extend from the inside to the outside of the base and to the end surface portion and the top surface portion of the frame portion. An electronic component package having an electrode and a grounding / sealing electrode formed on an upper surface of the frame body and separated from the electronic element electrode.
[0007]
According to a second aspect of the present invention, there is provided a base for a base having a bottom plate and a frame, and an electronic device formed to extend from the inside to the outside of the base to the end face and the top of the frame. An electrode comprising: an electrode; a grounding / sealing electrode formed on the upper surface of the frame body separately from the electronic element electrode; and a sealing material attached to the grounding / sealing electrode. It is a package for parts.
[0008]
According to a third aspect of the present invention, there is provided a base having a bottom plate portion and a frame portion, and an electronic device which is led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion. An electrode, a grounding / sealing electrode formed on the upper surface of the frame body portion and spaced apart from the electronic element electrode, and a conductive sealing material applied to the grounding / sealing electrode. It is a package for electronic components having.
[0009]
According to a fourth aspect of the present invention, there is provided a base having a bottom plate portion and a frame portion, and an electronic device which is led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion. An electrode, a grounding / sealing electrode formed in a frame shape on the upper surface of the frame body and separated from the electronic element electrode; and a conductive material formed of solder applied to the grounding / sealing electrode. It is an electronic component package having a conductive sealing material.
[0010]
The invention according to claim 5 of the present invention is a base having a bottom plate portion and a frame portion, and an electrode led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, A grounding / sealing electrode formed in a frame shape at a distance from the electronic element electrode on an upper surface of the frame body portion, and a conductive sealing material adhered to the grounding / sealing electrode. In an electronic component package having an electronic component intermediate structure in which an electronic element is connected and fixed to the electronic element electrode, the electronic element electrode is electrically connected to a circuit terminal of a mounting substrate without sealing an opening of the electronic component intermediate structure with a cap. An electronic component assembly structure wherein the electrodes for grounding and sealing are hermetically fixed and sealed to the mounting substrate with the sealing material.
[0011]
According to a sixth aspect of the present invention, there is provided a base for a base having a bottom plate portion and a frame portion, and an electronic device formed to extend from the inside to the outside of the base to the end surface portion and the top surface portion of the frame portion. An electrode; a grounding / sealing electrode formed in a frame shape on the upper surface of the frame body apart from the electronic element electrode; and a conductive sealing material applied to the grounding / sealing electrode. In the electronic component package having the electronic component electrode, the electronic component electrode is electrically connected to the circuit electrode of the mounting board without sealing the buttocks intermediate structure in which the electronic element is connected and fixed to the electronic element electrode. An electronic component assembly structure, wherein the electronic component assembly is connected and hermetically sealed and sealed to the ground electrode formed on the mounting substrate with the conductive sealing material.
[0012]
According to a seventh aspect of the present invention, there is provided a base having a bottom plate portion and a frame portion, and an electronic device formed to extend from the inside to the outside of the base to the end surface portion and the top surface portion of the frame portion. An electrode; a grounding / sealing electrode formed in a frame shape on the upper surface of the frame body apart from the electronic element electrode; and a conductive sealing material applied to the grounding / sealing electrode. Preparing an electronic device package having: an electronic component intermediate structure in which an electronic device is connected and fixed to the electronic device electrode; and electrically connecting the electronic device electrode to a circuit terminal of a mounting board. A method for manufacturing an electronic component assembly, characterized in that the grounding and sealing electrode is hermetically fixed and sealed to the ground electrode formed on the mounting substrate with the conductive sealing material at the same time as the connection is made.
[0013]
【Example】
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view of an electronic component package A of one embodiment of the present invention, FIG. 2 is a plan view of the electronic component package A of FIG. 1, and FIG. 3 is a diagram of the electronic component package A of FIG. It is a longitudinal cross-sectional view which follows the AA line.
FIG. 4 is a manufacturing process block diagram for explaining a method for manufacturing an electronic component assembly according to the present invention.
First, an electronic component package A shown in FIGS. 1 to 3 is manufactured (FIG. 4a). In the package A for electronic components shown in FIGS. 1 to 3, reference numeral 1 denotes an insulating base made of glass ceramic having a thermal expansion coefficient of 10 to 15 × 10 ⁻⁶ / ° C. as an example of a base (hereinafter simply referred to as a base). It has a bottom plate portion 2 and a frame portion 3, and has concave portions 4 and 5 at both ends in the longitudinal direction for forming electrodes for electronic elements. The base 1 having such a coefficient of thermal expansion can be made of, for example, a glass ceramic containing 30 to 70 wt% forsterite powder in glass. Reference numerals 6 and 7 denote electrodes for electronic elements extending from the inside of the base 1 to the outside of the base 1 from the upper surface of the bottom plate portion 2, and one electrode 6 passes through the end surface of the one concave portion 4 and the frame portion 3, the other electrode 7 extends to the upper surface of the frame body 3 through the end face of the other recess 5, bypassing under the frame body 3. Have been. Reference numeral 8 denotes a support portion, which is formed of the same material as the electrodes 6 and 7 and is simultaneously formed, and is referred to as a so-called "pillow" for supporting an electronic element such as a crystal resonator element described later. Reference numeral 9 denotes a frame-shaped grounding / sealing electrode formed on the upper surface of the frame body portion 3 so as to be separated from the electronic element electrodes 6 and 7. Reference numeral 10 shown by a two-dot chain line is an electronic element such as a quartz vibrator.
In the electronic component package A, since the opening of the base 1 is not sealed with the cap 79 as shown in FIGS. 11 to 13, it is compared with the conventional hermetic package shown in FIGS. The height 9 of the cap 9 is reduced by the height t2. Accordingly, the overall height t1 can be reduced as compared with the conventional height t3, and the height can be reduced.
[0014]
Next, using the above electronic component package A, the conductive adhesives 11 and 12 such as solder and the like are applied to the electronic element electrodes 6 and 7 and the grounding / sealing electrode 9 on the upper surface of the frame portion 3. The sealing material 13 is formed. Further, an electronic element 10 such as a quartz-crystal vibrating element is electrically connected to the electronic element electrodes 6 and 7 with conductive adhesives 14 and 15 and mechanically fixed thereto, and the electronic component intermediate structure B shown in FIG. Produce (FIG. 4b). Here, the conductive sealing materials 11 and 12 and the conductive sealing material 13 have a melting point that melts at a temperature at which the electronic component intermediate structure B is fixed to a mounting board such as a printed board described later. Form. As the conductive adhesives 14 and 15 for connecting and fixing the electronic element 10 such as the quartz vibrating element, those having a melting point higher than the melting points of the conductive sealing materials 11 and 12 and the conductive sealing material 13 are used. .
[0015]
FIG. 6 is a perspective view of the electronic component intermediate structure B and a mounting board 50 such as a printed circuit board on which the electronic component intermediate structure B is to be mounted before being mounted. In the drawing, the electronic component intermediate structure B is turned upside down for assembling, and the mounting board 50 is provided with circuit terminals 51 for connecting the electronic element electrodes 6 and 7 of the electronic component intermediate structure B, 52, and a rectangular ground electrode 53 separated from the circuit terminals 51 and 52.
Then, the conductive adhesives 11 and 12 applied to the electronic element electrodes 6 and 7 of the electronic component intermediate structure B are applied to the circuit terminals 51 and 52 and the grounding / sealing electrode 9 respectively. The attached conductive sealing material 13 is superimposed on the ground electrode 53 and heated while being pressed, so that the conductive adhesive materials 11 and 12 applied to the electronic element electrodes 6 and 7 are melted. The electrodes 6 and 7 for the electronic element are connected to the circuit terminals 51 and 52, respectively, and at the same time, the conductive sealing material 13 applied to the electrodes 9 for grounding and sealing is melted to form the electrodes 9 for grounding and sealing. Is fixedly bonded to the ground electrode 53 (FIG. 4C). In this manner, the sealing of the opening of the electronic component intermediate structure B and the assembling of the electronic component intermediate structure B to the substrate 50 can be performed simultaneously.
For this reason, since the electronic element 10 is heated only once when assembling the electronic component intermediate structure B to the mounting board 50, there is a characteristic that the characteristic variation due to the heating hardly occurs.
FIG. 7 is a longitudinal sectional view of an electronic component assembly structure C in a state where the electronic component intermediate structure B is mounted on the substrate 50. As a matter of course, the electronic component assembly C does not use a cap, so that the overall height is reduced. In addition, since the grounding and sealing electrode 9 of the electronic component intermediate structure B is grounded by the grounding electrode 53, it is possible to prevent a change in characteristics of the electronic element 10 due to a stray capacitance or an external electromagnetic wave.
[0016]
Although the above embodiment has been described with reference to the electronic component package A having a specific configuration, the present invention is not limited to the electronic component package A having this configuration, and various types of electronic component packages A may be used without departing from the spirit of the present invention. A modified configuration can be employed.
For example, in the above-mentioned electronic component package A, using the base 1 having the same dimensions as the conventional insulating base 1 shown in FIG. 8, the width dimension w1 of the frame 3 at both ends in the longitudinal direction of the insulating base 21 is changed to the widthwise direction, as in the electronic component package D shown in FIG. May be larger than the width dimension w2 of the frame 3 at both ends. By doing so, the area of the electrodes 6 and 7 for the electronic element and the electrode 9 for grounding and sealing on the upper surface of the frame portion 3 can be increased, so that the assembling to the mounting substrate 50 becomes easy and the electrode for the electronic element Since the electrodes 6 and 7 and the grounding / sealing electrode 9 can be formed further apart from each other, the electrodes 6 and 7 and the electronic element electrodes 6 and 7 can be grounded and sealed without a high degree of positioning when assembled to the mounting substrate 50. There is a feature that a short circuit with the electrode 9 can be reliably prevented.
[0017]
9 uses an insulating base 31 in which the electrodes 6 and 7 for the electronic element are distributed to both ends in the longitudinal direction of the bottom plate 2 and a dual-use electronic element 32 as an electronic element such as a quartz vibrating element. May be used. This eliminates the need for the electrode 7 to extend under the frame 3 and extend to the other end in the longitudinal direction, so that the adhesion between the bottom plate 2 and the frame 3 is improved, and Not only does delamination not occur, but also the amount of electrode forming material used can be reduced, and the electronic element 32 can be stably supported.
[0018]
Further, in the electronic component packages A and B of the above embodiment, the case where the grounding / sealing electrode 9 is formed only on the upper surface of the frame portion 3 of the base 1, 21, or 31 is shown in FIG. As described above, the grounding conductor layer 16 may be formed on the entire bottom plate 2 of the base 41. In addition, unlike the electronic component package A shown in FIG. 1, only the upper half (the lower half in the state of FIG. 10) has electronic parts on the end faces of the recesses 4 and 5 formed at both ends in the longitudinal direction of the base 41. Element electrodes 6 and 7 are formed. Further, the base 41 has concave portions 17 and 18 at both ends in the short direction, and the ground conductor layer 19 is electrically connected to the entire surface of the end surface of the concave portions 17 and 18. Electrodes 19 and 20 are formed.
In the figure, reference numeral 60 denotes a mounting board such as a printed board, and circuit terminals 61 and 62 to which the electrodes 6 and 7 for electronic elements are connected, and a grounding / sealing electrode formed on the upper surface of the frame 3 of the base 41. 9 and a ground electrode 63 for connecting and fixing the ground conductor layer 16 formed on the lower surface of the bottom plate portion 2 of the base 41. Here, the ground electrode 63 has a larger area than the ground electrode 51 shown in FIG.
According to such a configuration, the grounding conductor layer 16 on the lower surface of the bottom plate portion 2 of the base 41 is grounded via the grounding electrodes 19 and 20 formed in the recesses 17 and 18, so that stray capacitance and extraneous There is a feature that characteristic fluctuations of the electronic elements 10 and 32 due to electromagnetic waves can be more reliably prevented.
[0019]
【The invention's effect】
As described above, the present invention provides a base having a bottom plate portion and a frame portion, and is drawn out from the inside of the base to the outside of the base, through the end surface portion of the frame portion to the upper surface portion of the frame portion. Since the electronic component package has the formed electronic element electrode and the grounding / sealing electrode formed on the upper surface of the frame portion of the base and separated from the electronic element electrode, the cap is provided. An unnecessary package for electronic components can be provided.
The present invention also provides a base having a bottom plate portion and a frame portion, and is formed to extend from the inside of the base to the outside of the base to the upper surface portion of the frame portion through the end surface of the frame portion. An electrode for an electronic element, a grounding / sealing electrode formed on the upper surface of the frame portion of the base so as to be separated from the electrode for the electronic element, and a conductive material attached to the grounding / sealing electrode. An electronic component intermediate structure in which an electronic device is connected and fixed to the electronic device electrode in the electronic component package having a sealing material, without sealing the opening of the base with a cap. Is connected to the circuit terminals of the mounting board, and the electronic component assembly is hermetically sealed to the mounting board with the conductive sealing material. Therefore, no cap is required and the overall height can be reduced.
The present invention further includes a base having a bottom plate portion and a frame portion, and is formed from the inside of the base to the outside of the base and formed through the end surface portion of the frame portion to the upper surface portion of the frame portion. An electrode for an electronic element, a grounding / sealing electrode formed on the upper surface of the frame portion of the base so as to be separated from the electrode for the electronic element, and a conductive material attached to the grounding / sealing electrode. Manufacturing a package for an electronic component having a sealing material, a process of connecting and fixing an electronic device to an electrode for an electronic device in the package for the electronic component to manufacture an electronic component intermediate structure, and an opening of the base. Connecting the electrode for electronic element to the circuit terminal of the mounting substrate without sealing with a cap, and simultaneously hermetically sealing and sealing the mounting substrate with the conductive sealing material. Method, so you need a cap An effect that can be provided for electronic assembly structure that does not.
[Brief description of the drawings]
1 is a perspective view of an electronic component package A according to an embodiment of the present invention; FIG. 2 is a plan view of the electronic component package A of FIG. 1; FIG. 3 is a plan view of the electronic component package A of FIG. FIG. 4 is a longitudinal sectional view taken along line AA. FIG. 4 is a block diagram of a manufacturing process for explaining a method of manufacturing an electronic component assembly according to the present invention. FIG. FIG. 6 is a plan view of the electronic component intermediate structure B shown in FIG. 6. FIG. 6 is a perspective view of the electronic component intermediate structure B and the mounting substrate before the electronic component intermediate structure B of FIG. FIG. 8B is a vertical cross-sectional view of the electronic component assembly structure C after mounting the mounting board. FIG. 8 is a plan view of an electronic component package D according to a second embodiment of the present invention. FIG. FIG. 10 is a plan view of an electronic component intermediate structure E using a component package. FIG. 11 is a perspective view of an electronic component intermediate structure F and a mounting board using a package for electronic components according to a fourth embodiment of the present invention before being assembled. FIG. 11 is a perspective view of an electronic component using a conventional hermetic package. FIG. 13 is a plan view of the conventional electronic component using the hermetic package of FIG. 13 with a cap and a part of a sealing material removed. FIG. 13 is a longitudinal sectional view of the conventional electronic component of FIG. Block diagram for explaining a method of manufacturing an electronic component of the present invention.
A, D Electronic component package B, E, F Electronic component intermediate structure C Electronic component assembly structure 1, 21, 31, 41 Base 2 Bottom plate 3 Frame 6, 7 Electrode 9 Electrode 9 Grounding and sealing electrode 10, 32 Electronic element (quartz oscillation element)
11, 12, 14, 15 Conductive adhesive 13 Conductive sealing material 16 Grounding conductor layer 19.20 Grounding electrode 60 Mounting board (printed board)
52, 61, 62 circuit terminals 53, 63 ground electrode

Claims

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. A package for an electronic component, comprising a grounding / sealing electrode formed separately from the electronic element electrode.

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. An electronic component package comprising: a grounding / sealing electrode formed separately from the electronic element electrode; and a conductive sealing material applied to the grounding / sealing electrode.

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. An electronic component package comprising: a grounding / sealing electrode formed in a frame shape so as to be separated from the electronic element electrode; and a conductive sealing material applied to the grounding / sealing electrode.

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. A grounding / sealing electrode formed in a frame shape apart from the electronic element electrode; a conductive sealing material applied to the grounding / sealing electrode; and an end face portion and a bottom plate portion of the base And a grounding conductor layer formed on the lower surface of the electronic component.

A base having a bottom plate portion and a frame portion; an electrode electrode for an electronic element led out from inside the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion; and an upper surface portion of the frame portion In a package for an electronic component having a grounding and sealing electrode formed in a frame shape separated from the electronic element electrode, and a conductive sealing material adhered to the grounding and sealing electrode, An electronic component intermediate structure in which an electronic element is connected and fixed to the electronic element electrode, without electrically sealing the opening of the base with a cap, and electrically connecting the electronic element electrode to a circuit terminal of a mounting board. An electronic component assembly, wherein the grounding / sealing electrode is hermetically fixed and sealed to the mounting substrate with the conductive sealing material.

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. The electronic component package according to claim 1, further comprising: a frame-shaped grounding / sealing electrode separated from the electronic element electrode; and a conductive sealing material attached to the grounding / sealing electrode. The electronic component intermediate structure in which the electronic element is connected and fixed to the element electrode, without electrically sealing the opening of the front base with a cap, electrically connecting the electronic element electrode to a circuit terminal of a mounting board, An electronic component assembly, wherein a grounding / sealing electrode is hermetically fixed and sealed to a ground electrode formed on the mounting substrate with the conductive sealing material.

A base having a bottom plate portion and a frame portion, an electrode for an electronic element led out from the inside of the base to the outside and formed up to an end surface portion and an upper surface portion of the frame portion, and an upper surface portion of the frame portion. A step of manufacturing a package for an electronic element having a frame-shaped grounding and sealing electrode separated from the electronic element electrode and a conductive sealing material applied to the grounding and sealing electrode. Connecting and fixing an electronic element to the electronic element electrode to produce an electronic component intermediate structure; and connecting the electronic element electrode to a circuit terminal of a mounting board without sealing the opening of the base with a cap. Electrically connecting the grounding and sealing electrode to a ground electrode formed on the mounting substrate and hermetically fixing and sealing the grounding electrode with the conductive sealing material. The method of manufacturing the structure.