JP2001267440A - Airtight container and method of manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an airtight container and a method of manufacture in which stabilized airtightness can be ensured even for high temperature high humidity test. SOLUTION: The airtight container 100 has an airtight section comprising a base section 120 and a cover section 140 being applied thereon wherein a gold (Au) layer and a tin (Sn) layer are laid on a part of the base section abutting against the cover section. When the gold (Au) layer and the tin (Sn) layer are diffused to form an eutectic alloy, the base section and the cover section are brought into sealed state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an airtight container whose inside is, for example, in a vacuum atmosphere, and a method of manufacturing the airtight container.

[0002]

2. Description of the Related Art In recent years, surface mounting of electronic components on a printed circuit board of a computer, a portable electronic device or the like has been actively performed. As such an electronic component, there is a cylinder type piezoelectric vibrator which is a kind of an airtight container.

[0003] This cylinder type piezoelectric vibrator 10
Is configured as shown in FIG. The cylinder type piezoelectric vibrator 10 has a lead 11 which is connected to a connection terminal of a printed circuit board by soldering.

The lead 11 is supported by a stem 12 and is arranged so as to protrude above the stem 12. The tip of the lead 11 is connected to the piezoelectric vibrating reed 13 by Pb (lead) and Sn (tin) solder, and the lead 11 holds the piezoelectric vibrating reed 13.

A stem 12 supporting such a lead 11 is provided with a lead-based plating film 12a on the outer periphery thereof. The lead-based plating film 12a is a metal film made of, for example, Pb and Sn.

A cap 14 is mounted on the stem 12 having the metal film 12a. The cap 14 is made of metal and has Cu (copper) and Ni inside.
A (nickel) film is formed by plating.

[0007] The cap 14 is moved in the direction of the arrow in FIG.

At this time, the atmosphere inside the cap 14 is evacuated and the lead-based plating film 12a of the stem 12 is formed.
Is a temperature slightly lower than its melting temperature, for example 230
Heated to degree C. When the lead-based plating film 12a is softened by the heating as described above, the cap 14 is pressed into the stem 12 so that the cap 14 comes into contact with the softened lead-based plating film 12a.

By press-fitting the cap 14 into the stem 12 in a vacuum atmosphere as described above, the airtightness between the cap 14 and the stem 12 is maintained, and the cylinder type piezoelectric vibrator 10 is formed. .

[0010]

By the way, such a cylinder type piezoelectric vibrator 10 can obtain airtightness at first, but a high temperature and humidity test (temperature 85) is performed as an airtightness test. (Degree C, humidity 85%), the lead (P) in the sealing portion between the cap 14 and the stem 12
b), tin (Sn) solder gradually became brittle crystals, could not maintain sufficient airtightness, and caused sealing leakage.

The sealing leakage breaks the vacuum state in the cap 14, causing a problem that the cylinder type piezoelectric vibrator 10 does not function normally.

Accordingly, an object of the present invention is to provide an airtight container having high airtight reliability and a method for manufacturing the airtight container.

[0013]

According to the first aspect of the present invention, there is provided an airtight container having an airtight portion formed by a base and a cover disposed so as to cover the base. Then, a gold (Au) layer and a tin (Sn) layer are laminated on a portion of the base that comes into contact with the cover, and the laminated gold (Au) layer and tin (Sn) layer are diffused to form a eutectic alloy. This is achieved by an airtight container having a configuration in which the base and the cover are sealed when the above condition is satisfied. According to the above configuration, when the laminated gold (Au) layer and tin (Sn) layer are diffused and become a eutectic alloy, the base and the cover are in a sealed state. Unlike the state of sealing with a system plating film or the like, since it has a more stable crystal structure, sealing leakage does not occur.

Preferably, according to the invention of claim 2, in the structure of claim 1, the gold (Au) layer is made of tin (Sn).
It is an airtight container formed four times or more of the layer.

According to the above configuration, since the gold (Au) layer is formed at least four times as large as the tin (Sn) layer, the eutectic alloy layer of the sealing portion has a highly reliable and stable crystal structure. Become.

Preferably, according to the invention of claim 3, in the structure of claim 2, the gold (Au) layer and the tin (S
n) An airtight container formed in a ratio of 4: 1 with the layer.

According to the above configuration, since the ratio of the gold (Au) layer to the tin (Sn) layer is formed at a ratio of 4: 1, the eutectic alloy layer of the sealing portion is stable. It becomes a crystal structure.

Preferably, according to the invention of claim 4, in the structure of any one of claims 1 to 3, the gold (Au) layer is provided on a portion of the base portion that is in contact with the cover portion. An airtight container having a configuration in which the tin (Sn) layer is provided thereon. According to the above configuration, since the tin layer is disposed on the outermost surface, the tin layer functions as a cushioning material when the cover is pressed.

Preferably, according to the invention of claim 5, in the structure of any one of claims 1 to 3, the gold (Au) layer is provided on a portion of the base portion that comes into contact with the cover portion. An airtight container having a configuration in which the tin (Sn) layer is provided thereon, and the gold (Au) layer is provided thereon.

According to the above configuration, the oxidation of the tin (Sn) layer can be prevented by forming the outermost layer as the gold (Au) layer. By preventing the oxidation of tin (Sn), a eutectic alloy layer having a stable bonding force can be formed in the sealing portion.

According to a sixth aspect of the present invention, there is provided an electronic apparatus comprising: a base; a cover disposed so as to cover the base;
Wherein a tin (Sn) layer is formed in a portion of the base portion that abuts on the cover portion, and the cover portion corresponding to the tin (Sn) layer includes gold ( Au) layer is formed, and the gold (Au) layer and tin (S
n) This is achieved by an airtight container in which the base and the cover are sealed when the layer is diffused and becomes a eutectic alloy.

Preferably, according to a seventh aspect of the present invention, in the configuration of any one of the first to sixth aspects, the airtight container is an airtight container that is a piezoelectric vibrator.

According to the above configuration, since the hermetic container is a piezoelectric vibrator, in the sealed state, leakage of sealing hardly occurs, and the piezoelectric vibrator has high airtight reliability.

Preferably, according to the invention of claim 8, in the structure of claim 7, a gold (Au) layer and a tin (Sn) layer are laminated on the piezoelectric vibrating reed holding portion provided so as to protrude from the base. Then, the laminated gold (Au) layer and tin (Sn)
An airtight container in which the piezoelectric vibrating piece holding portion is fixed to the piezoelectric vibrating piece when the layer is diffused and becomes a eutectic alloy.

According to the above configuration, a gold (Au) layer and a tin (Sn) layer are laminated on the piezoelectric vibrating piece holding portion, and the laminated gold (Au) layer and tin (Sn) layer are diffused, Since the piezoelectric vibrating reed holding portion is fixed to the piezoelectric vibrating reed when the eutectic alloy is formed, the eutectic alloy layer of the fixed portion between the piezoelectric vibrating reed holding portion and the piezoelectric vibrating reed is provided. Is a highly reliable and stable tissue and does not degrade the function of the piezoelectric vibrator.

Preferably, according to the ninth aspect of the present invention, in the configuration of the eighth aspect, the gold (Au) layer is made of tin (Sn).
It is an airtight container formed four times or more of the layer.

According to the above configuration, since the gold (Au) layer is formed at least four times as large as the tin (Sn) layer, the eutectic alloy of the piezoelectric vibrating piece holding section and the fixing section of the piezoelectric vibrating piece is formed. The layers are
It is a stable tissue with high reliability, and the fixed state is stable.

Preferably, according to the tenth aspect of the present invention,
The airtight container according to claim 9, wherein the ratio of the gold (Au) layer to the tin (Sn) layer is 4: 1.

According to the configuration, the ratio between the gold (Au) layer and the tin (Sn) layer is formed at a ratio of 4: 1. The eutectic alloy layer of the fixing portion has a stable structure with high reliability, and the fixing state becomes stable.

According to the eleventh aspect, the object is as follows.
A step of laminating a gold (Au) layer and a tin (Sn) layer on a base that is in contact with a cover that is arranged to cover the base, and a step of laminating the laminated gold (Au) and tin (Sn) layers The step of raising the ambient temperature to such an extent that the diffusion of gold (Au) and tin (Sn) proceeds; the step of pushing the cover portion into the base; and the diffusion of the gold (Au) and tin (Sn). Of the stacked gold (Au) layer and tin (S
In the n) layer, a hermetic sealing process including a step of increasing the ambient temperature so that an eutectic alloy is formed, and a step of forming the eutectic alloy so that the base and the cover are sealed. This is achieved by a method of manufacturing a container.

According to the above method, the laminated gold (A
u) and tin (Sn), the temperature of the atmosphere is raised to such an extent that the diffusion proceeds, and further, the temperature of the atmosphere is raised so that a eutectic alloy is formed, and the base and the cover are sealed. Therefore, unlike the sealing of the lead-based plating film, the eutectic alloy layer in the sealing portion has a more reliable and stable crystal structure, so that a highly reliable hermetic container can be manufactured.

Preferably, according to the twelfth aspect of the invention,
12. The method of claim 11, wherein the base includes the gold (A).
This is a method for manufacturing an airtight container having a step of forming a u) layer four times or more as large as a tin (Sn) layer.

According to the method, the gold (Au) layer has a step of forming at least four times the tin (Sn) layer on the base, so that the gold (Au) layer is formed of the tin (Sn) layer. Since it is formed four times or more, the eutectic alloy layer of the sealing portion has a highly reliable and stable crystal structure.

[0034] Preferably, according to the invention of claim 13,
13. The method of claim 12, wherein the base includes the gold (A).
A method for manufacturing an airtight container, comprising a step of forming a u) layer and the tin (Sn) layer in a ratio of 4: 1.

According to the above method, the ratio of the gold (Au) layer to the tin (Sn) layer is formed at a ratio of 4: 1. And a stable crystal structure.

Preferably, according to the invention of claim 14,
14. The method according to claim 11, wherein the gold (Au) layer is provided on the base, and the tin (Sn) layer is provided thereon.

According to the above method, since the tin layer is disposed on the outermost surface, when the cover is press-fitted, the tin layer functions as a cushioning material.

Preferably, according to the invention of claim 15,
The method according to any one of claims 11 to 13,
A method for manufacturing an airtight container, comprising: providing the gold (Au) layer on the base, providing the tin (Sn) layer thereon, and providing the gold (Au) layer thereon. .

Preferably, according to the invention of claim 16,
The method according to any one of claims 11 to 15,
A method for manufacturing an airtight container, wherein the airtight container is a piezoelectric vibrator.

According to the above method, since the hermetic container is a piezoelectric vibrator, the hermetically sealed piezoelectric vibrator can maintain airtightness even in a high-temperature and high-humidity test in the sealed state.

Preferably, according to the seventeenth aspect,
17. The method according to claim 16, wherein a gold (Au) layer and a tin (S) layer are provided on the piezoelectric vibrating piece holder provided so as to protrude from the base.
n) a step of laminating the layers and gold (A)
u) and tin (Sn) layers, gold (Au) and tin (Sn)
n) elevating the ambient temperature to such an extent that the diffusion proceeds, a step of evacuating the atmosphere in the cover part, a step of pushing the cover part into the base, Increasing the ambient temperature so that a eutectic alloy is formed in the stacked gold (Au) layer and tin (Sn) layer in which diffusion with (Sn) is progressing; and forming the eutectic alloy. And fixing the piezoelectric vibrating reed to the piezoelectric vibrating reed holding part.

According to the above method, a gold (Au) layer and a tin (Sn) layer are laminated on the piezoelectric vibrating piece holding portion, and the laminated gold (Au) and tin (Sn) are diffused, and Since the piezoelectric vibrating reed holding portion is fixed to the piezoelectric vibrating reed when it becomes a crystal alloy, the eutectic alloy layer of the fixed portion between the piezoelectric vibrating reed holding portion and the piezoelectric vibrating reed is It has a highly reliable, stable eutectic structure and a stable fixed state.

Preferably, according to the eighteenth aspect,
18. The method according to claim 17, wherein the gold (Au) layer of the piezoelectric vibrating piece holding portion is formed to be four times or more the tin (Sn) layer.

According to the above method, since the gold (Au) layer is formed at least four times as large as the tin (Sn) layer, the eutectic alloy of the fixed portion between the piezoelectric vibrating piece holding portion and the piezoelectric vibrating piece is formed. The layers are
It has a reliable and stable eutectic structure, and the fixed state is stable.

Preferably, according to the nineteenth aspect,
The method according to claim 17, wherein the ratio of the gold (Au) layer and the tin (Sn) layer of the piezoelectric vibrating piece holding portion is formed at a ratio of 4: 1.

According to the above method, the ratio of the gold (Au) layer to the tin (Sn) layer is formed at a ratio of 4: 1. The eutectic alloy layer of the fixed portion has a highly reliable and stable eutectic structure, and the fixed state becomes stable.

[0047]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing a cylinder type piezoelectric vibrator 100 according to an embodiment of the airtight container of the present invention.

As shown in FIG. 1, the piezoelectric vibrator 100 has a metal cap 140 which is a cover for accommodating the piezoelectric vibrating piece 130 therein. The cap 140 is press-fitted into the stem 120 which is the base shown in FIG. 1, and the inside thereof is kept in a vacuum state. When the piezoelectric vibrating reed 130 made of quartz or the like is arranged in a vacuum atmosphere as described above, good characteristics can be obtained.

In order to support such a piezoelectric vibrating piece 130, for example, two leads 110 serving as a vibrating piece holding section are provided. As shown in FIG. 2, the lead 110 has a substantially columnar central portion 111 made of a Kovar alloy at the center thereof, and nickel (Ni) on its surface.
Is formed by plating with a thickness of, for example, 1 to 5 μm.

On this nickel layer 112, gold (Au)
Is formed with a thickness of 2 to 5 μm by plating. On this gold layer 113, tin (S
n), the tin layer 114 composed of
It is formed with a thickness of μm.

At this time, the thickness of the gold layer 113 and the tin layer 114 is 4: 1 or the thickness of the gold layer 113 is four times or more the thickness of the tin layer 114.

The stem 120 is arranged so as to hold the lead 110 thus configured. The stem 120 is provided with a core 121 made of Kovar glass, which is a central insulator thereof.
A lead 110 is provided so as to penetrate through the lead 1.

On the surface of the core 121, nickel (N
i) is made of, for example, 1 to 5 μm
And formed by plating. A gold layer 123 made of gold (Au) is formed on the nickel layer 122 by plating to have a thickness of 2 to 5 μm. On this gold layer 123, a tin layer 124 made of tin (Sn) is formed by plating to a thickness of 0.5 to 5 μm.

At this time, the thickness of the gold layer 123 and the tin layer 124 is 4: 1 or the thickness of the gold layer 123 is four times or more the thickness of the tin layer 124.

The piezoelectric vibrator 1 configured as described above
The piezoelectric vibrator 100 is formed by press-fitting the cap 140 into the stem 120 in a vacuum atmosphere and keeping the inside of the cap 140 in a vacuum state. The manufacturing method thereof will be described in detail below.

First, the piezoelectric vibrating reed 13 is attached to a lead 110 provided on a stem 130 configured as shown in FIG.
0 will be described first.

First, a heating laser (not shown) is applied to the lead 110 attached to the stem 130 to heat it. Specifically, of the inner leads 115 protruding upward from the stem 130 in FIG. 2, only the portion bonded to the piezoelectric vibrating reed 130 is heated by the heating laser. In this way, by using the heating laser, only the portion of the inner lead 115 that is joined to the piezoelectric vibrating piece 130 is heated. Therefore, the other inner lead 115 and the stem 120 are heated so that the gold layer 123 and the tin layer 124 provided on the stem 120 are heated.
Can be prevented from being affected by heat.

The heating at this time is as follows:
The interdiffusion of tin (Sn) and gold (Au) is rapidly advanced, and the eutectic alloy at the joint becomes Au: Sn = 4: 1 or more. At this time, the rapid diffusion is caused by the intermetallic compounds AuSn and AuSn _{2 which} are considered to be rather fragile as a eutectic alloy. And so on. However, this does not cause a problem in the reliability of the bonded portion as the piezoelectric vibrator.

After the inner lead 115 of the lead 110 and the piezoelectric vibrating piece 130 are securely bonded as described above, the stem 120 with the lead 110 and the cap 140 to which the piezoelectric vibrating piece 130 is bonded are placed in a chamber (not shown). Will be accommodated.

Then, the atmosphere in this chamber is raised to about 10 ⁻³ Pas by a vacuum device (not shown) to be a vacuum atmosphere.

At this time, as shown in FIG. 1, the cap 140 is not pushed into the stem 120 but is held near the stem 120 by a jig (not shown). In this state,
The vacuum device is operated, and a jig (not shown) is raised by a heater (not shown) at a slow speed such that the temperature rises by about 20 ° C. per minute. When this temperature rises to, for example, 260 ° C., the temperature of the jig is maintained at this temperature for about 15 minutes.

In this state, the gold layer 123 and the tin layer 124 formed on the surface of the stem 120 are in a diffusion state, similarly to the above-described bonding of the piezoelectric vibrating piece 130 and the inner lead 115. Is pressed into the surface of the stem 120 so as to be pushed in, and the cap 140 and the stem 120 are sealed.

At this time, since the gold layer 123 and the tin layer 124 provided on the surface of the stem 120 are at a high temperature of 260 ° C., they are in a relatively soft state, and the cap 140 and the stem 120 are sealed. It is in a state where it is easy to do. In particular,
Since the outermost surface directly in contact with the cap 140 is made of the soft metal tin layer 124, the cap 140
During press-fitting, it will function as a cushioning material.

When the sealed state of the cap 140 and the stem 10 is thus formed, the temperature in the chamber is further raised to 320 ° C. As a result, the gold layer 123 and the tin layer 124, which have been in a diffused state, further proceed to undergo a eutectic reaction, and the eutectic alloy of gold and tin is turned into a stem 120.
Is formed on the nickel layer 122 on the surface.

The eutectic alloy of gold and tin is formed of nickel layer 122
Once formed, the seal between cap 140 and stem 120 is assured.

As described above, the temperature is raised to 320 ° C., and when the eutectic alloy is formed, this state is maintained for several minutes to make this sealing more secure. Cool naturally as soon as possible so that no gas is generated from the eutectic alloy of gold and tin.

The eutectic alloy layer of the sealing portion is made of the piezoelectric vibrating reed 1
Unlike the eutectic alloy layer at the time of joining the inner lead 115 and the inner lead 115, a highly reliable eutectic alloy layer can be obtained without generating brittle intermetallic compounds.

The piezoelectric vibrator 1 manufactured as described above
00 is mounted as an electronic component on a printed circuit board such as a computer or a portable electronic device.

At this time, the leads 11 of the piezoelectric vibrator 100
The 0 outer lead 116 is connected to the connection terminal of the printed circuit board in a solder reflow process. In this solder reflow step, the temperature rises to about 230 ° C., but the eutectic alloy of gold and tin used for sealing the cap 140 and the stem 120 of the piezoelectric vibrator 100 has a ratio of, for example, 4: 1. Alloy.

In FIG. 3, when Au: Sn = 4: 1 or more, an alloy of the intermetallic compound AuSn and the β phase is generated, and the composition of the alloy is very stable and high in reliability. For this reason, the airtightness is maintained even in the high-temperature and high-humidity test, even after being left for 1000 hours.

As described above, in the present embodiment, since the crystal structure of the eutectic alloy in the sealing portion of the piezoelectric vibrator 100 is high in reliability and stable, the airtightness of the piezoelectric vibrator 100 is reduced. Even when a high-temperature and high-humidity test (temperature of 85 ° C., humidity of 85%) is performed, stable airtightness can be obtained.

In the present embodiment, the ratio of the eutectic alloy of gold and tin is set to 4: 1. However, the ratio is not limited to this, and gold may be set to 80% or more. In this case, as shown in FIG. The melting point is 280 degrees or more, and a more reliable piezoelectric vibrator is formed.

Further, in the present embodiment, the stem 120
The gold layer 123 and the tin layer 124 are formed on the side, but the present invention is not limited to this.
Obviously, a gold layer may be provided in a portion in contact with 20 to form a eutectic alloy and sealed.

In the present embodiment, the stem 120
Gold layer 123 on nickel layer 122 and tin layer 1 on it
Although 24 is provided, a gold layer may be further provided on the tin layer 124. In this case, oxidation of the tin layer 124 can be prevented by forming the outermost layer as a gold (Au) layer. By preventing the oxidation of tin (Sn), a eutectic alloy layer having a stable bonding force can be formed at the sealing portion.

Incidentally, the present invention is not limited to the above-described embodiments and the like, and various changes can be made without departing from the scope of the claims. In addition, each configuration of the above embodiments and the like may be partially omitted, or may be changed to another arbitrary combination not described above.

[0077]

As described above, according to the present invention, an airtight container having high airtight reliability and a method for manufacturing the airtight container can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a piezoelectric vibrator according to an embodiment of the present invention.

FIG. 2 is a schematic enlarged sectional view of a stem and leads of the piezoelectric vibrator of FIG. 1;

FIG. 3 is a diagram showing a state of a eutectic alloy of gold and tin.

FIG. 4 is a schematic sectional view showing a conventional piezoelectric vibrator.

[Explanation of symbols]

 100: Piezoelectric vibrator 110: Lead 111: Center 112: Nickel layer 113: Gold layer 114: Tin layer 115: Inner lead 116: Outer lead 120 ..Stem 121 ... Core 122 ... Nickel layer 123 ... Gold layer 124 ... Tin layer 130 ... Piezoelectric vibrating reed 140 ... Cap

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 41/09 H03H 3/02 B H03H 3/02 9/02 B 9/02 9/10 9/10 H01L 41/08 CF term (reference) 4K024 AA03 AA07 AA11 AB03 BA01 BB09 BB21 BC04 DB01 GA14 4K028 CA01 CB02 CC01 4K044 AA02 AB10 BA06 BA08 BA10 BB04 BC08 CA18 CA62 5J108 BB02 CC04 EE02 EE11 FF10 GG10 MM10

Claims (19)

[Claims] An airtight container having an airtight portion formed by a base portion and a cover portion arranged to cover the base portion, wherein a portion of the base portion that contacts the cover portion is made of gold (Au). Layer and a tin (Sn) layer are laminated, and when the laminated gold (Au) layer and tin (Sn) layer are diffused to form a eutectic alloy, the base and the cover are sealed. An airtight container characterized by having the following configuration. 2. The airtight container according to claim 1, wherein the gold (Au) layer is formed at least four times as large as the tin (Sn) layer. 3. The airtight container according to claim 2, wherein the ratio of the gold (Au) layer to the tin (Sn) layer is 4: 1. 4. The structure according to claim 1, wherein the gold (Au) layer is provided in a portion of the base portion that comes into contact with the cover portion, and the tin (Sn) layer is provided thereon. An airtight container according to claim 3. 5. A structure in which the gold (Au) layer is provided on a portion of the base portion that is in contact with the cover portion, the tin (Sn) layer is provided thereon, and the gold (Au) layer is provided thereon. The airtight container according to claim 1, wherein the airtight container is formed. 6. An airtight container having an airtight portion formed by a base portion and a cover portion disposed so as to cover the base portion, wherein tin (Sn) is provided on a portion of the base portion that contacts the cover portion. The cover (corresponding to the tin (Sn) layer) has gold (A)
u) layer is formed, and when the gold (Au) layer and the tin (Sn) layer are diffused to form a eutectic alloy, the base and the cover are sealed. An airtight container characterized by the above-mentioned. 7. The airtight container according to claim 1, wherein the airtight container is a piezoelectric vibrator. 8. A gold (Au) layer and a tin (Sn) layer are laminated on a piezoelectric vibrating reed holding portion provided to protrude from the base, and the laminated gold (Au) layer and tin (Sn) layer 8. The hermetic container according to claim 7, wherein the piezoelectric vibrating piece holding portion is fixed to the piezoelectric vibrating piece when is diffused and becomes a eutectic alloy. 9. The airtight container according to claim 8, wherein the gold (Au) layer is formed at least four times as large as the tin (Sn) layer. 10. The airtight container according to claim 9, wherein a ratio of the gold (Au) layer and the tin (Sn) layer is formed at a ratio of 4: 1. 11. A cover portion arranged so as to cover the base portion has a gold (Au) layer and a tin (Sn) layer on the contacting base portion.
Stacking layers, increasing the ambient temperature to such an extent that diffusion of gold (Au) and tin (Sn) proceeds in the stacked gold (Au) layer and tin (Sn) layer, Eutectic alloy is formed in the laminated gold (Au) layer and tin (Sn) layer in which the diffusion of gold (Au) and tin (Sn) is progressing. A process of raising the ambient temperature, and a process of forming the eutectic alloy so that the base and the cover are in a sealed state. 12. The method for manufacturing an airtight container according to claim 11, wherein the base has a step of forming the gold (Au) layer at least four times as large as the tin (Sn) layer. 13. The hermetic container according to claim 12, wherein the base has a step of forming the gold (Au) layer and the tin (Sn) layer in a ratio of 4: 1. Production method. 14. The gold (Au) layer is provided on the base,
14. The method for manufacturing an airtight container according to claim 11, further comprising a step of providing the tin (Sn) layer thereon. 15. The gold (Au) layer is provided on the base,
The tin (Sn) layer is provided thereon, and the gold (A)
14. The method for producing an airtight container according to claim 11, further comprising a step of providing a layer (u). 16. The method for manufacturing an airtight container according to claim 11, wherein the airtight container is a piezoelectric vibrator. 17. A step of laminating a gold (Au) layer and a tin (Sn) layer on a piezoelectric vibrating piece holding portion provided so as to protrude from the base, and a step of laminating the laminated gold (Au) layer and tin (Sn). In the (Sn) layer, a step of increasing the ambient temperature to such an extent that the diffusion of gold (Au) and tin (Sn) progresses; a step of evacuating the atmosphere in the cover section; At the ambient temperature so that a eutectic alloy is formed in the stacked gold (Au) layer and tin (Sn) layer in which the diffusion of gold (Au) and tin (Sn) is progressing. 17. The manufacturing of the hermetic container according to claim 16, comprising: a step of raising the pressure; and a step of fixing the piezoelectric vibrating piece holding portion and the piezoelectric vibrating piece by forming the eutectic alloy. Method. 18. The method for manufacturing an airtight container according to claim 17, further comprising a step of forming a gold (Au) layer of the piezoelectric vibrating piece holding portion at least four times as large as a tin (Sn) layer. . 19. The method according to claim 17, further comprising the step of forming a ratio of the gold (Au) layer and the tin (Sn) layer of the piezoelectric vibrating piece holding portion to a ratio of 4: 1. Of manufacturing airtight containers.