JP2022102015A - Package, lid, and manufacturing method for package - Google Patents

Abstract

To provide a package that can withstand high temperatures, such as during reflow operations, and maintain hermetic sealing without the need to unevenly distribute intermetallic compounds.SOLUTION: The package includes a lid 6 and a base 4 that together with the lid 6 constitutes the interior space. The lid 6 and base 4 are joined together through a sealant 5 to hermetically seal the interior space. The sealant 5 includes an intermetallic compound including tin, gold, and a metal for forming a total percentage solid solution with gold, e.g., copper.SELECTED DRAWING: Figure 4

Description

The present invention relates to a package suitable as a package for a piezoelectric device or the like, a lid used in this package, and a method for manufacturing the package.

As a package of this type, there is a package in which a base on which an electronic component element is mounted is covered with a lid to hermetically seal the internal space (cavity) in which the electronic component element is housed. In such a package, the base and lid are airtightly joined via a sealant.

Surface-mounted electronic components are exposed to a high temperature of about 260 degrees during the reflow work during surface mounting, but in such high-temperature reflow work, the sealing material that joins the base and lid does not melt. It is necessary to maintain airtightness.

Therefore, for example, in Patent Document 1, a bonding material containing an intermetallic compound having a high melting temperature is formed and sealed, and the intermetallic compound does not melt even at a high temperature such as during reflow work, and is air-sealed. It is possible to keep it in a stopped state.

Japanese Patent No. 5853702

In Patent Document 1, the encapsulant forming the intermetallic compound contains copper (Cu) and tin (Sn), but the intermetallic compound is used because copper does not dissolve in tin at the time of melting. It is difficult to produce in large quantities.

Therefore, the intermetallic compounds produced are unevenly distributed in the central portion of the encapsulant so that the airtightly sealed state can be maintained even if the amount of the intermetallic compounds produced is small. In order to disperse the intermetallic compound unevenly in the central portion of the encapsulant in this way, it is necessary to bend the metal layer to be the bonding layer in a convex shape, which complicates the encapsulation process and is troublesome. It is such a thing.

The present invention has been made in view of the above points, and it is not necessary to unevenly distribute the intermetallic compounds to be produced, and it can withstand high temperatures such as during reflow work and maintain an airtightly sealed state. It is an object of the present invention to provide a possible package, a lid used therein, and a method for manufacturing the package.

In the present invention, in order to achieve the above object, it is configured as follows.

(1) The package according to the present invention includes a lid and a base that constitutes an internal space together with the lid. The lid and the base are joined via a sealing material, and the internal space is hermetically sealed. It is a package to be used
The encapsulant contains tin, gold, and an intermetallic compound composed of gold and a metal forming a total solid solution.

According to the package according to the present invention, the encapsulant that joins the lid and the base contains a high melting point intermetallic compound consisting of tin, gold, and a metal that forms a total solid solution with gold, and thus reflows. The intermetallic compound does not melt even when exposed to high temperatures during work, and the internal space can be kept in an airtightly sealed state.

Further, since the intermetallic compound contains at least tin and gold, it is possible to sufficiently produce an intermetallic compound as compared with the intermetallic compound composed of tin and copper as in Patent Document 1, and thus it is stable. Can be joined.

(2) In a preferred embodiment of the present invention, the metal forming a solid solution with gold is copper.

According to this embodiment, the internal space can be kept in an airtightly sealed state by a sealing material containing a high melting point intermetallic compound consisting of tin, gold, and copper forming a total solid solution with gold.

(3) In another embodiment of the present invention, a copper-rich layer is provided on the lid side of the encapsulant.

According to this embodiment, a copper-rich layer is provided on the lid side of the encapsulant containing an intermetallic compound composed of tin, gold, and copper. The difference in the coefficient of thermal expansion from the copper-rich layer becomes small, the influence of thermal stress at the time of mounting and the like can be reduced, the affinity becomes good, and the adhesion is improved.

(4) In still another embodiment of the present invention, the metal forming a solid solution with gold is formed in the lid over the joint region to be joined to the base and the outside of the joint region. ..

According to this embodiment, the metal forming the total solid solution with gold is formed over the joining region of the lid to be joined to the base and the outside of the joining region, so that when joining the lid to the base, the metal is formed. The metal forming the total solid solution with gold can be sufficiently supplied to the joint portion where tin and gold are melted. This makes it possible to stably produce an intermetallic compound composed of tin, gold, and a metal forming a total solid solution with gold.

(5) In another embodiment of the present invention, the base has a bottom wall portion and a side wall portion extending upward from the peripheral edge portion of the bottom wall portion and formed in a circumferential shape, and the bottom wall portion. The storage recess is partitioned by the portion and the side wall portion, and the peripheral edge portion of the lid is joined to the upper surface of the side wall portion of the base via the sealing material to form the storage as the internal space. The recess is hermetically sealed.

According to this embodiment, the bottom wall portion and the side wall portion of the base form a storage recess, and the peripheral edge portion of the lid is joined to the upper surface of the side wall portion of the base via a sealing material in an internal space. A storage recess can be hermetically sealed.

(6) In one embodiment of the present invention, the intermetallic compound of the encapsulant is formed between the facing regions where the peripheral portion of the lid and the upper surface of the side wall portion of the base face each other. ing.

According to this embodiment, since a high melting point intermetallic compound is formed between the facing regions where the peripheral edge of the lid and the upper surface of the side wall of the base face each other, it is exposed to a high temperature during reflow work or the like. However, the intermetallic compound between the peripheral edge of the lid and the upper surface of the side wall of the base does not melt, and the airtight state of the internal space can be reliably maintained.

(7) In another embodiment of the present invention, the encapsulant has a fillet made of tin extending from the facing region toward the inner peripheral side of the lid.

According to this embodiment, since the fillet made of tin extends toward the inner peripheral side of the lid from the intermetallic compound formed in the facing region, the inner peripheral side of the intermetallic compound is protected by the fillet made of tin. , The bond between the base and the lid can be strengthened.

(8) In still another embodiment of the present invention, the encapsulant has a fillet made of tin extending from the facing region toward the outer peripheral side of the side wall portion of the base.

According to this embodiment, since the fillet made of tin extends toward the outer peripheral side of the side wall portion of the base with respect to the intermetallic compound formed in the facing region, the outer peripheral side of the intermetallic compound is protected by the fillet made of tin. The bond between the base and the lid can be further strengthened.

(9) In a preferred embodiment of the present invention, the internal space is a vacuum or an inert gas atmosphere.

According to this embodiment, the electronic component element housed in the internal space is not affected by the humidity and oxygen in the air, and it is possible to prevent the characteristics from deteriorating or becoming unstable.

(10) In another embodiment of the present invention, the electronic component element is housed in the internal space.

According to this embodiment, the electronic component element can be housed in the internal space of the package and hermetically sealed to form an electronic device.

(11) In still another embodiment of the present invention, the electronic component element housed in the internal space includes a piezoelectric element.

According to this embodiment, the piezoelectric element can be housed in the internal space of the package and hermetically sealed to form a piezoelectric device.

(12) The lid according to the present invention is a lid that constitutes an internal space together with a base and is joined to the base to airtightly seal the internal space.
In the lid, a metal layer made of gold and a metal forming a total solid solution is formed over the joint region to be joined to the base and the outside of the joint region, and the joint region is formed on the metal layer. , A metal brazing layer containing tin is formed.

According to the lid according to the present invention, a base having a gold layer is bonded to a metal brazing metal layer containing tin of the lid, and has a high melting point consisting of tin, gold, and a metal forming a solid solution with gold. Since the intermetallic compound can be produced, the intermetallic compound does not melt even when exposed to a high temperature during reflow work, and the internal space can be kept in an airtightly sealed state.

(13) In a preferred embodiment of the present invention, the metal forming a solid solution with gold is copper.

According to this embodiment, the internal space can be kept in an airtightly sealed state by a high melting point intermetallic compound consisting of tin, gold, and copper forming a total solid solution with gold.

(14) The method for manufacturing a package according to the present invention includes a lid and a base that constitutes an internal space together with the lid, and the lid and the base are joined via a sealing material to form the internal space. A method for manufacturing airtightly sealed packages.
A first metal layer made of a metal forming a solid solution with gold is formed over the joint region joined to the base of the lid and outside the joint region, and on the first metal layer of the joint region. A lid preparation step of forming a metal brazing metal layer containing tin, a base preparation step of forming a second metal layer containing gold in a bonding region joined to the lid of the base, and the lid and the base. An electronic component element is housed in the internal space composed of the above, and the lid and the base are overlapped with each other so that the metal brazing material layer and the second metal layer are in contact with each other. The lid and the base which are overlapped are heated to heat and melt the metal brazing material layer, the second metal layer and the first metal layer to form the sealing material, and the lid and the base are formed. In the joining step, the encapsulant containing tin, gold, and an intermetallic compound composed of the metal forming a solid solution with gold is produced.

According to the method for manufacturing a package according to the present invention, in the lid preparation step, a first metal layer made of gold and a metal forming a total solid solution is formed over the joint region to be joined to the base and the outside of the joint region. At the same time, a lid having a metal brazing metal layer containing tin is prepared on the first metal layer of the joint region, and a second metal layer containing gold is formed in the joint region to be joined to the lid in the base preparation step. Prepare the base. Then, in the superposition step, the electronic component element is housed in the internal space, and the lid and the base are superposed so that the metal brazing material layer and the second metal layer are in contact with each other. And the base are heated to heat and melt the metal brazing metal layer, the second metal layer and the first metal layer, and between tin, gold, and a high melting point metal composed of gold and a metal forming a total solid melt. Since the encapsulant containing the compound is produced, the intermetallic compound does not melt even when exposed to a high temperature during reflow work, and the internal space can be kept in an airtight sealed state.

Further, since the intermetallic compound contains at least tin and gold, it is possible to sufficiently produce an intermetallic compound as compared with the intermetallic compound composed of tin and copper as in Patent Document 1, and thus it is stable. Can be joined.

(15) In a preferred embodiment of the present invention, the metal forming a solid solution with gold is copper.

According to this embodiment, the internal space can be kept in an airtightly sealed state by a sealing material containing a high melting point intermetallic compound consisting of tin, gold, and copper forming a total solid solution with gold.

According to the present invention, the encapsulant for joining the lid and the base contains a high melting point intermetallic compound composed of tin, gold, and a metal forming a total solid solution with gold. Even if it is exposed to a high temperature such as, the intermetallic compound does not melt and the internal space can be kept in an airtightly sealed state.

Further, since the intermetallic compound contains at least tin and gold, it is possible to sufficiently produce an intermetallic compound as compared with the intermetallic compound composed of tin and copper as in Patent Document 1, and thus it is stable. Can be joined.

FIG. 1 is a schematic cross-sectional view of a crystal unit including a package according to an embodiment of the present invention. FIG. 2 is a schematic plan view of a base that houses and holds a crystal vibrating piece. FIG. 3 is a partially enlarged cross-sectional view of the base 4 and the lid 6 before joining. FIG. 4 is a partially enlarged cross-sectional view corresponding to FIG. 3 showing a joint portion between the base 4 and the lid 6. FIG. 5 is a partially enlarged cross-sectional view corresponding to FIG. 4 of another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of a crystal oscillator including a package according to an embodiment of the present invention, and FIG. 2 is a schematic plan view of a base containing and holding a crystal vibrating piece.

As shown in FIG. 1, the crystal oscillator 1 of this embodiment includes a package 3 that houses and holds a crystal vibration piece 2 as an electronic component element. The package 3 includes a base 4 having a storage recess with an open top, and a lid 6 joined to the opening of the base 4 via a sealing material 5. The base 4 and the lid 6 form an internal space 7 for accommodating the crystal vibrating piece 2, and the lid 6 is joined to the base 4 to airtightly seal the internal space 7.

The base 4 is formed by laminating ceramic materials. Specifically, the base 4 has a bottom wall portion 8 and a side wall portion 9 extending upward from the entire circumference of the peripheral edge portion of the bottom wall portion 8. The base 4 is formed in a rectangular box shape in a plan view in which the storage recesses constituting the internal space 7 are partitioned by the bottom wall portion 8 and the side wall portions 9. The base 4 is configured by laminating a ceramic annular plate corresponding to the side wall portion 9 on a single ceramic plate corresponding to the bottom wall portion 8 having a rectangular shape in a plan view and integrally firing the base 4 in a concave shape.

As shown in FIG. 2, a pair of crystal vibrating pieces 2 are joined to both ends on one end side in the longitudinal direction (left-right direction in FIG. 2) on the inner bottom surface of the base 4, that is, the upper surface of the bottom wall portion 8. The electrode pads 10 and 10 of the above are formed.

A pair of excitation electrodes 11 and 11 are formed on the front and back of the central portion of the crystal vibrating piece 2, and each of the excitation electrodes 11 and 11 is made of a conductive resin adhesive, a metal bump, or the like via an extraction electrode. The conductive bonding materials 12 and 12 are electromechanically bonded to the electrode pads 10 and 10, respectively. A plurality of external connection terminals (not shown) for mounting the crystal oscillator 1 on an external circuit board or the like are formed on the outer bottom surface of the base 4, and the pair of electrode pads 10 and 10 are provided. It is electrically connected to the external connection terminal via the internal wiring.

FIG. 3 is a partially enlarged cross-sectional view of the base 4 and the lid 6 before joining.

The upper surface of the side wall portion 9 of the base 4 is a joint surface with the peripheral edge portion of the lid 6, and a metal layer for joining with the lid 6 is formed on this joint surface. This metal layer has a laminated structure of a plurality of layers. Specifically, on the upper surface of the side wall portion 9 of the base 4, a metallized layer 13 made of tungsten (W) or molybdenum (Mo), a Ni layer 14 made of nickel (Ni), and a second made of gold (Au). The Au layer 15 as a metal layer is laminated in order. The metallized layer 13 is integrally formed with the base 4 during ceramic firing after printing the metallized material. The Ni layer 14 and the Au layer 15 are each formed by a plating technique. The thickness of the metallized layer 13 is, for example, 15 ± 7 μm. The thickness of the Ni layer 14 is, for example, 1.27 to 8.89 μm, and the thickness of the Au layer 15 is, for example, 0.30 to 1.00 μm. After joining the base 4 and the lid 6, the Au layer 15 of the base 4 constitutes the encapsulant 5 shown in FIG. The Au layer 15 may contain a metal other than Au.

The lid 6 has a rectangular flat plate shape in a plan view, and its external dimensions are smaller than the external dimensions of the base 4. The lid 6 is a metal that forms a solid solution with gold (Au) on the entire surface of the lid body 6a made of copper (Fe-Ni-Co alloy) or 42 alloy (Fe-Ni alloy), according to this embodiment. In, a Cu layer 17 as a first metal layer made of copper (Cu) is formed, and a Sn layer 18 made of tin (Sn) is formed on the entire surface of the Cu layer 17. The Cu layer 17 and the Sn layer 18 are each formed by, for example, a plating technique.

The thickness of the lid body 6a is, for example, 80 μm, and the thickness of the Cu layer 17 is, for example, 3 to 10 μm. The thickness of the Sn layer 18 is, for example, 1 to 1.5 μm.

A metal brazing layer containing tin (Sn), in this embodiment, a Sn brazing layer 19 made of Sn is formed in a joint region of the peripheral portion of the lid 6 with the base 4. The Sn brazing filler metal layer 19 is formed in a rectangular annular shape along the peripheral edge portion of the lid 6 on the joint surface side. The metal brazing metal layer formed in the joint region of the peripheral portion of the lid 6 with the base 4 may contain a metal other than Sn.

The thickness of the Sn brazing filler metal layer 19 is, for example, 10 to 30 μm. After joining the base 4 and the lid 6, a part of the Sn brazing material layer 19, the Sn layer 18, and the Cu layer 17 of the lid 6 becomes a part of the sealing material 5 shown in FIG.

The thickness of the Sn brazing filler metal layer 19 of the lid 6 is, for example, 10 to 30 μm, whereas the thickness of the Au layer 15 of the base 4 is 0.30 to 1.00 μm as described above. Since Sn is sufficiently present as compared with Au, upon joining the base 4 and the lid 6, all Au is melted in Sn, and the average atomic concentration of Au in the encapsulant 5 is, for example, 2. It will be about 10 at%.

Next, a method of manufacturing the package 3 of this embodiment will be described.

First, the step of preparing the lid 6 is carried out. In this lid preparation step, the joint region of the lid main body 6a made of kovar or 42 alloy, the region extending beyond the joint region and the joint region, and in this embodiment, the entire surface of the lid main body 6a is covered with gold (Au). A Cu layer 17 is formed as a first metal layer made of copper (Cu) that forms a total solid solution. Further, in order to improve the wettability, the Sn layer 18 is formed on the entire surface of the Cu layer 17. Next, the Sn brazing material layer 19 as a metal brazing material layer containing tin (Sn) is formed in the joint region of the peripheral portion of the lid 6 with the base 4.

Next, a step of preparing the base 4 is carried out. In this base preparation step, a metallized layer 13 made of tungsten (W) or molybdenum (Mo) and a Ni layer 14 made of nickel (Ni) are laminated and formed on the upper surface of the side wall portion 9 of the base 4, and further, gold is formed. An Au layer 15 made of gold (Au) as a second metal layer containing (Au) is formed.

A crystal vibrating piece 2 is housed in an internal space composed of the lid 6 and the base 4 prepared as described above, and a superposition step of superimposing the lid 6 and the base 4 is performed. In this stacking step, the crystal vibrating piece 2 is housed in the storage recess of the base 4, and the excitation electrodes 11 and 11 of the crystal vibrating piece 2 are joined to the electrode pads 10 and 10 of the base 4 by the conductive bonding material 12, respectively. .. The lid 6 is superposed so that the Sn brazing material layer 19 and the Au layer 15 of the base 4 are in contact with each other. The stacking of the base 4 and the lid 6 in which the crystal vibrating piece 2 is housed and mounted is performed in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

Next, a joining step of heating and joining the superposed lid 6 and the base 4 in a vacuum atmosphere or an inert gas atmosphere is performed. In this joining step, the Sn brazing material layer 19, the Au layer 15, and the Cu layer 17 are heated and melted. At this time, the Au layer 15 on the surface layer of the base 4 is melt-diffused into the Sn brazing material layer 19 of the lid 6, and Sn and Au are mixed in a molten state. Cu that is sufficiently present around the Sn and Au that are mixed and melted is taken in, and an intermetallic compound composed of Sn, Au, and Cu (for example, Cu ₆ Sn ₅ or Cu) is taken in. The encapsulant 5 containing ₃ Sn) is produced. After that, heating is stopped to cool and solidify the sealing material 5. As a result, the base 4 and the lid 6 are joined via the sealing material 5, and the internal space 7 is airtightly sealed.

The intermetallic compound composed of Sn, Au, and Cu contained in the encapsulant 5 is one in which a part of Au in the intermetallic compound of Sn and Au is replaced with Cu that forms a solid solution with Au. It is believed that there is.

By replacing a part of Au with Cu that forms a solid solution with Au in this way, the content of Au can be reduced by the amount of Cu contained, thereby causing the crystal oscillator 1 to have a reduced content of Au. It is possible to reduce the cost.

FIG. 4 is a partially enlarged cross-sectional view corresponding to FIG. 3 showing a joint portion between the base 4 and the lid 6.

The sealing material 5 has a central portion 5a between facing regions where the peripheral edge portion of the lid 6 and the upper surface of the side wall portion 9 of the base 4 face each other, and an inner fillet portion 5b and an outer fillet portion formed inside and outside the central portion 5a, respectively. It is equipped with 5c.

The central portion 5a of the sealing material 5 is mainly composed of an intermetallic compound, and contains an intermetallic compound composed of Sn and Au, and an intermetallic compound composed of Sn, Au, and Cu.

As described above, the central portion 5a existing in the facing region where the peripheral edge portion of the lid 6 and the upper surface of the side wall portion 9 of the base 4 face each other is composed of a high melting point intermetallic compound, so that the heat resistance is improved. It can withstand a high temperature during reflow when the crystal oscillator 1 is mounted.

Specifically, the central portion 5a of the encapsulant 5 according to the present embodiment does not melt at a temperature of at least 330 ° C. or lower.

The upper portion of the central portion 5a, that is, the portion of the lid 6 near the Cu layer 17, is a Cu-rich layer having a higher Cu content than the other portions.

Since the upper portion of the central portion 5a of the sealing material 5 is a Cu-rich layer in this way, the difference in the coefficient of thermal expansion of the lid 6 above it from the Cu layer 17 becomes small, and at the time of mounting or the like. The influence of thermal stress can be reduced, the affinity becomes good, and the adhesion is improved.

The inner and outer portions 5b and 5c of the central portion 5a of the sealing material 5 are composed of Sn.

The inner fillet portion 5b is formed so as to project from the end edge on the inner peripheral side of the upper surface of the side wall portion 9 of the base 4 toward the lower surface of the lid 6 toward the inner peripheral side. The outer fillet portion 5c is formed so as to project from the outer peripheral edge of the lower surface of the lid 6 to the outer peripheral edge of the upper surface of the base 4.

In this way, the inner fillet portion 5b and the outer fillet portion 5c made of Sn can cover and protect the intermetallic compound in the central portion 5a. Further, since the inner fillet portion 5b and the outer fillet portion 5c are formed so as to project inward and outward, the joint between the base 4 and the lid 6 can be strengthened, and more reliable airtight sealing can be achieved. It will be possible.

As shown in FIG. 5, the outer fillet 5c portion made of Sn may be formed so as to extend from the upper surface of the side wall portion 9 of the base 4 to the upper end edge of the peripheral wall of the lid 6 and cover the peripheral wall of the lid 6.

As a result, the joint between the base 4 and the lid 6 can be further strengthened, and more reliable airtight sealing becomes possible.

In the above embodiment, copper is used as the metal forming the total solid solution with gold, but the metal is not limited to copper, and nickel or the like may be used.

In the above embodiment, the internal space 7 of the package 3 is applied to a crystal oscillator 1 in which a crystal vibrating piece (crystal element) which is a piezoelectric element is housed as an electronic component element, but the crystal oscillator 1 is not limited to the crystal oscillator. It can be applied to packages of piezoelectric devices such as crystal filters and crystals.

Further, the internal space of the package may accommodate not only electronic component elements such as piezoelectric elements and integrated circuit elements, but also piezoelectric vibration devices such as crystal oscillators and crystal oscillators.

For example, a three-layer (sandwich) structure in which a piezoelectric vibrating plate made of a crystal having excitation electrodes formed on both main surfaces is sealed with a first and second sealing member made of a crystal or the like so as to cover each excitation electrode. Piezoelectric oscillator, a piezoelectric vibrating plate made of crystal with excitation electrodes formed on both main surfaces and a metal film to be a mounting terminal, made of a resin film so as to cover each excitation electrode. A constant temperature bath in which a piezoelectric vibrator sealed with the first and second sealing members, a piezoelectric vibrator having the above three-layer (sandwich) structure, an IC for an oscillation circuit, a heater, an IC for heater control, etc. is mounted on a crystal substrate. A piezoelectric vibration device such as a type piezoelectric oscillator may be housed.

The lid 6 may be made of a clad material. For example, a kovar material may be rolled in a state of being sandwiched between Cu materials having a Sn layer formed on the surface to form a clad material, which is punched and then Sn waxed. A material layer may be formed.

In the above embodiment, the base 4 has a recess for mounting the electronic component element, and the lid 6 has a flat plate shape. However, as another embodiment of the present invention, the electronic component element is mounted on the flat plate-shaped base. A lid that is mounted and has a recess may be covered so as to cover the electronic component element on the base, or both the base and the lid on which the electronic component element is mounted may have a recess.

Further, in the base, the upper frame portion is formed on the upper surface of the flat plate-shaped substrate portion to form the upper concave portion, while the lower frame portion is formed on the lower surface of the substrate portion to form the lower concave portion, and the lower concave portion is formed vertically. A structure having recesses, that is, a structure having an H-shaped cross section may be used.

1 Crystal oscillator 2 Crystal vibrating piece 3 Package 4 Base 5 Encapsulant 5a Central part 5b Inner fillet part 5c Outer fillet part 6 Lid 6a Lid body 7 Internal space 8 Bottom wall part 9 Side wall part 15 Au layer 17 Cu layer 18 Sn Layer 19 Sn brazing material layer

Claims (15)

A package comprising a lid and a base that constitutes an internal space together with the lid, and the lid and the base are joined via a sealing material to airtightly seal the internal space.
The encapsulant comprises an intermetallic compound consisting of tin, gold, and a metal consisting of gold and a metal forming a total solid solution.
A package that features that. The metal that forms a total solid solution with gold is copper.
The package according to claim 1. A copper-rich layer is provided on the lid side of the encapsulant.
The package according to claim 2. In the lid, the metal forming a total solid solution with gold is formed over the joint region to be joined to the base and the outside of the joint region.
The package according to any one of claims 1 to 3. The base has a bottom wall portion, a side wall portion extending upward from the peripheral edge portion of the bottom wall portion, and a side wall portion formed in a circumferential shape, and the storage recess is partitioned by the bottom wall portion and the side wall portion. Formed,
The peripheral edge portion of the lid is joined to the upper surface of the side wall portion of the base via the sealing material, and the storage recess as the internal space is hermetically sealed.
The package according to any one of claims 1 to 4. The intermetallic compound of the encapsulant is formed between the peripheral portion of the lid and the upper surface of the side wall portion of the base facing each other.
The package according to claim 5. The encapsulant has a tin fillet extending toward the inner peripheral side of the lid from the facing region.
The package according to claim 6. The encapsulant has a fillet made of tin that extends from the facing region toward the outer peripheral side of the sidewall of the base.
The package according to claim 6 or 7. The internal space is a vacuum or an inert gas atmosphere.
The package according to any one of claims 1 to 8. Electronic component elements are housed in the internal space.
The package according to any one of claims 1 to 9. The package according to claim 10, wherein the electronic component element housed in the internal space includes a piezoelectric element. A lid that constitutes an internal space together with a base and is joined to the base to airtightly seal the internal space.
A metal layer made of gold and a metal forming a total solid solution is formed on the lid over the joint region to be joined to the base and the outside of the joint region.
In the joint region, a metal brazing metal layer containing tin is formed on the metal layer.
A lid that features that. The metal that forms a total solid solution with gold is copper.
The lid according to claim 12. A method for manufacturing a package in which a lid and a base constituting an internal space together with the lid are provided, and the lid and the base are joined via a sealing material to airtightly seal the internal space.
A first metal layer made of gold and a metal forming a total solid solution is formed over the joint region joined to the base of the lid and outside the joint region, and on the first metal layer of the joint region. In the lid preparation process to form a metal brazing layer containing tin,
A base preparation step of forming a second metal layer containing gold in a joining region to be joined to the lid of the base.
An electronic component element is housed in the internal space composed of the lid and the base, and the lid and the base are overlapped with each other so that the metal brazing material layer and the second metal layer are in contact with each other. Overlaying process and
The lid and the base which are overlapped are heated to heat and melt the metal brazing material layer, the second metal layer and the first metal layer to form the sealing material, and the lid and the base are formed. Including the joining process of joining with
In the joining step, the encapsulant containing tin, gold, and an intermetallic compound composed of the metal forming a solid solution with gold is produced.
A method of manufacturing a package characterized by that. The metal that forms a total solid solution with gold is copper.
The method for manufacturing a package according to claim 14.

Images