JP2011228352A - Lid, base and package for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lid and a package for an electronic component that improve heat resistance at a hermetic seal portion of the package for the electronic component to obtain stable characteristics of the electronic component.SOLUTION: A lid 3 has a rectangular shape in a plan view and comprises a plurality of layers of metal materials and a core portion 30 where a metal brazing portion 31 is formed on the surface thereof. The metal brazing portion 31 has a lower brazing portion 31a, an upper brazing portion 31b and a plurality of concave portions 311. The concave portion 311 consists of the upper brazing portion 31b which is bottomless and the lower brazing portion 31a which has a bottom, and is formed of, as a whole, a convex shape having many small openings with bottoms. A base 1 is an open-topped box having a rectangular solid outer shape as a whole and includes a bottom portion 10, a bank portion 11, a step portion 1c and a storage portion of an electric component element which basically has a convex cross section. The lid 3 is placed on the base 1 so that the opening of the base 1 is sealed by fitting the metal brazing portion 31 on top of the bank portion 11.

Description

  The present invention relates to an electronic component package used for a piezoelectric vibration device and the like, and a lid and a base used for the electronic component package.

  The cavity (internal space) of the electronic component package is hermetically sealed in order to prevent deterioration of the characteristics of the electronic component element housed in the cavity and to obtain stable characteristics. As an example of such a configuration, a crystal resonator or a crystal oscillator using a crystal resonator element as an electronic component element can be given.

  In recent years, lead-free solder is used for such hermetic sealing. In Japanese Patent Application Laid-Open No. 2002-359212, in an electronic component container having a sealed container structure with a lid part in which lead-free solder is applied to at least a joint surface, the container part in contact with the lead-free solder part applied to the lid part is An electronic component container characterized by forming a gold-tin alloy plating film is disclosed.

JP 2002-359212 A

  In the above-mentioned patent documents, Sn-Ag-Cu-based and Sn-Cu-based alloys are exemplified as examples of lead-free solder. However, since such alloys have a relatively low melting point, there is a problem of poor heat resistance. there were. For example, an electronic component container hermetically sealed with lead-free solder is often bonded to a mounting board of an electronic device or the like using a reflow soldering technique, but depending on the temperature conditions during the reflow soldering, the lead The free solder melts or softens, and the characteristics of the electronic component may deteriorate.

  The present invention has been made to solve the above-described problems, and provides a lid and an electronic component package for improving the heat resistance in the hermetic sealing portion of the electronic component package and obtaining an electronic component having stable characteristics. The purpose is to do.

  The present invention has been made to achieve the above object, and as described in claim 1, hermetically seals the opening of a base having an opening and an electronic component element storage portion connected to the opening. In the lid, a metal brazing portion is formed at least in a joining region to be joined to the opening, and the metal brazing portion includes tin and another metal, and the core portion of the lid is made of the other metal. A brazing part is formed, and an upper brazing part having tin or a tin alloy made of tin and another metal is formed on the upper surface thereof, and a concave part is formed in a part of the metallic brazing part.

  According to the present invention, a metal brazing part is formed at least in a joining region joined to the opening, and the metal brazing part has a structure including tin and another metal, and the core part side of the lid includes the other metal. A lower brazing portion is formed, and an upper brazing portion having tin or a tin alloy made of tin and another metal is formed on the upper surface thereof, and a concave portion is formed in a part of the upper brazing portion and the lower brazing portion. Since it is a structure, when it melt-joins by a metal brazing part, the tin or tin alloy of the upper brazing part in an upper part softens or fuse | melts, and the opportunity for a part to enter into the said recessed part increases. Thus, with the configuration in which airtight sealing is performed with tin or a tin alloy entering the recess, in the joined metal brazing portion, a region having a high tin concentration and a low melting point when viewed from the top, that is, from the opening side (low It is possible to create a region (high melting point region) having a lower tin concentration and a higher melting point than the low melting point region and the low melting point region. Each of these regions has a melting point higher than the eutectic temperature of the tin alloy. Even if reflow soldering is performed by creating such a region configuration, the heat resistance of the entire metal brazing portion is improved due to the presence of the high melting point region.

  The concave portion formed in the metal brazing portion may be configured such that the upper brazing portion penetrates in the thickness direction and the lower brazing portion has a bottom.

  If it is the said structure, in addition to the said effect | action, the tin density | concentration of the tin alloy after a fusion | melting can be controlled. A region having a lower tin concentration and a higher melting point (high melting point region) than the low melting point region can be stably produced.

  Further, the concave portion formed in the metal brazing portion may be composed of a plurality of small holes and dispersedly arranged in a part or all of the metal brazing portion.

  If it is the said structure, in addition to said each effect | action, in the metal brazing part joined, the tin concentration is low and melting | fusing point is higher than the said low melting | fusing point area | region (low melting | fusing point area | region) with a high tin concentration and a low melting point seeing in a plane A plurality of regions (high melting point regions) can be stably formed over the entire metal brazing part.

Moreover, the structure by which the recessed part formed in the said metal brazing part was formed in the circumferential shape in the outermost periphery area | region of a lid may be sufficient.

  With the above configuration, in addition to the above actions, tin or a tin alloy moves to the outermost peripheral portion in the joined metal brazing portion, and a region having a high tin concentration and a low melting point (low melting point region) is created in a circumferential shape. In addition, a region having a lower tin concentration and a higher melting point (high melting point region) than the low melting point region can be formed in a circumferential shape. With such a configuration, a high-melting-point metal brazing part can be formed on the inner part of the lid, so that even during reflow soldering, the metal brazing material constituting the soft and molten metal brazing part enters the package. Can be suppressed.

  The structure of the metal brazing part may be applied to a base having a bank part and an electronic equipment element storage part. A circumferential bank part hermetically joined by a lid and an electronic component element storage part formed by the bank part are provided. A metal brazing portion is formed on the upper surface of the bank portion to be joined to the lid, and the metal brazing portion includes tin and other metals, and the core portion of the lid is formed on the upper surface of the bank portion. Forming a lower brazing portion made of the above metal, forming an upper brazing portion having tin or a tin alloy made of tin and another metal on the upper surface, and forming a recess in a part of the upper brazing portion and the lower brazing portion It may be configured.

  If it is the said structure, when melt-bonding by a metal brazing part, the tin or tin alloy of the upper brazing part in an upper part will soften or fuse | melt, and the opportunity for a part to enter into the said recessed part increases. Thus, by the structure in which the hermetic sealing is performed in a state in which the tin or the tin alloy enters the recess, in the joined metal brazing portion, the tin concentration is high and the melting point is low as seen in a plane (low melting point region) and the concerned A region having a lower tin concentration and a higher melting point than the low melting point region (high melting point region) can be produced. Each of these regions has a melting point higher than the eutectic temperature of the tin alloy. Even if reflow soldering is performed by creating such a region configuration, the heat resistance of the entire metal brazing portion is improved due to the presence of the high melting point region.

Furthermore, the electronic component package includes a lid having the above-described configuration, and an opening and a base having an electronic component storage unit connected to the opening, and the opening of the base is hermetically sealed with the lid. It may be a package.

According to the above configuration, when fusion bonding is performed by the metal brazing portion, tin or tin alloy in the upper brazing portion in the upper portion is softened or melted, and the chance that a part of the tin enters into the concave portion is increased. As a result of the hermetic sealing with the tin or tin alloy entering the recess, the bonded metal brazing portion has a high tin concentration and a low melting point (low melting point region) when viewed in plan, and the low melting point. A region having a lower tin concentration and a higher melting point (high melting point region) than the region can be created. Even if reflow soldering is performed by creating such a region configuration, the heat resistance of the entire metal brazing portion is improved due to the presence of the high melting point region.

Moreover, the tin concentration of the tin alloy after melting can be controlled, and the tin concentration is higher than the low melting point region (the low melting point region) where the tin concentration is high and the melting point is low when viewed in plan. A region having a low melting point and a high melting point (high melting point region) can be stably produced.

Furthermore, the region where the tin concentration is high and the melting point is low (low melting point region) and the region where the tin concentration is lower and the melting point is higher than the low melting point region (high melting point region) are stable throughout the metal brazing portion. Can be created.

Further, in the joined metal brazing portion, tin or a tin alloy moves to the outermost peripheral portion, and a region having a high tin concentration and a low melting point (low melting point region) is formed in a circumferential shape, and the tin is introduced from the low melting point region to the inside. A region having a low concentration and a high melting point (high melting point region) can be formed in a circumferential shape. With such a configuration, a high-melting-point metal brazing part can be formed in the inner part of the lid, so that the opportunity for the soft and molten metal brazing material constituting the metal brazing part to enter the package even during reflow soldering. Can be suppressed.

  According to the present invention, the heat resistance of the metal brazed portion after joining is improved, thereby improving the hermetic sealing performance of the electronic component package, and the lid and electronic component package for obtaining an electronic component having stable characteristics Can be obtained.

The top view of the lid used for 1st Embodiment by this invention AA sectional view of FIG. The internal structure figure of the piezoelectric vibration device which shows 1st Embodiment by this invention Partial enlarged view of FIG. Sectional drawing which shows the internal structure of the base which shows 2nd Embodiment by this invention The top view of the lid used for the 3rd embodiment by the present invention BB sectional view of FIG. The top view of the lid used for the 4th embodiment by the present invention Another example showing the configuration of a metal brazing part Another example showing the configuration of a metal brazing part Another example showing the configuration of a metal brazing part Another example showing the configuration of a metal brazing part

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
A first embodiment of the present invention will be described with reference to FIGS. 1 to 4 by taking a surface-mount type crystal vibrating device as an example.

As shown in FIG. 3, the surface-mount type crystal vibrating device is bonded to a base 1 having a recess having an upper opening, a crystal vibrating plate 2 that is a piezoelectric diaphragm housed in the base, and an opening of a package. The lid 3 is made up of.

The lid 3 has a rectangular shape in plan view, and is composed of a multilayer metal material, and has a structure in which a metal brazing portion 31 is formed on the surface of the core portion 30. The core part 30 is made of Kovar material (iron-nickel-cobalt alloy), and a circumferential metal brazing part 31 is formed along the vicinity of the outer periphery of the lid on the joint surface of the core part 30 with the base 1. A nickel layer may be formed on the opposite surface of the core portion 30 where the metal brazing portion 31 is formed. The core portion may have a configuration in which the Kovar material is nickel-plated, a configuration in which the Kovar material and nickel are clad by rolling, or a configuration in which the Kovar material is clad by rolling with the nickel sandwiched between nickel.

The metal brazing part 31 includes a lower brazing part 31a and an upper brazing part 31b. The lower wax portion 31a is formed in contact with the core portion 30, and the upper wax portion 31b is formed on the upper portion of the lower wax portion 31a. The lower brazing portion 31a is made of copper, which is a metal that forms an alloy with tin, and the upper brazing portion 31b is made of a tin-copper eutectic alloy, which is a tin alloy. In addition, the ratio of tin and copper may not be a eutectic alloy, and may be a ratio of about 100% tin to about 85% tin.

The configuration of the upper brazing portion and the lower brazing portion is not limited to the above-described configuration. For example, a copper layer may be formed in the lower brazing portion and a tin layer may be formed in the upper brazing portion. Alternatively, a gold layer may be formed on the lower brazing portion, and a tin layer or a gold-tin layer may be formed on the upper brazing portion. Tin or an alloy of tin and other metals may be formed on the upper brazing portion, and the above-described other may be provided on the lower brazing portion. Any structure may be used as long as the metal is formed. In particular, as described above, the environment can be accommodated by using a lead-free material.

The metal brazing part 31 has a large number of recesses 311 formed therein. The recess 311 has a configuration in which the upper brazing portion 31b penetrates and the lower brazing portion 31a has a bottomed configuration, and has a concave configuration in which a large number of bottomed small holes are formed as a whole. As shown in FIG. 1, the recesses have a rectangular configuration in plan view, the metal brazing part has a configuration in which the recesses are arranged in two rows in parallel, and the short side has a configuration in which one row is arranged. The concave portions are arranged in a distributed manner throughout the metal brazing portion. In addition, the structure and arrangement | positioning of these recessed parts are examples, and are not limited to this example. For example, the concave portion may be circular or elliptical in plan view. In this case, the flow of softened or melted tin or tin alloy into the recesses becomes smooth, and the formation of the high melting point region can be promoted.

  The base 1 has a rectangular parallelepiped outer shape as a whole, has a box shape having an opening at the top, has a bottom portion 10, a bank portion 11, and a step portion 1c, and has a generally concave electronic component element housing portion as viewed in cross section. It is the structure which it had. In this embodiment, the base has a structure in which a conductive electrode made of a metal film is formed on the inside and outside with ceramics as a base. A glass material such as borosilicate glass may be used as the base material.

The bank portion 11 is formed so as to extend upward from the outer periphery of the bottom portion 10. With such a configuration, an opening and an electronic component element storage portion C connected to the opening are formed, and the electronic component element storage portion C An inner wall is formed on the inner side. The upper surface of the stepped portion 1c is a flat surface, and electrode pads 12 and 13 (13 is not shown) are provided on the upper surface with a predetermined interval.

In addition, a metal layer 111 is formed on the upper surface of the bank portion 11 that is formed in a circumferential shape on the base, and the metal layer 111 is a region that is hermetically bonded to a lid described later. For example, the metal layer 111 is laminated in order of a tungsten layer, a nickel layer, a gold layer, and a copper layer in contact with the base ceramic. The tungsten layer is integrally fired with the ceramic, and the nickel, gold, and copper layers are formed by a technique such as plating or vacuum deposition. In addition, the said metal layer structure is an example, the structure which does not form the uppermost copper layer is also possible, and the layer structure which consists of another metal material may be sufficient.

The quartz crystal plate 2 is an AT cut quartz plate and has a rectangular shape in plan view and has a long side and a short side. Excitation electrodes 21 and 22 are formed on the front and back of the central portion of the main surface of the crystal diaphragm 2. The excitation electrodes 21 and 22 have a rectangular shape in a plan view and are similar to a crystal diaphragm, and have long sides and short sides. In each of the front and back excitation electrodes 21 and 22, an extraction electrode (not shown) is drawn from the short side of one excitation electrode to the short side of one crystal diaphragm. In addition to the AT-cut quartz diaphragm, a tuning fork type quartz diaphragm or other piezoelectric diaphragm may be used.

The excitation electrode and the extraction electrode are made of a metal film. For example, the excitation electrode and the extraction electrode have a two-layer structure in which a chromium film is formed as a base layer in contact with a quartz diaphragm and a gold film is formed as an upper layer on the chromium film. The metal film configuration may be other metal materials, for example, a titanium film or a nickel film may be used for the underlayer. Alternatively, a material such as a silver film or a copper film, or an alloy film of a gold alloy, a silver alloy, or a copper alloy may be used for the upper layer.

The electrode-formed quartz diaphragm is cantilevered with the electrode pads 12 and 13 using a conductive bonding material S and is conductively bonded to the extraction electrode. As the conductive bonding material S, a resin adhesive containing lead-free solder or conductive filler is used.

The metal brazing portion 31 corresponds to the upper surface of the bank portion, and the lid 3 is mounted on the base 1 so as to close the opening. Then, by joining the base 1 and the lid 3 with the metal brazing portion, the quartz crystal diaphragm 2 housed therein is airtightly housed. As the internal atmosphere, an inert gas such as nitrogen gas or a vacuum atmosphere is used. In this embodiment, a vacuum atmosphere is used.

After the hermetic joining, the metal brazing portion has a structure in which a low melting point region and a high melting point region are formed in a plan view. However, each said area | region has melting | fusing point higher than the eutectic temperature of a tin copper alloy. As a result, the heat resistance of the metal brazing portion is improved as a whole, thereby improving the hermetic sealing property of the electronic component package and obtaining a lid and an electronic component package for obtaining an electronic component having stable characteristics. . In the high melting point region, a metal compound of tin and copper having an increased copper ratio is likely to be formed. In this case, although the strength may be brittle, reinforcement is performed by a low melting point region having a relatively low copper ratio.

Next, a method for manufacturing the lid used in the present embodiment and a method for manufacturing a piezoelectric vibration device using the lid will be described.

As shown in FIG. 1, a metal brazing portion 31 having a large number of concave portions is formed on the joint surface with the base of the core portion 30 made of Kovar. Specifically, for example, the core portion 30 is masked with a resist at the center portion of the lid using a photolithography technique, and copper plating is performed in this state, and then tin copper plating is performed. Thereby, the metal brazing part 31 having the lower brazing part 31a made of copper and the upper brazing part 31b made of tin copper is formed in a circumferential shape in the vicinity of the outer periphery of the lid. A frame-shaped preform material made of tin copper may be fused and formed on the lower brazing part.

Thereafter, a recess made of a small hole is formed. Specifically, for example, a local engraving means such as a laser beam is used to form a recess composed of a large number of small holes over the entire metal brazing part. Due to the formation of the concave portion, the upper brazed portion is engraved to the middle of the lower brazed portion. In addition, the engraving to the middle of the upper brazing part may be sufficient, and it is good also as a structure which also penetrates a lower brazing part. Such engraving depth may be set according to the ratio of the tin alloy and the desired melting point of the metal brazing portion after joining.

The crystal diaphragm 2 is mounted on the electrode pads 12 and 13 of the base 1, and conductive bonding is performed by the conductive bonding material S. After the conductive bonding material S is cured and frequency adjustment (film thickness adjustment) is performed on the excitation electrodes 21 and 22, a thermal stabilization process such as annealing is performed. Thereafter, heating is performed in a state where the lid 3 is mounted on the base 1 and the opening portion is closed with the metal brazing portion facing the metal layer 111. In the heating, the entire electronic component package composed of the base 1 and the lid 3 is heated at a temperature at which the metal brazing portion melts in a heating furnace. For example, in the case of a metal brazing part made of tin and copper, heating is performed according to a predetermined temperature profile in a temperature range of 250 ° C. to 380 ° C. and a time range of 1 minute to 30 minutes.

FIG. 4 is an enlarged view of a region indicated by M in FIG. As shown in FIG. 4, a part of tin or tin-copper alloy softened and melted from the convex portion outside the concave portion by such heating flows into the concave portion, and the concave region as a whole is a tin high concentration region, the convex portion The region becomes a tin low concentration region. The metal brazing portion after being melted and hardened forms a tin-copper alloy as a whole, but the tin high concentration region becomes a tin-rich low melting point region 313 when viewed in plan, and the tin low concentration region is a copper rich high melting point. Region 312 is formed. By forming a plurality of such high melting point regions 312 and low melting point regions 313 in a plan view, the metal brazed portion after joining is in a state of improved heat resistance as a whole. A piezoelectric vibration device hermetically sealed by the above heat sealing can be obtained. Note that the high melting point region 312 and the low melting point region 313 can be more efficiently formed by heating in a state where a load of about 10 to 100 g is applied between the base and the lid.

A second embodiment of the present invention will be described with reference to FIG. 5 by taking a base for a surface-mount type crystal vibrating device as an example. The base 1 has a rectangular parallelepiped outer shape as a whole, has a box shape having an opening at the top, has a bottom portion 10, a bank portion 11, and a step portion 1c, and has a generally concave electronic component element housing portion as viewed in cross section. It is the structure which it had. In this embodiment, the base has a structure in which a conductive electrode made of a metal film is formed on the inside and outside with ceramics as a base. A glass material such as borosilicate glass may be used as the base material.

The bank portion 11 is formed so as to extend upward from the outer periphery of the bottom portion 10. With such a configuration, an opening and an electronic component element storage portion C connected to the opening are formed, and the electronic component element storage portion C An inner wall is formed on the inner side. The upper surface of the stepped portion 1c is a flat surface, and electrode pads 12 and 13 (13 is not shown) are provided on the upper surface with a predetermined interval.

In addition, a metal layer 111 is formed on the upper surface of the bank portion 11 that is formed in a circumferential shape on the base, and the metal layer 111 is a region that is hermetically bonded to a lid described later. For example, the metal layer 111 is formed in contact with a base ceramic in the order of a tungsten layer or a molybdenum layer, a nickel layer, a gold layer, and a copper layer. The tungsten layer is integrally fired with the ceramic, and the nickel, gold, and copper layers are formed by a technique such as plating or vacuum deposition. In addition, the said metal layer structure is an example, the structure which does not form the uppermost copper layer is also possible, and each layer structure which consists of another metal material may be sufficient.

A metal brazing part 41 is formed on the upper surface of the metal layer 111. The metal brazing portion 41 includes a first lower brazing portion 41a, a second lower brazing layer 41b, and an upper brazing portion 41c. The first lower brazing part 41a is formed in contact with the metal layer 111, the second lower brazing part 41b is formed on the first lower brazing part 41a, and the upper brazing part 41c is an upper part of the second lower brazing part 41b. Is formed. The first lower brazing portion 41a and the second lower brazing portion 41b are made of copper, which is a metal that forms an alloy with tin, and the upper brazing portion 41b is made of a tin-copper eutectic alloy, which is a tin alloy.

The configuration of the upper brazing portion and the lower brazing portion is not limited to the above-described configuration. For example, a copper layer may be formed in the lower brazing portion and a tin layer may be formed in the upper brazing portion. Alternatively, a gold layer may be formed on the lower brazing portion, and a tin layer or a gold-tin layer may be formed on the upper brazing portion. Tin or an alloy of tin and other metals may be formed on the upper brazing portion, and the above-described other may be provided on the lower brazing portion. The structure which formed this metal may be sufficient.

The metal brazing part 41 has a large number of recesses 411 formed therein. The concave portion 411 is configured to penetrate both the upper wax portion 41c and the second lower wax portion 41b, and has a concave configuration in which a large number of bottomed small holes are formed as a whole. As shown in FIG. 5, two recesses are provided in the width direction of the bank portion, and a plurality of these recesses are formed on each side.

In addition, the structure and arrangement | positioning of these recessed parts are examples, and are not limited to this example. For example, the concave portion may be circular or elliptical in plan view. In this case, the flow of softened or melted tin or tin alloy into the recesses becomes smooth, and the formation of the high melting point region can be promoted.

After mounting an electronic component element (quartz diaphragm) on the base, a lid is mounted on the metal brazing portion of the base to close the opening of the base. Then, the base 1 and the lid 3 are heat-bonded by the metal brazing portion, whereby the quartz crystal diaphragm 2 housed therein is hermetically housed. As the internal atmosphere, an inert gas such as nitrogen gas or a vacuum atmosphere is used. In this embodiment, a vacuum atmosphere is used. In addition, you may form tin or a tin copper alloy in a joining area | region with a base in a lid. In this case, the upper wax part formed on the base may be omitted.

After the hermetic joining, the metal brazing portion has a structure in which a low melting point region and a high melting point region are formed in a plan view. However, each said area | region has melting | fusing point higher than the eutectic temperature of a tin copper alloy. As a result, the heat resistance of the metal brazing portion is improved as a whole, thereby improving the hermetic sealing property of the electronic component package and obtaining a lid and an electronic component package for obtaining an electronic component having stable characteristics. .

A third embodiment according to the present invention will be described with reference to FIGS. As shown in FIG. 6, the lid 5 has a rectangular shape in plan view, and is composed of a multilayer metal material, and has a structure in which a metal brazing part 51 is formed on the surface of the core part. The core portion is made of Kovar material (iron-nickel-cobalt alloy), and a circumferential metal brazing portion 51 is formed along the vicinity of the outer periphery of the lid on the joint surface with the base 1 of the core portion. In addition, you may form a nickel layer in the opposite surface in which the metal brazing part 51 of the core part was formed.

As shown in FIG. 7, the metal brazing part 51 includes a lower brazing part 51a and an upper brazing part 51b. The lower wax part 51a is formed in contact with the core part 50, and the upper wax part 51b is formed on the upper part of the lower wax part 51a. The lower brazing portion 51a is made of copper, which is a metal that forms an alloy with tin, and the upper brazing portion 51b is made of a tin-copper eutectic alloy, which is a tin alloy.

The lower brazing part 51a has a thin part 51aa and a thick part 51ab. The thin part 51aa is formed at the outermost peripheral part of the lid, and the thick part 51ab is formed inside the thin part 51aa. The upper brazing part 51b is formed with a uniform film thickness on the lower brazing part 51a. Thereby, a stepped portion 51ba in which the metal brazing portion 51 is thinned is formed in the outermost peripheral portion of the lid.

Moreover, as shown in FIG. 8, the structure which formed the thin part 6a in the outer periphery of the lid 6 may be sufficient. A metal brazing part 61 is formed on the thin-walled part 6a and a partly inner surface thereof. The metal brazing portion 61 has a lower brazing portion 61a and an upper brazing portion 61b, both of which have a uniform thickness, and a stepped portion 61ba corresponding to the thickness of the thin portion 6a is formed.

  In the above embodiment, the configuration of the concave portion is a configuration in which the plurality of small holes and the outermost periphery are thinned. However, the configuration is not limited to these configurations, for example, the configuration shown in FIGS. 9 to 12. Also good. The configuration shown in FIG. 9 is a configuration in which a recess 71 is formed in a strip shape with respect to the metal brazing portion 7, and from the outer peripheral portion to the vicinity of the opposite side, from one side to the other side, and from the other side to the one side. It is the structure extended to. The configuration shown in FIG. 10 is a configuration in which the concave portions 72 are formed in a band shape with respect to the metal brazing portion 7, and a plurality of configurations are extended from the outer peripheral portion to the opposite side.

  The configuration shown in FIG. 11 is a configuration in which a large number of circular recesses 73 in a plan view are dispersedly arranged with respect to the metal brazing portion 7. The configuration shown in FIG. 12 is a configuration in which a large number of elliptical recesses 74 in a plan view are dispersedly arranged with respect to the metal brazing part 7 and these recesses are connected by a strip-like connection part 74a. The connecting portion makes the flow of the brazing material smooth and facilitates formation of the low melting point region and the high melting point region.

  It should be noted that the present invention can be implemented in various other forms without departing from the spirit, gist, or main features. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  Applicable for mass production of electronic component packages.

DESCRIPTION OF SYMBOLS 1 Base 10 Bottom part 11 Bank part 2 Crystal diaphragm (piezoelectric diaphragm)
3, 5 Lid 31, 51, 7 Metal brazing part 311, 71, 72, 73, 74 Recess

Claims (6)

A lid that hermetically seals the opening of the base having an opening and an electronic component element storage portion connected to the opening;
A metal brazing portion is formed at least in a joining region to be joined to the opening, and the metal brazing portion includes tin and another metal, and a lower brazing portion made of the other metal is formed in the core portion of the lid. A lid characterized in that an upper brazing portion having tin or a tin alloy made of tin and another metal is formed on the upper surface, and a concave portion is formed in a part of the metal brazing portion. The lid according to claim 1, wherein the concave portion formed in the metal brazing portion penetrates in the thickness direction at the upper brazing portion and has a bottomed structure at the lower brazing portion. 3. The lid according to claim 1, wherein the concave portion formed in the metal brazing portion is composed of a plurality of small holes and is dispersedly arranged in part or all of the metal brazing portion. The lid according to any one of claims 1 to 3, wherein the concave portion formed in the metal brazing portion is formed in a circumferential shape in an outermost peripheral region of the lid. A base having a circumferential bank portion hermetically joined by a lid and an electronic component element housing portion formed by the bank portion,
A metal brazing portion is formed on the upper surface of the bank portion to be joined to the lid, the metal brazing portion is configured to have tin and another metal, and a lower brazing portion made of the other metal is formed on the upper surface of the bank portion, A base characterized in that an upper brazing part having tin or a tin alloy made of tin and another metal is formed on the upper surface, and a concave part is formed in a part of the metallic brazing part. An electronic component package comprising the lid according to any one of claims 1 to 4 and a base having an opening and an electronic component element storage portion connected to the opening, wherein the opening of the base is a lid. An electronic component package characterized by being hermetically sealed.

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