JPH0650991Y2 - Package for storing semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to an improvement of a semiconductor element housing package for housing a semiconductor element.

2. Description of the Related Art Conventionally, as shown in FIGS. 3 and 4, a semiconductor element housing package for housing a semiconductor element, particularly a semiconductor integrated circuit element, has a semiconductor element mounted and mounted on a central portion of an upper surface thereof. Rectangular insulating substrate 11 having a mounting portion, and the insulating substrate
An opening A is formed in the central part so as to surround 11 semiconductor element mounting parts.
And an insulating frame body 12 having the same outer dimensions as the insulating base body 11, and an external lead terminal 13 for electrically connecting a semiconductor element housed inside to an external electric circuit. The external lead terminal 13 on the upper surface of the insulating substrate 11.
And the insulating frame 12 are placed one after another, and each of them has a low melting point glass.
It is made by bonding and fixing with 14.

In such a conventional package for housing a semiconductor element, the semiconductor element is usually housed in the package by abutting two orthogonal side surfaces of the insulating frame body 12 with a jig so that the opening A provided in the insulating frame body 12 is located at a predetermined position. After being fixed to the insulating base 11 located in the opening A,
The semiconductor element 15 is mounted and mounted on the semiconductor element mounting portion of the device, each electrode of the semiconductor element 15 is connected to the external lead terminal 13 via the bonding wire 16, and finally the insulating frame 12
The lid member 17 is attached to the upper part of the insulating frame 12 so as to close the opening A of the insulating frame 12 through a glass having a low melting point, and the semiconductor element is hermetically sealed in the final product. As a semiconductor device.

(Problems to be solved by the invention) However, in this conventional semiconductor element housing package, the insulating base 11 and the insulating frame 12 are adhered to each other by using glass. Of the insulating base body 11 and the insulating frame body 12 are difficult to bond so that the side surfaces of the insulating base body 11 and the insulating frame body 12 are all on the same plane. It is bonded so that it protrudes outward from the side surface. Therefore, when a semiconductor element is accommodated in this semiconductor element accommodating package, when two orthogonal sides of the insulating frame body 12 are brought into contact with a jig and the opening A formed in the insulating frame body 12 is fixed at a predetermined position, Since the side surface of the insulating substrate 11 projects from the side surface of the insulating frame body 12, the side surface of the insulating frame body 12 cannot be brought into contact with the jig,
As a result, it becomes impossible to fix the opening A provided in the insulating frame 12 at a predetermined position, and it becomes impossible to accurately mount and mount the semiconductor element at the predetermined position of the package. Was there.

Further, since the semiconductor element cannot be accurately placed and mounted at a predetermined position, there is a drawback that the wire bonding work for connecting each electrode of the semiconductor element and the external lead terminal cannot be performed accurately.

(Object of the Invention) The present invention has been devised in view of the above-mentioned drawbacks, and an object thereof is to enable a semiconductor element to be accurately placed and mounted in a predetermined position, and each electrode of the semiconductor element and an external lead terminal. It is an object of the present invention to provide a package for housing a semiconductor element capable of easily and surely connecting to and.

(Means for Solving the Problem) The present invention provides an insulating substrate having a mounting portion on which a semiconductor element is mounted, and an insulating material surrounding the mounting portion and forming a void for accommodating the semiconductor element therein. A semiconductor element housing package comprising a frame and a glass body with an external lead terminal sandwiched between the frame and the frame, wherein the outer dimensions of the insulating base are smaller than the outer dimensions of the insulating frame.

(Embodiment) Next, the present invention will be described in detail based on an embodiment shown in FIGS. 1 and 2.

1 and 2 show an embodiment of a package for accommodating a semiconductor device of the present invention, 1 is an insulating base made of an electrically insulating material such as alumina ceramics, and 2 is an insulating frame made of an electrically insulating material.

The insulating substrate 1 has a mounting portion for mounting and mounting a semiconductor element on the center of the upper surface thereof, and the semiconductor element 3 is mounted on the mounting portion via an adhesive material such as glass or resin. Fixed.

The insulating base 1 is formed by adopting a conventionally known press molding method. For example, when the insulating base 1 is made of alumina ceramics, a press having a shape corresponding to a rectangular insulating base as shown in the drawing is used. It is manufactured by filling alumina ceramic powder in a mold and applying a constant pressure to mold it, and then firing it at a temperature of 1500 ° C.

Further, an insulating frame body 2 is adhered to the upper surface of the insulating substrate 1 with a glass 5 sandwiching an external lead terminal 4 therebetween.

The insulating frame 2 has an opening B formed in the center thereof, and has a frame-like shape surrounding a mounting portion on which the semiconductor element of the insulating base 1 is mounted and mounted. The insulating frame 2 has a hole B at the center thereof and the upper surface of the insulating substrate 1 to form a space for accommodating the semiconductor element 3 therein.

The insulating frame body 2 is made of an electrically insulating material such as alumina ceramics, and is manufactured by the same method as the insulating base body 1 described above.
Fixed by adhesion.

The external lead terminals 4 arranged between the insulating substrate 1 and the insulating frame 2 are made of Kovar (Fe-Ni-Co alloy) or 42Alloy (F
The external lead terminal 4 is electrically connected to each electrode of the semiconductor element 3 through a bonding wire 6, and the external lead terminal 4 is connected to an external circuit to connect the external lead terminal 4 to an external circuit. Will be connected to an external circuit.

When the insulating substrate 1 and the insulating frame body 2 are bonded via the glass 5, the external lead terminals 4 are simultaneously bonded and fixed between the two.

In order to bond the insulating base body 1 and the insulating frame body 2, powder of glass 5 is applied to the upper surface of the insulating base body 1 and the lower surface of the insulating frame body 2 in advance, and the external lead terminals 4 are attached to the upper surface of the insulating base body 1.
Then, the insulating frame body 2 is sequentially placed and then heated to melt the glass powder previously applied to the insulating base body 1 and the insulating frame body 2 to integrate them.

Thus, according to this semiconductor element housing package,
After the semiconductor element 3 is attached to the semiconductor element mounting portion of the insulating substrate 1 via an adhesive and each electrode of the semiconductor element 3 is electrically connected to the external lead terminal 4 via the bonding wire 6, the insulating frame is formed. The lid member 7 is adhered to the upper surface of the glass member 2 with glass, resin, or the like, and the semiconductor element 3 is hermetically sealed inside to form a semiconductor device as a final product.

In the present invention, it is important to make the outer dimensions of the insulating base smaller than the outer dimensions of the insulating frame. Therefore, in the embodiment shown in FIGS. 1 and 2, for example, the inner diameter of the press die when the insulating substrate 1 is manufactured by the press molding method is set to be smaller than the inner diameter of the press die for manufacturing the insulating frame body 2. By so doing, the outer dimensions of the insulating base 1 are formed to be smaller than the outer dimensions of the insulating frame 2. If the outer dimensions of the insulating base 1 are smaller than the outer dimensions of the insulating frame 2 in this manner, when the insulating frame 2 is bonded to the insulating base 1 using the glass 5, Even if a positional deviation occurs with the insulating frame body 2, a part of the side surface of the insulating base body 1 does not protrude from the side surface of the insulating frame body 2. Therefore, when a semiconductor element is accommodated in this semiconductor element accommodating package, the two orthogonal sides of the insulating frame 2 are surely brought into contact with the jig to fix the opening B formed in the insulating frame 2 at a predetermined position. Therefore, the semiconductor element can be accurately mounted and mounted on the semiconductor element mounting portion of the insulating base 1 located inside the opening B of the insulating frame 2.

Further, since the semiconductor element can be accurately placed and attached at a predetermined position, the connection between each electrode of the semiconductor element and the external lead terminal can be performed using an automatic wire bonder, and each electrode of the semiconductor element 3 can be provided at a predetermined position. It is also possible to connect to the external lead terminal 4 accurately and surely.

The outer dimensions of the insulating base 1, that is, the length of the insulating base 1.
X ₁ and width Y ₁ are the length X ₂ and width Y ₂ of the insulating frame ₂ , X ₂ ≧ X ₁ +
When 0.2 mm and Y ₂ ≧ Y ₁ +0.2 mm are set, when the insulating base 1 and the insulating frame 2 are bonded to each other through the glass 5, even if a positional deviation occurs between the two, the side surface of the insulating base 1 is the insulating frame. It does not project outward from the side surface of the semiconductor device 2 at all, and the semiconductor element housing package can be completely positioned and the semiconductor element can be accurately placed and mounted in a predetermined position of the semiconductor element housing package. Therefore, the length X ₁ and the width Y ₁ of the insulating base 1 are X ₂ ≧ X ₁ +0.2 mm, Y _{2 with} respect to the length X ₂ and the width Y ₂ of the insulating frame body _2.
It is preferable to set ≧ Y ₁ +0.2 mm.

The length X ₁ of the insulating base 1, the length X ₂ of the width Y ₁ is an insulating frame member 2,
When X ₂ > X ₁ +1.0 mm and Y ₂ > Y ₁ +1.0 mm with respect to the width Y ₂ , when the insulating substrate 1 and the insulating frame 2 are bonded together using the glass 5, the bonding area becomes small. The length X ₁ and the width Y ₁ of the insulating base body 1 are the length X ₂ and the width Y _{2 of the} insulating frame body 2 because the airtight sealing of the semiconductor element housed inside is easily broken at the adhesive portion.
On the other hand, it is desirable to set X ₂ ≤X ₁ +1.0 mm and Y ₂ ≤Y ₁ +1.0 mm.

(Effect of the Invention) According to the package for housing a semiconductor device of the present invention, since the outer dimension of the insulating base is smaller than the outer dimension of the insulating frame, when the insulating frame is bonded onto the insulating base using glass, Even if the insulating base body and the insulating frame body are misaligned, a part of the side surface of the insulating base body does not protrude from the side surface of the insulating frame body. Therefore, when a semiconductor element is accommodated in this semiconductor element accommodating package, it is possible to make sure that the two orthogonal sides of the insulating frame are brought into contact with the jig to fix the opening formed in the insulating frame at a predetermined position. As a result, the semiconductor element can be accurately mounted and mounted on the semiconductor element mounting portion of the insulating substrate located in the opening of the insulating frame.

Further, since the semiconductor element can be accurately placed and mounted in a predetermined position, each electrode of the semiconductor element and the external lead terminal can be connected using an automatic wire bonder, and each electrode of the semiconductor element can be connected to a predetermined external portion. It is also possible to connect the lead terminals accurately and surely.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a semiconductor device housing package of the present invention, FIG. 2 is a side view of the package of FIG. 1, and FIG. 3 is a plan view of a conventional semiconductor device housing package. FIG. 4 is a side view of the package shown in FIG. 1: Insulating substrate, 2: Insulating frame 4: External lead terminal, 5: Glass

Claims (1)

[Scope of utility model registration request] 1. An insulating substrate having a mounting portion on which a semiconductor element is mounted, and an insulating frame surrounding the mounting portion and forming a space for accommodating the semiconductor element therein. A package for storing a semiconductor element, comprising an external lead terminal sandwiched between glass pieces, wherein the insulating substrate has an outer dimension smaller than that of an insulating frame.