JPH0254249U - - Google Patents
Info
- Publication number
- JPH0254249U JPH0254249U JP13376588U JP13376588U JPH0254249U JP H0254249 U JPH0254249 U JP H0254249U JP 13376588 U JP13376588 U JP 13376588U JP 13376588 U JP13376588 U JP 13376588U JP H0254249 U JPH0254249 U JP H0254249U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- accommodating
- outer dimension
- placing part
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す平面図、第２図は第１図のパツ
ケージの側面図、第３図は従来の半導体素子収納
用パツケージの平面図、第４図は第３図に示すパ
ツケージの側面図である。
１：絶縁基体、２：絶縁枠体、４：外部リード
端子、５：ガラス。
FIG. 1 is a plan view showing an embodiment of a package for storing semiconductor devices according to the present invention, FIG. 2 is a side view of the package shown in FIG. 1, and FIG. 3 is a plan view of a conventional package for storing semiconductor devices. FIG. 4 is a side view of the package shown in FIG. 3. 1: Insulating base, 2: Insulating frame, 4: External lead terminal, 5: Glass.
Claims (1)
体と該載置部を囲繞し、内部に半導体素子を収容
する空所を形成するための絶縁枠体とを、その間
に外部リード端子を挟んでガラス付けして成る半
導体素子収納用パツケージにおいて、前記絶縁基
体の外形寸法を絶縁枠体の外形寸法より小さくし
たことを特徴とする半導体素子収納用パツケージ
。 An insulating base body having a placing part on which a semiconductor element is placed, and an insulating frame body surrounding the placing part and forming a cavity for accommodating the semiconductor element therein, with external lead terminals sandwiched therebetween. 1. A package for accommodating a semiconductor element formed by attaching glass to the semiconductor element, characterized in that the outer dimension of the insulating base is smaller than the outer dimension of the insulating frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13376588U JPH0650991Y2 (en) | 1988-10-13 | 1988-10-13 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13376588U JPH0650991Y2 (en) | 1988-10-13 | 1988-10-13 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254249U true JPH0254249U (en) | 1990-04-19 |
| JPH0650991Y2 JPH0650991Y2 (en) | 1994-12-21 |
Family
ID=31391929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13376588U Expired - Lifetime JPH0650991Y2 (en) | 1988-10-13 | 1988-10-13 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650991Y2 (en) |
-
1988
- 1988-10-13 JP JP13376588U patent/JPH0650991Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0650991Y2 (en) | 1994-12-21 |