JPS6441142U - - Google Patents
Info
- Publication number
- JPS6441142U JPS6441142U JP13570187U JP13570187U JPS6441142U JP S6441142 U JPS6441142 U JP S6441142U JP 13570187 U JP13570187 U JP 13570187U JP 13570187 U JP13570187 U JP 13570187U JP S6441142 U JPS6441142 U JP S6441142U
- Authority
- JP
- Japan
- Prior art keywords
- island
- lead frame
- lead
- semiconductor chip
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示すプラスチツク
・モールド・フラツトタイプ半導体集積回路装置
の斜視図、第２図は本考案の他の実施例を示すプ
ラスチツク・モールド・フラツトタイプ半導体集
積回路装置の斜視図である。
１……半導体チツプのプラスチツク・モールド
体、２……フラツト・リード端子、３……プリツ
ジ部、４……リード・フレームの外枠部、４ａ〜
４ｄ……リード・フレームの外枠部の曲折載片。
FIG. 1 is a perspective view of a plastic mold flat type semiconductor integrated circuit device showing one embodiment of the present invention, and FIG. 2 is a perspective view of a plastic mold flat type semiconductor integrated circuit device showing another embodiment of the invention. It is. DESCRIPTION OF SYMBOLS 1...Plastic molded body of semiconductor chip, 2...Flat lead terminal, 3...Printer part, 4...Outer frame part of lead frame, 4a~
4d...A bent piece for the outer frame of the lead frame.
Claims (1)
体チツプのプラスチツク・モールド体と、前記半
導体チツプとボンデイング接続されるリードフレ
ームのフラツト・リード端子配列と、前記リード
端子以外をブリツジ部として前記アイランドの周
辺にアイランドと一体化構造で残されるリードフ
レームの外枠部から成る放熱板とを含むことを特
徴とする半導体集積回路装置。 A plastic molded body of a semiconductor chip placed on an island of a lead frame, a flat lead terminal arrangement of a lead frame bonded to the semiconductor chip, and a bridge portion other than the lead terminals arranged around the island. 1. A semiconductor integrated circuit device comprising: an island; and a heat dissipation plate consisting of an outer frame portion of a lead frame left in an integrated structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13570187U JPS6441142U (en) | 1987-09-04 | 1987-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13570187U JPS6441142U (en) | 1987-09-04 | 1987-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441142U true JPS6441142U (en) | 1989-03-13 |
Family
ID=31395564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13570187U Pending JPS6441142U (en) | 1987-09-04 | 1987-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441142U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150044A (en) * | 2005-11-29 | 2007-06-14 | Denso Corp | Semiconductor device |
-
1987
- 1987-09-04 JP JP13570187U patent/JPS6441142U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150044A (en) * | 2005-11-29 | 2007-06-14 | Denso Corp | Semiconductor device |