JPS6228444U - - Google Patents

Info

Publication number
JPS6228444U
JPS6228444U JP1985120659U JP12065985U JPS6228444U JP S6228444 U JPS6228444 U JP S6228444U JP 1985120659 U JP1985120659 U JP 1985120659U JP 12065985 U JP12065985 U JP 12065985U JP S6228444 U JPS6228444 U JP S6228444U
Authority
JP
Japan
Prior art keywords
integrated circuit
package
package body
integrated
encapsulates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985120659U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985120659U priority Critical patent/JPS6228444U/ja
Publication of JPS6228444U publication Critical patent/JPS6228444U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す斜視図である
。 1……パツケージ、2……ピン端子。
FIG. 1 is a perspective view showing an embodiment of the present invention. 1...Package, 2...Pin terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路等に使用される集積回路チツプを封入
する集積回路パツケージにおいて、放熱効率を高
めるためにパツケージ表面を凹凸に成型し一本化
したパツケージ本体と、このパツケージ本体に取
り付けられたピン端子とを含むことを特徴とする
集積回路パツケージ。
In an integrated circuit package that encapsulates an integrated circuit chip used in electronic circuits, etc., the package body is formed into a single piece with an uneven surface to improve heat dissipation efficiency, and the pin terminals attached to the package body are integrated. An integrated circuit package comprising:
JP1985120659U 1985-08-05 1985-08-05 Pending JPS6228444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985120659U JPS6228444U (en) 1985-08-05 1985-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985120659U JPS6228444U (en) 1985-08-05 1985-08-05

Publications (1)

Publication Number Publication Date
JPS6228444U true JPS6228444U (en) 1987-02-20

Family

ID=31009184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985120659U Pending JPS6228444U (en) 1985-08-05 1985-08-05

Country Status (1)

Country Link
JP (1) JPS6228444U (en)

Similar Documents

Publication Publication Date Title
JPS6228444U (en)
JPS61199056U (en)
JPS6294646U (en)
JPS6265847U (en)
JPH0276844U (en)
JPS6236553U (en)
JPS61196544U (en)
JPS6420740U (en)
JPS61207043U (en)
JPS61131872U (en)
JPS63101481U (en)
JPS61206281U (en)
JPS63170964U (en)
JPS61111160U (en)
JPS6245848U (en)
JPS6172865U (en)
JPH0170293U (en)
JPH028147U (en)
JPS6252969U (en)
JPH0242387U (en)
JPS6247144U (en)
JPH0229535U (en)
JPS61171261U (en)
JPS6439649U (en)
JPS62104453U (en)