JPS6247144U - - Google Patents
Info
- Publication number
- JPS6247144U JPS6247144U JP13825685U JP13825685U JPS6247144U JP S6247144 U JPS6247144 U JP S6247144U JP 13825685 U JP13825685 U JP 13825685U JP 13825685 U JP13825685 U JP 13825685U JP S6247144 U JPS6247144 U JP S6247144U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead terminals
- integrated circuit
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図A,Bは夫々本考案に係る集積回路パツ
ケージの一実施例の平面図及び側面図、第2図A
,Bは夫々上記パツケージの基板への取付状態の
平面図、及び第2図A中B―B線に沿う縦断
矢視図、第3図は上記パツケージの他の実施例の
基板への取付状態の側面図である。
1,1―1……集積回路パツケージ、2……モ
ールド部、3……リード端子、4……長寸法リー
ド端子、4a……突起部、4b……折返し部、5
……プリント基板、5a……孔、6……プリント
回路。
1A and 1B are a plan view and a side view, respectively, of an embodiment of an integrated circuit package according to the present invention, and FIG. 2A
, B are respectively a plan view of the above-mentioned package attached to the board, and a vertical view taken along line B--B in FIG. FIG. 1, 1-1...Integrated circuit package, 2...Mold part, 3...Lead terminal, 4...Long dimension lead terminal, 4a...Protrusion part, 4b...Folded part, 5
...Printed circuit board, 5a...hole, 6...printed circuit.
Claims (1)
リード端子を有するフラツト型集積回路パツケー
ジにおいて、少なくとも1本の前記リード端子が
、前記プリント回路基板に直接平面半田付できる
構造を有し、かつ額該プリント回路基板の孔に挿
入係合される突起部を有する構成としてなる集積
回路パツケージ。 In a flat integrated circuit package having a plurality of lead terminals that are directly planar soldered to a printed circuit board, at least one of the lead terminals has a structure that allows direct planar soldering to the printed circuit board, and the printed circuit board is connected to the printed circuit board. An integrated circuit package having a protrusion that is inserted into and engaged with a hole in a circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13825685U JPS6247144U (en) | 1985-09-10 | 1985-09-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13825685U JPS6247144U (en) | 1985-09-10 | 1985-09-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6247144U true JPS6247144U (en) | 1987-03-23 |
Family
ID=31043072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13825685U Pending JPS6247144U (en) | 1985-09-10 | 1985-09-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6247144U (en) |
-
1985
- 1985-09-10 JP JP13825685U patent/JPS6247144U/ja active Pending