JPH01119169U - - Google Patents
Info
- Publication number
- JPH01119169U JPH01119169U JP1466788U JP1466788U JPH01119169U JP H01119169 U JPH01119169 U JP H01119169U JP 1466788 U JP1466788 U JP 1466788U JP 1466788 U JP1466788 U JP 1466788U JP H01119169 U JPH01119169 U JP H01119169U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldered
- resin
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Connection Or Junction Boxes (AREA)
Description
図―１は本考案の一実施例に係る電気接続箱用
プリント回路基板の断面図、図―２および図―３
は同回路基板の製造過程を示す説明図、図―４は
本考案の他の実施例を示す断面図、図―５は従来
の電気接続箱用プリント回路基板の断面図である
。
１：プリント回路基板、２：端子、３：半田付
け部、４：ケース、５：樹脂成形体。
Figure 1 is a sectional view of a printed circuit board for an electrical junction box according to an embodiment of the present invention, Figures 2 and 3
4 is a sectional view showing another embodiment of the present invention, and FIG. 5 is a sectional view of a conventional printed circuit board for an electrical connection box. 1: Printed circuit board, 2: Terminal, 3: Soldering part, 4: Case, 5: Resin molded body.
Claims (1)
、その基端部をプリント回路基板に半田付けして
なる電気接続箱用プリント回路基板において、上
記プリント回路基板の端子を半田付けした方の面
に、樹脂を一体にモールド成形して、半田付け部
を樹脂成形体内に埋め込んだことを特徴とする電
気接続箱用プリント回路基板。 In a printed circuit board for an electrical junction box, in which input/output terminals are placed upright on a printed circuit board and their base ends are soldered to the printed circuit board, the surface of the printed circuit board on which the terminals are soldered is A printed circuit board for an electrical connection box, characterized in that a resin is integrally molded and a soldered part is embedded in the resin molded body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466788U JPH01119169U (en) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466788U JPH01119169U (en) | 1988-02-08 | 1988-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01119169U true JPH01119169U (en) | 1989-08-11 |
Family
ID=31226073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1466788U Pending JPH01119169U (en) | 1988-02-08 | 1988-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01119169U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016067173A (en) * | 2014-09-26 | 2016-04-28 | 京セラ株式会社 | Terminal box and solar cell module using the same |
-
1988
- 1988-02-08 JP JP1466788U patent/JPH01119169U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016067173A (en) * | 2014-09-26 | 2016-04-28 | 京セラ株式会社 | Terminal box and solar cell module using the same |