JPH02138457U - - Google Patents
Info
- Publication number
- JPH02138457U JPH02138457U JP4773189U JP4773189U JPH02138457U JP H02138457 U JPH02138457 U JP H02138457U JP 4773189 U JP4773189 U JP 4773189U JP 4773189 U JP4773189 U JP 4773189U JP H02138457 U JPH02138457 U JP H02138457U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- circuit board
- terminal block
- resin substrate
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
図−１および図−２はそれぞれ本考案に係る端
子台一体型モールド成形回路基板の実施例を示す
斜視図、図−３は図−２の回路基板に用いた端子
金具の斜視図、図−４は従来の端子台付き回路基
板の斜視図である。
２１……端子台一体型モールド成形回路基板、
２２……絶縁フイルム、２３……回路導体、２４
……プリント回路フイルム、２５……樹脂基板、
２６……端子部、２７……端子台、２８……端子
金具嵌め込み溝、２９……端子金具、３０……半
田付け部。
Figures 1 and 2 are perspective views showing embodiments of the terminal block integrated molded circuit board according to the present invention, and Figure 3 is a perspective view of a terminal fitting used in the circuit board of Figure 2, 4 is a perspective view of a conventional circuit board with a terminal block. 21...Terminal block integrated molded circuit board,
22... Insulating film, 23... Circuit conductor, 24
...Printed circuit film, 25...Resin board,
26...Terminal part, 27...Terminal block, 28...Terminal fitting fitting groove, 29...Terminal fitting, 30...Soldering part.
Claims (1)
た樹脂基板とを一体化してなるモールド成形回路
基板において、上記回路導体の端子部が載る端子
台を、上記樹脂基板と一体にモールド成形したこ
とを特徴とする端子台一体型モールド成形回路基
板。 A molded circuit board formed by integrating a circuit conductor with a desired pattern and a molded resin substrate, characterized in that a terminal block on which a terminal portion of the circuit conductor is mounted is integrally molded with the resin substrate. Molded circuit board with integrated terminal block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4773189U JPH02138457U (en) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4773189U JPH02138457U (en) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02138457U true JPH02138457U (en) | 1990-11-19 |
Family
ID=31563920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4773189U Pending JPH02138457U (en) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02138457U (en) |
-
1989
- 1989-04-25 JP JP4773189U patent/JPH02138457U/ja active Pending