JPS6291452U - - Google Patents

Info

Publication number
JPS6291452U
JPS6291452U JP18381485U JP18381485U JPS6291452U JP S6291452 U JPS6291452 U JP S6291452U JP 18381485 U JP18381485 U JP 18381485U JP 18381485 U JP18381485 U JP 18381485U JP S6291452 U JPS6291452 U JP S6291452U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
external connection
insulating material
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18381485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18381485U priority Critical patent/JPS6291452U/ja
Publication of JPS6291452U publication Critical patent/JPS6291452U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す斜視図、第2図
a,bは外部接続端子を示し、aは上面図、bは
側面図、第3図a,bは従来の混成集積回路装置
を示し、aは斜視図、bは側面図、第4図は従来
の他の混成集積回路装置を示し、aは斜視図、b
は側面図である。
FIG. 1 is a perspective view showing an embodiment of the present invention, FIGS. 2 a and b show external connection terminals, a is a top view, b is a side view, and FIGS. 3 a and b are conventional hybrid integrated circuit devices. 4 shows another conventional hybrid integrated circuit device, a is a perspective view, b is a side view, and FIG.
is a side view.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 混成集積回路基板と、外部接続端子とを有する
混成集積回路装置において、前記外部接続端子が
絶縁物により一体成形され、前記混成集積回路基
板の辺部に前記絶縁物を挾み込んで取り付けたこ
とを特徴とする混成集積回路装置。
In a hybrid integrated circuit device having a hybrid integrated circuit board and an external connection terminal, the external connection terminal is integrally molded with an insulating material, and is attached by inserting the insulating material into a side portion of the hybrid integrated circuit board. A hybrid integrated circuit device characterized by:
JP18381485U 1985-11-28 1985-11-28 Pending JPS6291452U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18381485U JPS6291452U (en) 1985-11-28 1985-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18381485U JPS6291452U (en) 1985-11-28 1985-11-28

Publications (1)

Publication Number Publication Date
JPS6291452U true JPS6291452U (en) 1987-06-11

Family

ID=31130893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18381485U Pending JPS6291452U (en) 1985-11-28 1985-11-28

Country Status (1)

Country Link
JP (1) JPS6291452U (en)

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