JPH03124486U - - Google Patents
Info
- Publication number
- JPH03124486U JPH03124486U JP3471290U JP3471290U JPH03124486U JP H03124486 U JPH03124486 U JP H03124486U JP 3471290 U JP3471290 U JP 3471290U JP 3471290 U JP3471290 U JP 3471290U JP H03124486 U JPH03124486 U JP H03124486U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- view
- stacked
- insert
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図はこの考案によるＩＣソケツトにＩＣを
装着した場合の部分断面側面図、第２図は第１図
のＩＣソケツトを用いた場合のバーンイン基板へ
の装着状態を示す部分斜視図、第３図は従来のＩ
Ｃソケツトを用いた場合のバーンイン基板への装
着状態を示す部分斜視図、第４図は従来のＩＣソ
ケツトにＩＣを装着した場合の部分断面側面図で
ある。
１はＩＣ、１ａはＩＣのリード部、２はＩＣソ
ケツトの接触子、２ａはＩＣソケツトの端子、２
ｂはＩＣソケツトの電極部、３はバーンイン基板
、５はＩＣソケツト本体を示す。なお、図中、同
一符号は同一、又は相当部分を示す。
FIG. 1 is a partial cross-sectional side view of an IC mounted in the IC socket according to the invention, FIG. 2 is a partial perspective view showing the IC socket mounted on a burn-in board using the IC socket of FIG. 1, and FIG. The figure shows the conventional I
FIG. 4 is a partial perspective view showing how an IC is mounted on a burn-in board when a C socket is used, and FIG. 4 is a partial cross-sectional side view when an IC is mounted on a conventional IC socket. 1 is the IC, 1a is the lead part of the IC, 2 is the contact of the IC socket, 2a is the terminal of the IC socket, 2
b indicates an electrode portion of the IC socket, 3 indicates a burn-in board, and 5 indicates the IC socket body. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
Ｃ装着方向と同一方向に積み重ね可能としたこと
を特徴とするＩＣソケツト。 Insert the IC socket with the DIP type IC into
An IC socket characterized in that it can be stacked in the same direction as the C mounting direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471290U JPH03124486U (en) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471290U JPH03124486U (en) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124486U true JPH03124486U (en) | 1991-12-17 |
Family
ID=31539429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3471290U Pending JPH03124486U (en) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124486U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
-
1990
- 1990-03-29 JP JP3471290U patent/JPH03124486U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |