JPH0350348U - - Google Patents
Info
- Publication number
- JPH0350348U JPH0350348U JP11100389U JP11100389U JPH0350348U JP H0350348 U JPH0350348 U JP H0350348U JP 11100389 U JP11100389 U JP 11100389U JP 11100389 U JP11100389 U JP 11100389U JP H0350348 U JPH0350348 U JP H0350348U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- terminals
- electric component
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Description
第１図は本考案の集積回路装置の概要を説明す
るための側断面図、第２図は同平面図、第３図は
従来例の集積回路装置を回路基板に装荷した状態
を示す一部省略平面図、第４図は同集積回路装置
の一部破断斜視図である。
１……集積回路装置、１２……半導体回路、１
４……端子、１６……樹脂モールド、１７……コ
ンデンサ。
Fig. 1 is a side cross-sectional view for explaining the outline of the integrated circuit device of the present invention, Fig. 2 is a plan view thereof, and Fig. 3 is a part showing a state in which a conventional integrated circuit device is loaded on a circuit board. The omitted plan view and FIG. 4 are partially cutaway perspective views of the integrated circuit device. 1... Integrated circuit device, 12... Semiconductor circuit, 1
4...terminal, 16...resin mold, 17...capacitor.
Claims (1)
に接続すると共に外部に導出される複数の端子と
、同複数の端子の一端部と共に同基板を被覆する
樹脂モールドと、電気部品とからなり、同複数の
端子間に同電気部品を接続すると共に同電気部品
前記回路と離間し、かつ、前記樹脂モールドにて
封止してなることを特徴とする集積回路装置。 (2) 前記電気部品がコンデンサであることを特
徴とする請求項(1)記載の集積回路装置。 (3) 前記電気部品がインダクタであることを特
徴とする請求項(1)記載の集積回路装置。 (4) 前記電気部品が振動子または発振子である
ことを特徴とする請求項(1)記載の集積回路装置
。[Claims for Utility Model Registration] (1) A semiconductor circuit integrated on a substrate, a plurality of terminals connected to the circuit and led out to the outside, and covering the substrate together with one end of the plurality of terminals. An integrated circuit comprising a resin mold and an electrical component, the electrical component being connected between a plurality of terminals, separated from the circuit, and sealed with the resin mold. circuit device. (2) The integrated circuit device according to claim (1), wherein the electric component is a capacitor. (3) The integrated circuit device according to claim (1), wherein the electric component is an inductor. (4) The integrated circuit device according to claim (1), wherein the electric component is a vibrator or an oscillator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11100389U JPH0350348U (en) | 1989-09-22 | 1989-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11100389U JPH0350348U (en) | 1989-09-22 | 1989-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350348U true JPH0350348U (en) | 1991-05-16 |
Family
ID=31659502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11100389U Pending JPH0350348U (en) | 1989-09-22 | 1989-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350348U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105365866A (en) * | 2015-12-04 | 2016-03-02 | 中国人民解放军国防科学技术大学 | Folding handcart |
-
1989
- 1989-09-22 JP JP11100389U patent/JPH0350348U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105365866A (en) * | 2015-12-04 | 2016-03-02 | 中国人民解放军国防科学技术大学 | Folding handcart |