JPS62174345U - - Google Patents
Info
- Publication number
- JPS62174345U JPS62174345U JP6205786U JP6205786U JPS62174345U JP S62174345 U JPS62174345 U JP S62174345U JP 6205786 U JP6205786 U JP 6205786U JP 6205786 U JP6205786 U JP 6205786U JP S62174345 U JPS62174345 U JP S62174345U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- recess
- circuit board
- hybrid integrated
- membrane circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示した断面図、第
２図は第１図実施例の底面図、第３図は従来例を
示した断面図である。
１……膜回路基板、２……電子部品、３……ベ
ース板、４……端子、５……絶縁体、６……発熱
体、７……絶縁部材、８……カバー、９……凹部
、１０……電線。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a bottom view of the embodiment shown in FIG. 1, and FIG. 3 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Membrane circuit board, 2...Electronic component, 3...Base plate, 4...Terminal, 5...Insulator, 6...Heating element, 7...Insulating member, 8...Cover, 9... Recessed portion, 10...Electric wire.
Claims (1)
装した膜回路基板と、該膜回路基板を気密封止す
るカバーとを設け、上記ベース板の他方の面に複
数の端子を延出して成る混成集積回路において、
前記ベース板の端子延出面に凹部を設け、この凹
部の底面に発熱体を装着したことを特徴とする混
成集積回路。 A membrane circuit board on which chip-shaped electronic components are mounted and a cover hermetically sealing the membrane circuit board are provided on one surface of a base plate, and a plurality of terminals extend from the other surface of the base plate. In hybrid integrated circuits,
A hybrid integrated circuit characterized in that a recess is provided in the terminal extending surface of the base plate, and a heating element is mounted on the bottom of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205786U JPS62174345U (en) | 1986-04-24 | 1986-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205786U JPS62174345U (en) | 1986-04-24 | 1986-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174345U true JPS62174345U (en) | 1987-11-05 |
Family
ID=30895966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6205786U Pending JPS62174345U (en) | 1986-04-24 | 1986-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174345U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138742A (en) * | 1987-11-26 | 1989-05-31 | Hitachi Ltd | Semiconductor integrated circuit module |
| JP2009141250A (en) * | 2007-12-10 | 2009-06-25 | Hitachi Kokusai Electric Inc | Heat transmission structure of electronic component |
-
1986
- 1986-04-24 JP JP6205786U patent/JPS62174345U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138742A (en) * | 1987-11-26 | 1989-05-31 | Hitachi Ltd | Semiconductor integrated circuit module |
| JP2009141250A (en) * | 2007-12-10 | 2009-06-25 | Hitachi Kokusai Electric Inc | Heat transmission structure of electronic component |
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