JPH01153650U - - Google Patents
Info
- Publication number
- JPH01153650U JPH01153650U JP4554088U JP4554088U JPH01153650U JP H01153650 U JPH01153650 U JP H01153650U JP 4554088 U JP4554088 U JP 4554088U JP 4554088 U JP4554088 U JP 4554088U JP H01153650 U JPH01153650 U JP H01153650U
- Authority
- JP
- Japan
- Prior art keywords
- wiring conductor
- semiconductor device
- conductor
- semiconductor element
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案による半導体装置の一実施例
の配線導体と外部導出補助端子としてのリード線
との接続部の部分拡大図で、第１図ａは上面図、
第１図ｂは第１図ａの矢視Ａの側面図、第１図ｃ
は第１図ａの矢視Ｂの側面図である。第２図、第
３図および第４図は同じ接続部のそれぞれ異なる
従来例を示すもので、各図においてａは上面図、
ｂは側面図である。
１……基板、２……金属ベース、３……絶縁板
、４……外部導出リード線、７……絶縁基板、７
ａ……配線導体、７ｂ……カール部。
FIG. 1 is a partially enlarged view of a connecting portion between a wiring conductor and a lead wire as an external lead-out auxiliary terminal in an embodiment of a semiconductor device according to this invention, and FIG. 1a is a top view;
Figure 1b is a side view of arrow A in Figure 1a, Figure 1c
1 is a side view taken in the direction of arrow B in FIG. 1a. Figures 2, 3, and 4 show different conventional examples of the same connection part, and in each figure, a is a top view;
b is a side view. 1... Board, 2... Metal base, 3... Insulating plate, 4... External lead wire, 7... Insulating board, 7
a... Wiring conductor, 7b... Curled portion.
Claims (1)
る枠体および蓋体とで構成される容器内の前記基
板上に、半導体素子および配線導体が絶縁されて
固着され、所要の電気的接続がなされ、一端が配
線導体に接続された外部導出端子導体の他端が前
記容器外部へ導出されてなる半導体装置において
、前記半導体素子の制御電極と接続された配線導
体の端部にカール部が設けられており、このカー
ル部に制御回路系の外部導出補助端子導体として
のリード線の一端が挿入されてろう付けされてい
ることを特徴とする半導体装置。 A semiconductor element and a wiring conductor are insulated and fixed on the substrate in a container consisting of a substrate made of a thermally conductive material and a frame and a lid made of an insulating material, and necessary electrical connections are made. In a semiconductor device in which one end of an external lead-out terminal conductor is connected to a wiring conductor and the other end is led out to the outside of the container, a curl portion is provided at an end of the wiring conductor connected to a control electrode of the semiconductor element. A semiconductor device characterized in that one end of a lead wire serving as an externally leading auxiliary terminal conductor of a control circuit system is inserted into the curled portion and brazed thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4554088U JPH01153650U (en) | 1988-04-04 | 1988-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4554088U JPH01153650U (en) | 1988-04-04 | 1988-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153650U true JPH01153650U (en) | 1989-10-23 |
Family
ID=31271844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4554088U Pending JPH01153650U (en) | 1988-04-04 | 1988-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153650U (en) |
-
1988
- 1988-04-04 JP JP4554088U patent/JPH01153650U/ja active Pending