JPH0252348U - - Google Patents
Info
- Publication number
- JPH0252348U JPH0252348U JP12968588U JP12968588U JPH0252348U JP H0252348 U JPH0252348 U JP H0252348U JP 12968588 U JP12968588 U JP 12968588U JP 12968588 U JP12968588 U JP 12968588U JP H0252348 U JPH0252348 U JP H0252348U
- Authority
- JP
- Japan
- Prior art keywords
- led out
- semiconductor component
- package
- molded package
- outer plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図Ａ及びＢはそれぞれこの考案の実施例を
示す平面図及び側面図、第２図Ａ及びＢは従来の
半導体部品用モールドパツケージの平面図及び側
面図である。
1A and 1B are a plan view and a side view showing an embodiment of this invention, respectively, and FIGS. 2A and 2B are a plan view and a side view of a conventional mold package for semiconductor components.
Claims (1)
れている半導体部品のモールドパツケージにおい
て、 上記パツケージの外平面に、上記電気端子が導
出されている外平面を除いて、導電膜が形成され
ていることを特徴とする半導体部品のモールドパ
ツケージ。[Claims for Utility Model Registration] In a molded package of a semiconductor component in which an electrical terminal is led out from one or more outer planes, the outer plane of the package is excluded from the outer plane from which the electrical terminals are led out. A molded package for a semiconductor component, characterized in that a conductive film is formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12968588U JPH0252348U (en) | 1988-10-03 | 1988-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12968588U JPH0252348U (en) | 1988-10-03 | 1988-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252348U true JPH0252348U (en) | 1990-04-16 |
Family
ID=31384187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12968588U Pending JPH0252348U (en) | 1988-10-03 | 1988-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252348U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4821569B1 (en) * | 1968-10-17 | 1973-06-29 | ||
| JPS5030478A (en) * | 1973-07-17 | 1975-03-26 | ||
| JPS5753968A (en) * | 1980-09-17 | 1982-03-31 | Nec Corp | Semiconductor device |
-
1988
- 1988-10-03 JP JP12968588U patent/JPH0252348U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4821569B1 (en) * | 1968-10-17 | 1973-06-29 | ||
| JPS5030478A (en) * | 1973-07-17 | 1975-03-26 | ||
| JPS5753968A (en) * | 1980-09-17 | 1982-03-31 | Nec Corp | Semiconductor device |