JPH01139442U - - Google Patents
Info
- Publication number
- JPH01139442U JPH01139442U JP3466888U JP3466888U JPH01139442U JP H01139442 U JPH01139442 U JP H01139442U JP 3466888 U JP3466888 U JP 3466888U JP 3466888 U JP3466888 U JP 3466888U JP H01139442 U JPH01139442 U JP H01139442U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- molded base
- markings
- inclination
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は従来例を示す斜視図である。
２……モールド基体、３……リード端子、Ｍ…
…標印、Ｓ２……モールド基体外面。
FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 2...Mold base, 3...Lead terminal, M...
...Marking, S2...Outer surface of mold base.
Claims (1)
方向に対して傾斜角をもつモールド基体外面に標
印を施したモールドパツケージ型電子部品。 A molded package type electronic component that has markings on the outer surface of the molded base at an angle of inclination to the direction in which the lead terminals are led out from the molded base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3466888U JPH01139442U (en) | 1988-03-16 | 1988-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3466888U JPH01139442U (en) | 1988-03-16 | 1988-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01139442U true JPH01139442U (en) | 1989-09-22 |
Family
ID=31261364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3466888U Pending JPH01139442U (en) | 1988-03-16 | 1988-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139442U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059710A (en) * | 2015-09-17 | 2017-03-23 | 日亜化学工業株式会社 | Light-emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4425774Y1 (en) * | 1966-01-06 | 1969-10-29 | ||
| JPS6187286A (en) * | 1984-10-05 | 1986-05-02 | Sony Corp | Tape cassette and cassette mechanism parts |
| JPH03289004A (en) * | 1990-04-04 | 1991-12-19 | Matsushita Electric Ind Co Ltd | Conductive resin composite |
| JPH0432400A (en) * | 1990-05-29 | 1992-02-04 | Onkyo Corp | Frame for speaker and its manufacture |
| JPH0468046A (en) * | 1990-07-09 | 1992-03-03 | Sumitomo Chem Co Ltd | Rubber-modified styrenic resin composition |
-
1988
- 1988-03-16 JP JP3466888U patent/JPH01139442U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4425774Y1 (en) * | 1966-01-06 | 1969-10-29 | ||
| JPS6187286A (en) * | 1984-10-05 | 1986-05-02 | Sony Corp | Tape cassette and cassette mechanism parts |
| JPH03289004A (en) * | 1990-04-04 | 1991-12-19 | Matsushita Electric Ind Co Ltd | Conductive resin composite |
| JPH0432400A (en) * | 1990-05-29 | 1992-02-04 | Onkyo Corp | Frame for speaker and its manufacture |
| JPH0468046A (en) * | 1990-07-09 | 1992-03-03 | Sumitomo Chem Co Ltd | Rubber-modified styrenic resin composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059710A (en) * | 2015-09-17 | 2017-03-23 | 日亜化学工業株式会社 | Light-emitting device |