JPH0195750U - - Google Patents
Info
- Publication number
- JPH0195750U JPH0195750U JP19182887U JP19182887U JPH0195750U JP H0195750 U JPH0195750 U JP H0195750U JP 19182887 U JP19182887 U JP 19182887U JP 19182887 U JP19182887 U JP 19182887U JP H0195750 U JPH0195750 U JP H0195750U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- molded
- power supply
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例の外観斜視図、第
２図は、本考案の他の実施例の透視斜視図である
。
１……封止樹脂、２……電源ピン、３……抵抗
性樹脂、４……封止樹脂。
FIG. 1 is an external perspective view of one embodiment of the present invention, and FIG. 2 is a perspective perspective view of another embodiment of the present invention. 1... Sealing resin, 2... Power pin, 3... Resistive resin, 4... Sealing resin.
Claims (1)
封止樹脂表面の電源ピン間に抵抗性樹脂を成形し
ていることを特徴とする樹脂封止集積回路。 1. A resin-sealed integrated circuit characterized in that a resistive resin is molded between power supply pins on the surface of a non-conductive sealing resin at the top or bottom of an integrated circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19182887U JPH0195750U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19182887U JPH0195750U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195750U true JPH0195750U (en) | 1989-06-26 |
Family
ID=31482720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19182887U Pending JPH0195750U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195750U (en) |
-
1987
- 1987-12-16 JP JP19182887U patent/JPH0195750U/ja active Pending