JPH0247061U - - Google Patents

Info

Publication number
JPH0247061U
JPH0247061U JP12586388U JP12586388U JPH0247061U JP H0247061 U JPH0247061 U JP H0247061U JP 12586388 U JP12586388 U JP 12586388U JP 12586388 U JP12586388 U JP 12586388U JP H0247061 U JPH0247061 U JP H0247061U
Authority
JP
Japan
Prior art keywords
lead terminal
resin portion
pellet
integrated circuit
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12586388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12586388U priority Critical patent/JPH0247061U/ja
Publication of JPH0247061U publication Critical patent/JPH0247061U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す断面図、第２
図は本考案の他の実施例を示す断面図、第３図は
従来の集積回路の断面図である。 １……樹脂部、２……ペレツト、３……ボンデ
イングワイヤー、４……外部リード端子、５……
ペレツト搭載部、６……外部リード端子、７……
樹脂部、８……ボンデイングワイヤー、９……ペ
レツト、１０……外部リード端子、１１……ペレ
ツト搭載部。 Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing another embodiment of the present invention, and FIG. 3 is a sectional view of a conventional integrated circuit. 1... Resin part, 2... Pellet, 3... Bonding wire, 4... External lead terminal, 5...
Pellet loading section, 6... External lead terminal, 7...
Resin part, 8... Bonding wire, 9... Pellet, 10... External lead terminal, 11... Pellet mounting part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リード端子部をモールド樹脂部底面に密着
させ、底面において樹脂部とリード端子が同一平
面上にあり、かつペレツトを逆封止していること
を特徴とする集積回路装置。 An integrated circuit device characterized in that an external lead terminal portion is brought into close contact with a bottom surface of a molded resin portion, the resin portion and the lead terminal are on the same plane at the bottom surface, and the pellet is reversely sealed.
JP12586388U 1988-09-26 1988-09-26 Pending JPH0247061U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12586388U JPH0247061U (en) 1988-09-26 1988-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12586388U JPH0247061U (en) 1988-09-26 1988-09-26

Publications (1)

Publication Number Publication Date
JPH0247061U true JPH0247061U (en) 1990-03-30

Family

ID=31376845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12586388U Pending JPH0247061U (en) 1988-09-26 1988-09-26

Country Status (1)

Country Link
JP (1) JPH0247061U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (en) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp Thin type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (en) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp Thin type semiconductor device

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