JPS59164251U - Lead frame for semiconductor devices - Google Patents

Lead frame for semiconductor devices

Info

Publication number
JPS59164251U
JPS59164251U JP5777883U JP5777883U JPS59164251U JP S59164251 U JPS59164251 U JP S59164251U JP 5777883 U JP5777883 U JP 5777883U JP 5777883 U JP5777883 U JP 5777883U JP S59164251 U JPS59164251 U JP S59164251U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor devices
semiconductor device
island
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5777883U
Other languages
Japanese (ja)
Inventor
久保　良夫
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP5777883U priority Critical patent/JPS59164251U/en
Publication of JPS59164251U publication Critical patent/JPS59164251U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のリードフレームを用いた半導体装置を示
す側断面図、第２図は従来のリードフレームのコイニン
グ溝における、樹脂の充填状態を示す拡大断面図、第３
図はこの考案に係るリードフレームを示す平面図、第４
図はリードフレームに設けられるコイニング溝の形状を
示す拡大断面図、第５図はこの考案に係るリードフレー
ムを用いた半導体装置を示す側断面図である。 １０・・・半導体装置用リードフレーム（リードフレー
ム）、１２・・・アイランド、２０・・・半導体素子、
３０・・・樹脂、２１．２２．２３．２４・・・界面、
５０・・・コイニング溝、５１・・・上部開口端、５２
・・・溝部、１００．２００・・・半導体装置。FIG. 1 is a side cross-sectional view showing a semiconductor device using a conventional lead frame, FIG. 2 is an enlarged cross-sectional view showing the state of resin filling in the coining groove of the conventional lead frame, and FIG.
The figure is a plan view showing the lead frame according to this invention.
The figure is an enlarged cross-sectional view showing the shape of a coining groove provided in a lead frame, and FIG. 5 is a side cross-sectional view showing a semiconductor device using the lead frame according to this invention. 10... Lead frame for semiconductor device (lead frame), 12... Island, 20... Semiconductor element,
30...Resin, 21.22.23.24...Interface,
50... Coining groove, 51... Upper opening end, 52
...Groove, 100.200...Semiconductor device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アイランドに半導体素子を載置してモールド樹脂により
成形される半導体装置用リードフレームにおいて、モー
ルド成形されたとき前記半導体装置用リードフレームが
モールド樹脂より露出する界面に沿い且つアイランドに
近い側に、上部開口端の開口幅が溝部の最大幅より小さ
くなる如く形成されたコイニング溝を設けたことを特徴
とする半導体装置用リードフレーム。In a lead frame for a semiconductor device in which a semiconductor element is placed on an island and molded with a molding resin, an upper portion is provided along the interface where the lead frame for the semiconductor device is exposed from the molding resin when molded and on the side closer to the island. 1. A lead frame for a semiconductor device, comprising a coining groove formed such that the width of the opening at the opening end is smaller than the maximum width of the groove.
JP5777883U 1983-04-18 1983-04-18 Lead frame for semiconductor devices Pending JPS59164251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5777883U JPS59164251U (en) 1983-04-18 1983-04-18 Lead frame for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5777883U JPS59164251U (en) 1983-04-18 1983-04-18 Lead frame for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS59164251U true JPS59164251U (en) 1984-11-02

Family

ID=30188075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5777883U Pending JPS59164251U (en) 1983-04-18 1983-04-18 Lead frame for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS59164251U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010567A (en) * 2008-06-30 2010-01-14 Sanyo Electric Co Ltd Semiconductor device and its nethod for manufacturing
JP2020136495A (en) * 2019-02-20 2020-08-31 中央電子工業株式会社 Hollow package structure, manufacturing method of the same, semiconductor device, and manufacturing method of the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918606U (en) * 1972-05-23 1974-02-16
JPS5558557A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Resin mold type electronic component and lead frame used therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918606U (en) * 1972-05-23 1974-02-16
JPS5558557A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Resin mold type electronic component and lead frame used therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010567A (en) * 2008-06-30 2010-01-14 Sanyo Electric Co Ltd Semiconductor device and its nethod for manufacturing
JP2020136495A (en) * 2019-02-20 2020-08-31 中央電子工業株式会社 Hollow package structure, manufacturing method of the same, semiconductor device, and manufacturing method of the same

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