JPS58140647U - lead frame - Google Patents

lead frame

Info

Publication number
JPS58140647U
JPS58140647U JP3827382U JP3827382U JPS58140647U JP S58140647 U JPS58140647 U JP S58140647U JP 3827382 U JP3827382 U JP 3827382U JP 3827382 U JP3827382 U JP 3827382U JP S58140647 U JPS58140647 U JP S58140647U
Authority
JP
Japan
Prior art keywords
lead frame
lead
leads
heat sink
tie bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3827382U
Other languages
Japanese (ja)
Inventor
田井中　治一郎
Original Assignee
ニチデン機械株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ニチデン機械株式会社 filed Critical ニチデン機械株式会社
Priority to JP3827382U priority Critical patent/JPS58140647U/en
Publication of JPS58140647U publication Critical patent/JPS58140647U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係るリードフレームの平面図であり、
第２図は該リードフレーム要部の拡大縦断面図である。 １・・・放熱板、２・・・タイバ一部、３・・・リード
、４・・・１１脂モ一ルド層、５・・・溝、１０・・・
リードフレーム、６・・・リード部。FIG. 1 is a plan view of a lead frame according to the present invention,
FIG. 2 is an enlarged vertical sectional view of the main part of the lead frame. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Part of tie bar, 3... Lead, 4... 11 fat mold layer, 5... Groove, 10...
Lead frame, 6... lead part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を固着して樹脂モールドされる放熱板部と、
複数のリードを有するリード部とからなるリードフレー
ムにおいて、リード間を連結するタイバ一部にリード方
向に沿った溝を形成したことを特徴とする前記リードフ
レーム。a heat sink portion to which a semiconductor element is fixed and molded with resin;
1. A lead frame comprising a lead portion having a plurality of leads, characterized in that a groove extending along the lead direction is formed in a part of a tie bar that connects the leads.
JP3827382U 1982-03-17 1982-03-17 lead frame Pending JPS58140647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3827382U JPS58140647U (en) 1982-03-17 1982-03-17 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3827382U JPS58140647U (en) 1982-03-17 1982-03-17 lead frame

Publications (1)

Publication Number Publication Date
JPS58140647U true JPS58140647U (en) 1983-09-21

Family

ID=30049626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3827382U Pending JPS58140647U (en) 1982-03-17 1982-03-17 lead frame

Country Status (1)

Country Link
JP (1) JPS58140647U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180842A (en) * 1984-09-28 1986-04-24 Hitachi Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (en) * 1975-03-03 1980-05-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517382B2 (en) * 1975-03-03 1980-05-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180842A (en) * 1984-09-28 1986-04-24 Hitachi Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
JPS58140647U (en) lead frame
JPS58440U (en) plastic packaging
JPS594644U (en) Resin mold semiconductor device
JPS59164251U (en) Lead frame for semiconductor devices
JPS5889931U (en) lead frame
JPS58144855U (en) semiconductor equipment
JPS587353U (en) semiconductor equipment
JPS6115744U (en) semiconductor equipment
JPS5933254U (en) semiconductor equipment
JPS58138350U (en) lead frame
JPS5954953U (en) lead frame
JPS6134738U (en) Resin molded semiconductor device
JPS6113939U (en) Resin-insulated semiconductor device
JPS60125730U (en) Resin sealing mold for semiconductor devices
JPS5834742U (en) Heat dissipation structure for resin-encapsulated semiconductor devices
JPS59135644U (en) Resin-encapsulated semiconductor device
JPS5920635U (en) Resin molded semiconductor device
JPS588947U (en) Lead frame for semiconductor devices
JPS6016553U (en) Resin-encapsulated semiconductor device
JPS5878654U (en) Mold type semiconductor device
JPS59107157U (en) GaAs semiconductor device
JPS59119040U (en) Resin-encapsulated semiconductor device
JPS6130255U (en) lead frame
JPS59192845U (en) semiconductor equipment
JPS6117750U (en) Frame for semiconductor devices