JPS5889931U - lead frame - Google Patents
lead frameInfo
- Publication number
- JPS5889931U JPS5889931U JP18552981U JP18552981U JPS5889931U JP S5889931 U JPS5889931 U JP S5889931U JP 18552981 U JP18552981 U JP 18552981U JP 18552981 U JP18552981 U JP 18552981U JP S5889931 U JPS5889931 U JP S5889931U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- tie bar
- island part
- abstract
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本案の一実施例を示す要部平面図、第2図は半
導体装置の横断面図である。
図中、2はアイランド部、3. 5. 6はタイバー、
41〜45はリード片、9は樹脂材である。FIG. 1 is a plan view of essential parts showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the semiconductor device. In the figure, 2 is an island part, 3. 5. 6 is the tie bar,
41 to 45 are lead pieces, and 9 is a resin material.
Claims (1)
かつそれぞれがタイバーにて連結された複数のリード片
とを具えたものにおいて、上記−リード片の樹脂材にて
モールド被覆される部分をタイバーにて連結したことを
特徴とするリードフレーム。an island part, and one end is located near the island part,
A lead frame comprising a plurality of lead pieces each connected by a tie bar, wherein the portions of the lead pieces to be molded and coated with a resin material are connected by a tie bar.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18552981U JPS5889931U (en) | 1981-12-11 | 1981-12-11 | lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18552981U JPS5889931U (en) | 1981-12-11 | 1981-12-11 | lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5889931U true JPS5889931U (en) | 1983-06-17 |
Family
ID=29986661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18552981U Pending JPS5889931U (en) | 1981-12-11 | 1981-12-11 | lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5889931U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114458A (en) * | 1990-09-04 | 1992-04-15 | Mitsui High Tec Inc | Lead frame and manufacture of semiconductor device provided therewith |
JP2008016716A (en) * | 2006-07-07 | 2008-01-24 | New Japan Radio Co Ltd | Lead frame and method for manufacturing semiconductor device using same |
-
1981
- 1981-12-11 JP JP18552981U patent/JPS5889931U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114458A (en) * | 1990-09-04 | 1992-04-15 | Mitsui High Tec Inc | Lead frame and manufacture of semiconductor device provided therewith |
JP2008016716A (en) * | 2006-07-07 | 2008-01-24 | New Japan Radio Co Ltd | Lead frame and method for manufacturing semiconductor device using same |
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