JPS5889931U - lead frame - Google Patents

lead frame

Info

Publication number
JPS5889931U
JPS5889931U JP18552981U JP18552981U JPS5889931U JP S5889931 U JPS5889931 U JP S5889931U JP 18552981 U JP18552981 U JP 18552981U JP 18552981 U JP18552981 U JP 18552981U JP S5889931 U JPS5889931 U JP S5889931U
Authority
JP
Japan
Prior art keywords
lead frame
tie bar
island part
abstract
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18552981U
Other languages
Japanese (ja)
Inventor
将 西村
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP18552981U priority Critical patent/JPS5889931U/en
Publication of JPS5889931U publication Critical patent/JPS5889931U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本案の一実施例を示す要部平面図、第２図は半
導体装置の横断面図である。 図中、２はアイランド部、３．　５．　６はタイバー、
４１〜４５はリード片、９は樹脂材である。FIG. 1 is a plan view of essential parts showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the semiconductor device. In the figure, 2 is an island part, 3. 5. 6 is the tie bar,
41 to 45 are lead pieces, and 9 is a resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アイランド部と、一端がアイランド部の近傍に位置し、
かつそれぞれがタイバーにて連結された複数のリード片
とを具えたものにおいて、上記−リード片の樹脂材にて
モールド被覆される部分をタイバーにて連結したことを
特徴とするリードフレーム。an island part, and one end is located near the island part,
A lead frame comprising a plurality of lead pieces each connected by a tie bar, wherein the portions of the lead pieces to be molded and coated with a resin material are connected by a tie bar.
JP18552981U 1981-12-11 1981-12-11 lead frame Pending JPS5889931U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18552981U JPS5889931U (en) 1981-12-11 1981-12-11 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18552981U JPS5889931U (en) 1981-12-11 1981-12-11 lead frame

Publications (1)

Publication Number Publication Date
JPS5889931U true JPS5889931U (en) 1983-06-17

Family

ID=29986661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18552981U Pending JPS5889931U (en) 1981-12-11 1981-12-11 lead frame

Country Status (1)

Country Link
JP (1) JPS5889931U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04114458A (en) * 1990-09-04 1992-04-15 Mitsui High Tec Inc Lead frame and manufacture of semiconductor device provided therewith
JP2008016716A (en) * 2006-07-07 2008-01-24 New Japan Radio Co Ltd Lead frame and method for manufacturing semiconductor device using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04114458A (en) * 1990-09-04 1992-04-15 Mitsui High Tec Inc Lead frame and manufacture of semiconductor device provided therewith
JP2008016716A (en) * 2006-07-07 2008-01-24 New Japan Radio Co Ltd Lead frame and method for manufacturing semiconductor device using same

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