JPS63155651U - - Google Patents

Info

Publication number
JPS63155651U
JPS63155651U JP4961787U JP4961787U JPS63155651U JP S63155651 U JPS63155651 U JP S63155651U JP 4961787 U JP4961787 U JP 4961787U JP 4961787 U JP4961787 U JP 4961787U JP S63155651 U JPS63155651 U JP S63155651U
Authority
JP
Japan
Prior art keywords
semiconductor device
bent
resin
angle
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4961787U
Other languages
Japanese (ja)
Other versions
JPH0642348Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049617U priority Critical patent/JPH0642348Y2/en
Publication of JPS63155651U publication Critical patent/JPS63155651U/ja
Application granted granted Critical
Publication of JPH0642348Y2 publication Critical patent/JPH0642348Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は実施例の正面図、第２図及び第３図は
他の実施例の正面図、第４図は従来例の正面図で
ある。 １は半導体装置、２はリード、３は樹脂封止部
、４は平面、５は上型、６は下型、７は先端部で
ある。 FIG. 1 is a front view of an embodiment, FIGS. 2 and 3 are front views of other embodiments, and FIG. 4 is a front view of a conventional example. 1 is a semiconductor device, 2 is a lead, 3 is a resin sealing part, 4 is a plane, 5 is an upper mold, 6 is a lower mold, and 7 is a tip.

Claims (1)

【実用新案登録請求の範囲】 樹脂封止され、樹脂封止部表面近傍でリードが
屈曲された半導体装置において、 該リードを、上記半導体装置を載置する平面に
対して２０°〜３０°の角度で屈曲させたことを
特徴とする半導体装置。[Claims for Utility Model Registration] In a semiconductor device that is resin-sealed and has leads bent near the surface of the resin-sealed part, the leads are bent at an angle of 20° to 30° with respect to the plane on which the semiconductor device is placed. A semiconductor device characterized by being bent at an angle.
JP1987049617U 1987-03-31 1987-03-31 Semiconductor device Expired - Lifetime JPH0642348Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049617U JPH0642348Y2 (en) 1987-03-31 1987-03-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049617U JPH0642348Y2 (en) 1987-03-31 1987-03-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS63155651U true JPS63155651U (en) 1988-10-12
JPH0642348Y2 JPH0642348Y2 (en) 1994-11-02

Family

ID=30872235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049617U Expired - Lifetime JPH0642348Y2 (en) 1987-03-31 1987-03-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0642348Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016039213A (en) * 2014-08-06 2016-03-22 ローム株式会社 Substrate built-in package, semiconductor device, and module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188928A (en) * 1983-04-11 1984-10-26 Toshiba Corp Process of sheathing for semiconductor device
JPS606241U (en) * 1983-06-27 1985-01-17 日本電気株式会社 Hybrid integrated circuit device
JPS60137443U (en) * 1984-02-23 1985-09-11 日本電気株式会社 flat package
JPS60200553A (en) * 1984-03-26 1985-10-11 Nec Corp Manufacture of semiconductor device
JPS61157337A (en) * 1984-12-29 1986-07-17 New Japan Chem Co Ltd Preparation of anionic surfactant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188928A (en) * 1983-04-11 1984-10-26 Toshiba Corp Process of sheathing for semiconductor device
JPS606241U (en) * 1983-06-27 1985-01-17 日本電気株式会社 Hybrid integrated circuit device
JPS60137443U (en) * 1984-02-23 1985-09-11 日本電気株式会社 flat package
JPS60200553A (en) * 1984-03-26 1985-10-11 Nec Corp Manufacture of semiconductor device
JPS61157337A (en) * 1984-12-29 1986-07-17 New Japan Chem Co Ltd Preparation of anionic surfactant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016039213A (en) * 2014-08-06 2016-03-22 ローム株式会社 Substrate built-in package, semiconductor device, and module

Also Published As

Publication number Publication date
JPH0642348Y2 (en) 1994-11-02

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