JPH0236053U - - Google Patents
Info
- Publication number
- JPH0236053U JPH0236053U JP1988116058U JP11605888U JPH0236053U JP H0236053 U JPH0236053 U JP H0236053U JP 1988116058 U JP1988116058 U JP 1988116058U JP 11605888 U JP11605888 U JP 11605888U JP H0236053 U JPH0236053 U JP H0236053U
- Authority
- JP
- Japan
- Prior art keywords
- width
- inner lead
- ceramic package
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例の上面図、第2図は
従来のリードフレームを有するセラミツクパツケ
ージの上面図である。
1……ワイヤーボンデイングのズレを考慮した
幅のインナーリード、2……外部リードと導通を
とるためのインナーリード、3……ペレツト、4
……ワイヤー、21……インナーリード、23…
…ペレツト、24……ワイヤー。
FIG. 1 is a top view of an embodiment of the present invention, and FIG. 2 is a top view of a conventional ceramic package having a lead frame. 1... Inner lead with a width that takes into account misalignment of wire bonding, 2... Inner lead for establishing conduction with external leads, 3... Pellet, 4
...Wire, 21...Inner lead, 23...
...Pellet, 24...Wire.
Claims (1)
ラミツクパツケージ用リードフレームにおいて、
インナーリードの幅が先端部のみワイヤーボンデ
イングの位置ズレを考慮した幅を有しており、イ
ンナーリードのその他の部分の幅は導通するに必
要な最小限の幅としたことを特徴とするセラミツ
クパツケージ用リードフレーム。 In a ceramic package lead frame with gold plating on the inner lead surface,
A ceramic package characterized in that the width of the inner lead is such that only the tip part has a width that takes into consideration misalignment of wire bonding, and the width of the other parts of the inner lead is the minimum width necessary for conduction. lead frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988116058U JPH0236053U (en) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988116058U JPH0236053U (en) | 1988-09-02 | 1988-09-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0236053U true JPH0236053U (en) | 1990-03-08 |
Family
ID=31358268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988116058U Pending JPH0236053U (en) | 1988-09-02 | 1988-09-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0236053U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107946201A (en) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | A kind of preparation method of the wire bonding pad structure based on local electro-deposition |
CN108054108A (en) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | A kind of wire bonding method based on quick local electro-deposition |
-
1988
- 1988-09-02 JP JP1988116058U patent/JPH0236053U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107946201A (en) * | 2017-12-19 | 2018-04-20 | 哈尔滨工业大学 | A kind of preparation method of the wire bonding pad structure based on local electro-deposition |
CN108054108A (en) * | 2017-12-19 | 2018-05-18 | 哈尔滨工业大学 | A kind of wire bonding method based on quick local electro-deposition |