JPS6294648U - - Google Patents
Info
- Publication number
- JPS6294648U JPS6294648U JP18754385U JP18754385U JPS6294648U JP S6294648 U JPS6294648 U JP S6294648U JP 18754385 U JP18754385 U JP 18754385U JP 18754385 U JP18754385 U JP 18754385U JP S6294648 U JPS6294648 U JP S6294648U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- bump
- tip
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図面は本考案の実施例を示し、第１図は平面図
、第２図はリードの端部の断面説明図である。
１……リードフレーム、２……リード、３……
バンプ、４……ＩＣ。
The drawings show an embodiment of the present invention, with FIG. 1 being a plan view and FIG. 2 being a cross-sectional explanatory view of the end of the lead. 1...Lead frame, 2...Lead, 3...
Bump, 4...IC.
Claims (1)
のバンプを形成したことを特徴とするＩＣ用リー
ドフレーム。 A lead frame for an IC, characterized in that a bump for mounting an IC is formed at the tip of a lead of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18754385U JPS6294648U (en) | 1985-12-05 | 1985-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18754385U JPS6294648U (en) | 1985-12-05 | 1985-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6294648U true JPS6294648U (en) | 1987-06-17 |
Family
ID=31138099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18754385U Pending JPS6294648U (en) | 1985-12-05 | 1985-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6294648U (en) |
-
1985
- 1985-12-05 JP JP18754385U patent/JPS6294648U/ja active Pending
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