JPS6370154U - - Google Patents
Info
- Publication number
- JPS6370154U JPS6370154U JP16544286U JP16544286U JPS6370154U JP S6370154 U JPS6370154 U JP S6370154U JP 16544286 U JP16544286 U JP 16544286U JP 16544286 U JP16544286 U JP 16544286U JP S6370154 U JPS6370154 U JP S6370154U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- sealed
- lead tip
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案に係る半導体装置の縦断面図
、第２図は、従来の半導体装置の縦断面図である
。
１１……素子取付部、１２……リード、１３…
…素子、１４……金属細線、１５……電極、１６
……樹脂。
FIG. 1 is a vertical cross-sectional view of a semiconductor device according to the present invention, and FIG. 2 is a vertical cross-sectional view of a conventional semiconductor device. 11...Element mounting part, 12...Lead, 13...
...Element, 14...Metal thin wire, 15...Electrode, 16
……resin.
Claims (1)
先端と、リード先端と素子の電極とを接続した金
属細線とを、樹脂で囲繞封止した半導体装置にお
いて、素子取付面とは反対側の樹脂外表面を、内
方に湾曲させたことを特徴とする半導体装置。 In a semiconductor device in which an element, an element mounting part to which the element is attached, a lead tip, and a thin metal wire connecting the lead tip and the electrode of the element are sealed with resin, the resin on the side opposite to the element mounting surface is sealed. A semiconductor device characterized by having an outer surface curved inward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16544286U JPS6370154U (en) | 1986-10-27 | 1986-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16544286U JPS6370154U (en) | 1986-10-27 | 1986-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370154U true JPS6370154U (en) | 1988-05-11 |
Family
ID=31095486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16544286U Pending JPS6370154U (en) | 1986-10-27 | 1986-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370154U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516446A (en) * | 1978-07-24 | 1980-02-05 | Hitachi Ltd | Resin mold type semiconductor device |
-
1986
- 1986-10-27 JP JP16544286U patent/JPS6370154U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516446A (en) * | 1978-07-24 | 1980-02-05 | Hitachi Ltd | Resin mold type semiconductor device |