JPS6315099U - - Google Patents
Info
- Publication number
- JPS6315099U JPS6315099U JP10900086U JP10900086U JPS6315099U JP S6315099 U JPS6315099 U JP S6315099U JP 10900086 U JP10900086 U JP 10900086U JP 10900086 U JP10900086 U JP 10900086U JP S6315099 U JPS6315099 U JP S6315099U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lower conductor
- semiconductor element
- nonmetallic
- nonmetallic cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図ａは本考案の一実施例に係る半導体装置
の平面図、同図ｂはその断面図、第２図ａは本考
案の他の実施例の平面図、同図ｂはその断面図、
第３図ａは従来の半導体装置の平面図、同図ｂは
その断面図である。
１…非金属キヤツプ、２…下部導体、３…網状
埋込み金属、４…搭載部品。
Fig. 1a is a plan view of a semiconductor device according to an embodiment of the present invention, Fig. 2b is a sectional view thereof, Fig. 2a is a plan view of another embodiment of the invention, and Fig. 2b is a sectional view thereof. ,
FIG. 3a is a plan view of a conventional semiconductor device, and FIG. 3b is a sectional view thereof. 1...Nonmetal cap, 2...Lower conductor, 3...Mesh embedded metal, 4...Mounted parts.
Claims (1)
載する下部導体と、この下部導体の上部に封着さ
れる非金属キヤツプで構成される半導体装置にお
いて、前記上部非金属キヤツプの内部に又は表面
に網状の金属を有することを特徴とする半導体装
置。 In a semiconductor device comprising a lower conductor on which a semiconductor element or a circuit component including a semiconductor element is mounted, and a nonmetallic cap sealed to the upper part of the lower conductor, a net-like structure is provided inside or on the surface of the upper nonmetallic cap. A semiconductor device characterized by containing metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10900086U JPS6315099U (en) | 1986-07-15 | 1986-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10900086U JPS6315099U (en) | 1986-07-15 | 1986-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315099U true JPS6315099U (en) | 1988-02-01 |
Family
ID=30986706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10900086U Pending JPS6315099U (en) | 1986-07-15 | 1986-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315099U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685096A (en) * | 1992-07-07 | 1994-03-25 | Internatl Business Mach Corp <Ibm> | Light-weight packaging |
-
1986
- 1986-07-15 JP JP10900086U patent/JPS6315099U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685096A (en) * | 1992-07-07 | 1994-03-25 | Internatl Business Mach Corp <Ibm> | Light-weight packaging |