JPS6186945U - - Google Patents

Info

Publication number
JPS6186945U
JPS6186945U JP17142484U JP17142484U JPS6186945U JP S6186945 U JPS6186945 U JP S6186945U JP 17142484 U JP17142484 U JP 17142484U JP 17142484 U JP17142484 U JP 17142484U JP S6186945 U JPS6186945 U JP S6186945U
Authority
JP
Japan
Prior art keywords
integrated circuit
resin frame
resin
circuit device
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17142484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17142484U priority Critical patent/JPS6186945U/ja
Publication of JPS6186945U publication Critical patent/JPS6186945U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の要部断面図、第2
図は従来の樹脂封止集積回路装置の断面図である
。 1……回路基板、2……集積回路素子、3……
ボンデイングワイヤ、4……樹脂枠、4a……テ
ーパ部、5……封止樹脂、4……従来の樹脂枠。
Figure 1 is a sectional view of the main parts of one embodiment of the present invention, Figure 2
The figure is a sectional view of a conventional resin-sealed integrated circuit device. 1... Circuit board, 2... Integrated circuit element, 3...
Bonding wire, 4... Resin frame, 4a... Tapered portion, 5... Sealing resin, 4... Conventional resin frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板に集積回路素子を搭載し、前記集積回
路素子の周りを樹脂枠で囲み、この樹脂枠内に樹
脂を充填してなる集積回路装置において、前記樹
脂枠の内面は下方に拡がつたテーパ付けがなされ
ていることを特徴とする集積回路装置。
In an integrated circuit device in which an integrated circuit element is mounted on a circuit board, the integrated circuit element is surrounded by a resin frame, and the resin frame is filled with resin, the inner surface of the resin frame is tapered downwardly. An integrated circuit device characterized by:
JP17142484U 1984-11-12 1984-11-12 Pending JPS6186945U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17142484U JPS6186945U (en) 1984-11-12 1984-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17142484U JPS6186945U (en) 1984-11-12 1984-11-12

Publications (1)

Publication Number Publication Date
JPS6186945U true JPS6186945U (en) 1986-06-07

Family

ID=30729108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17142484U Pending JPS6186945U (en) 1984-11-12 1984-11-12

Country Status (1)

Country Link
JP (1) JPS6186945U (en)

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