JPH0369248U - - Google Patents

Info

Publication number
JPH0369248U
JPH0369248U JP1989131231U JP13123189U JPH0369248U JP H0369248 U JPH0369248 U JP H0369248U JP 1989131231 U JP1989131231 U JP 1989131231U JP 13123189 U JP13123189 U JP 13123189U JP H0369248 U JPH0369248 U JP H0369248U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989131231U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989131231U priority Critical patent/JPH0369248U/ja
Publication of JPH0369248U publication Critical patent/JPH0369248U/ja
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1989131231U 1989-11-10 1989-11-10 Pending JPH0369248U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989131231U JPH0369248U (en) 1989-11-10 1989-11-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989131231U JPH0369248U (en) 1989-11-10 1989-11-10

Publications (1)

Publication Number Publication Date
JPH0369248U true JPH0369248U (en) 1991-07-09

Family

ID=31678753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989131231U Pending JPH0369248U (en) 1989-11-10 1989-11-10

Country Status (1)

Country Link
JP (1) JPH0369248U (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110945A (en) * 1999-09-07 2001-04-20 Motorola Inc Semiconductor element, manufacturing method thereof, and packaging method
JP2002118221A (en) * 2000-10-06 2002-04-19 Rohm Co Ltd Semiconductor device and lead frame used for the semiconductor device
JP2004247612A (en) * 2003-02-14 2004-09-02 Kanto Sanyo Semiconductors Co Ltd Semiconductor device and its manufacturing process
JP2007243220A (en) * 2007-05-14 2007-09-20 Renesas Technology Corp Resin encapsulated semiconductor package
JP2010118712A (en) * 2010-03-04 2010-05-27 Renesas Technology Corp Method of manufacturing qfn package
JP2011222598A (en) * 2010-04-05 2011-11-04 Shindengen Electric Mfg Co Ltd Method for manufacturing magnetic body substrate, magnetic body substrate, and electronic circuit module
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
JP2014179648A (en) * 2000-12-28 2014-09-25 Renesas Electronics Corp Semiconductor device
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
JP2015070161A (en) * 2013-09-30 2015-04-13 ローム株式会社 Lead frame, semiconductor device, and method of manufacturing semiconductor device
JP2015103817A (en) * 2013-11-26 2015-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド. Electronic component and electronic component mounting circuit board
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9496204B2 (en) 2000-12-28 2016-11-15 Renesas Electronics Corporation Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381965A (en) * 1986-09-26 1988-04-12 Hitachi Ltd Electronic device
JPH01106456A (en) * 1987-10-19 1989-04-24 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381965A (en) * 1986-09-26 1988-04-12 Hitachi Ltd Electronic device
JPH01106456A (en) * 1987-10-19 1989-04-24 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit device

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110945A (en) * 1999-09-07 2001-04-20 Motorola Inc Semiconductor element, manufacturing method thereof, and packaging method
US8637976B2 (en) 2000-10-06 2014-01-28 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9812382B2 (en) 2000-10-06 2017-11-07 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9472492B2 (en) 2000-10-06 2016-10-18 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9064855B2 (en) 2000-10-06 2015-06-23 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
JP4523138B2 (en) * 2000-10-06 2010-08-11 ローム株式会社 The semiconductor device and the lead frame for use therein
JP2002118221A (en) * 2000-10-06 2002-04-19 Rohm Co Ltd Semiconductor device and lead frame used for the semiconductor device
US8026591B2 (en) 2000-10-06 2011-09-27 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US8421209B2 (en) 2000-10-06 2013-04-16 Rohm Co., Ltd. Semiconductor device with lead terminals having portions thereof extending obliquely
US9496204B2 (en) 2000-12-28 2016-11-15 Renesas Electronics Corporation Semiconductor device
JP2014179648A (en) * 2000-12-28 2014-09-25 Renesas Electronics Corp Semiconductor device
US10115658B2 (en) 2000-12-28 2018-10-30 Renesas Electronics Corporation Semiconductor device
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
JP2004247612A (en) * 2003-02-14 2004-09-02 Kanto Sanyo Semiconductors Co Ltd Semiconductor device and its manufacturing process
JP4522049B2 (en) * 2003-02-14 2010-08-11 三洋電機株式会社 Semiconductor device
JP2007243220A (en) * 2007-05-14 2007-09-20 Renesas Technology Corp Resin encapsulated semiconductor package
JP4489791B2 (en) * 2007-05-14 2010-06-23 株式会社ルネサステクノロジ Qfn package
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
JP2010118712A (en) * 2010-03-04 2010-05-27 Renesas Technology Corp Method of manufacturing qfn package
JP2011222598A (en) * 2010-04-05 2011-11-04 Shindengen Electric Mfg Co Ltd Method for manufacturing magnetic body substrate, magnetic body substrate, and electronic circuit module
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
JP2015070161A (en) * 2013-09-30 2015-04-13 ローム株式会社 Lead frame, semiconductor device, and method of manufacturing semiconductor device
JP2015103817A (en) * 2013-11-26 2015-06-04 サムソン エレクトロ−メカニックス カンパニーリミテッド. Electronic component and electronic component mounting circuit board
US10062493B2 (en) 2013-11-26 2018-08-28 Samsung Electro-Mechanics Co., Ltd. Electronic component and circuit board having the same mounted thereon

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